Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1985
04/03/1985EP0136237A1 Integrated circuit package holder
04/03/1985EP0135851A2 Process and device for marking parts, especially electronic components
04/03/1985EP0135589A1 Method for bonding electrical conductors to an insulating substrate
04/02/1985US4509096 Chip-carrier substrates
04/02/1985US4508758 Two step-forming walls around edges, then flow coating
04/02/1985US4508163 For an electronics package
04/02/1985US4508161 Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer
04/02/1985US4507907 Expendable heater sealing process
04/02/1985US4507852 Method for making a reliable ohmic contact between two layers of integrated circuit metallizations
04/02/1985CA1184757A1 Conductive paste
03/1985
03/28/1985WO1985001390A1 Wafer
03/27/1985EP0135416A1 Integrated circuit having a pre-attached conductive mounting media and method of making the same
03/27/1985EP0135310A2 Moulding compositions for the encapsulation of electronic components
03/27/1985EP0135230A1 Semiconductor device, in particular a transistor including a protection means against overvoltage
03/27/1985EP0135174A2 Thick film conductor composition
03/27/1985EP0135120A1 Ceramic-metallic element
03/27/1985EP0135089A2 Apparatus for producing a plurality of voltage levels on a multi-layer dielectric substrate
03/27/1985EP0135019A2 Interconnection of elements on integrated cirrcuit substrate
03/26/1985US4507710 Electronic components and system carrier assembly
03/26/1985US4507675 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
03/26/1985US4507171 Method for contacting a narrow width PN junction region
03/26/1985US4506436 Method for increasing the radiation resistance of charge storage semiconductor devices
03/26/1985CA1184671A1 Method of manufacture of plastics containers with incorporated heat sinks for integrated circuits and die and heat sink combination for use with this method
03/20/1985EP0134692A2 Multilayer semiconductor devices with embedded conductor structure
03/20/1985EP0134678A2 Polymers with graft alpha-alkylarylate functionality
03/20/1985EP0134623A2 Electrically and thermally conductive adhesive transfer tape
03/20/1985EP0134621A1 Apparatus for the automatic, precise transport of objects, e.g. semiconductor wafers
03/20/1985EP0134571A1 Integrated semiconductor circuit having an aluminium or aluminium alloy multilayer wiring, and method for its manufacture
03/20/1985EP0134469A1 Method of marking semiconductor surfaces using laser radiation
03/19/1985US4506320 Power rectifier arrangement
03/19/1985US4506285 Substrate made of varistor material having a plurality of electronic components mounted thereon
03/19/1985US4506238 Hybrid circuit device
03/19/1985US4506139 Circuit chip
03/19/1985US4505799 Ph sensitive
03/19/1985US4505225 Self-aligning apparatus for semiconductor lead frame processing means
03/19/1985US4505030 Process for positioning an interconnection line on an electrical contact hole of an integrated circuit
03/19/1985US4505029 Semiconductor device with built-up low resistance contact
03/19/1985US4505027 Very large scale integration
03/19/1985CA1184317A1 Ultra high-frequency circuit
03/13/1985EP0133955A1 Test structure for identifying semiconductor chips, and process for their identification
03/13/1985EP0025057B1 Thermo-compression bonding a semiconductor to strain buffer
03/12/1985US4504850 Disc-type semiconductor mounting arrangement with force distribution spacer
03/12/1985US4504849 Semiconductor devices and a solder for use in such devices
03/12/1985US4504629 Polymers with graft α-alkylacrylate functionality
03/12/1985US4504551 Poly(arylene sulfide) compositions
03/12/1985US4504521 LPCVD Deposition of tantalum silicide
03/12/1985US4504435 Method for semiconductor device packaging
03/12/1985US4504339 Method for producing multilayered glass-ceramic structure with copper-based conductors therein
03/12/1985US4504322 Re-work method for removing extraneous metal from cermic substrates
03/12/1985US4504156 Cooling system monitor assembly and method
03/12/1985US4504120 Ceramic substrate support for electronic components and integrated electronic circuits
03/12/1985US4503609 Low-insertion force method of assembling a lead and a substrate
03/12/1985US4503598 Method of fabricating power MOSFET structure utilizing self-aligned diffusion and etching techniques
03/12/1985US4503597 Method of forming a number of solder layers on a semiconductor wafer
03/12/1985CA1183968A1 Binary germanium-silicon interconnect and electrode structure for integrated circuits
03/12/1985CA1183954A1 Dense dynamic memory cell structure and process
03/08/1985EP0097157A4 Cooling means for integrated circuit chip device.
03/05/1985US4503452 Plastic encapsulated semiconductor device and method for manufacturing the same
03/05/1985US4503451 Low resistance buried power bus for integrated circuits
03/05/1985US4503315 Semiconductor device with fuse
03/05/1985US4503131 Electrical contact materials
03/05/1985US4503089 Smoothing rough stainless steel with phosphate or silicate coating
03/05/1985US4502938 Encapsulated chemoresponsive microelectronic device arrays
03/05/1985US4502750 Electrical connecting strap for semiconductor components
03/05/1985US4502286 Constant pressure type boiling cooling system
03/05/1985US4502209 Heating deposited film of metal carbide, nitride or boride
03/05/1985US4502208 Method of making high density VMOS electrically-programmable ROM
03/05/1985US4502207 Wiring material for semiconductor device and method for forming wiring pattern therewith
03/05/1985CA1183611A1 Apparatus for cooling integrated circuit chips
02/1985
02/27/1985EP0133600A2 Epoxy resin and composition
02/27/1985EP0133533A2 Low thermal expansion resin material for a wiring insulating film.
02/26/1985US4502100 Cooling system with counter flow of coolant
02/26/1985US4501768 Thin film floating zone metal coating technique
02/26/1985CA1183280A1 Integrated circuit chip carrier
02/26/1985CA1183279A1 Circuit arrangement comprising an integrated semiconductor circuit
02/19/1985US4500945 Compression sealing system
02/19/1985US4500907 Pressure-applied type semiconductor device
02/19/1985US4500906 Multilevel masterslice LSI with second metal level programming
02/19/1985US4500905 Stacked semiconductor device with sloping sides
02/19/1985US4500904 Semiconductor device
02/19/1985US4500605 Forming oxide surface layer on aluminum-copper-iron-nickel alloy
02/19/1985US4500389 Process for the manufacture of substrates to interconnect electronic components
02/19/1985US4500149 Solder-bearing lead
02/19/1985US4499659 Semiconductor structures and manufacturing methods
02/19/1985US4499656 Deep mesa process for fabricating monolithic integrated Schottky barrier diode for millimeter wave mixers
02/19/1985US4499655 Method for making alignment-enhancing feed-through conductors for stackable silicon-on-sapphire
02/13/1985EP0133125A1 Electronic component housing with a capacitor
02/13/1985EP0133101A1 Interconnection device for the cells of a pre-implanted hyperfrequency integrated circuit
02/13/1985EP0133023A2 Read-only memory
02/13/1985EP0133010A2 Multilayered ceramic circuit board
02/13/1985EP0132849A2 Clad metal lead frame substrates
02/13/1985EP0132740A2 Method of forming a dielectric substrate
02/13/1985EP0132720A1 Integrated semiconductor circuit having an external aluminium or aluminium alloy contact interconnection layer
02/13/1985EP0132664A2 Compliant pin for solderless termination to a printed wiring board
02/13/1985EP0132614A1 A method for manufacturing an integrated circuit device
02/13/1985EP0132596A2 Solderable nickel-iron alloy article and method for making same
02/13/1985EP0132520A2 A method of producing a semiconductor device
02/12/1985US4499518 Process for the production of an electronic component enclosed in a housing and apparatus for carrying out the process
02/12/1985US4499485 Semiconductor unit
02/12/1985US4499484 Integrated circuit manufactured by master slice method
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