Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
---|
02/12/1985 | US4499371 Electrical connection system |
02/12/1985 | US4499333 Electronic component cap and seal |
02/12/1985 | US4499147 With eutectic oxide coating |
02/12/1985 | US4498721 Electrical connector for an electronic package |
02/12/1985 | US4498530 Flexible thermal conduction element for cooling semiconductor devices |
02/12/1985 | US4498232 Automatic insertion and removal device for components |
02/12/1985 | US4498226 Method for manufacturing three-dimensional semiconductor device by sequential beam epitaxy |
02/12/1985 | CA1182591A1 Fabrication of semiconductor modules with ceramic substrates and detection of residual glass |
02/12/1985 | CA1182582A1 Semiconductor chip package |
02/12/1985 | CA1182539A1 Dual-in-line package assembly |
02/05/1985 | US4498122 High-speed, high pin-out LSI chip package |
02/05/1985 | US4498121 Copper alloys for suppressing growth of Cu-Al intermetallic compounds |
02/05/1985 | US4498096 Axial lead semiconductor device |
02/05/1985 | US4498047 Integrated circuit mounting apparatus |
02/05/1985 | US4497922 Compositions of materials for forming protective film in semiconductor device |
02/05/1985 | US4497875 Ceramic substrate with metal plate |
02/05/1985 | US4497665 Method for manufacturing semiconductor device |
02/05/1985 | US4497106 Semiconductor device and a method of manufacturing the same |
02/05/1985 | CA1182219A1 Means and method for disabling access to a memory |
01/31/1985 | WO1985000468A1 A semiconductor die having undedicated input/output cells |
01/31/1985 | WO1985000467A1 Electronic circuit chip connection assembly and method |
01/30/1985 | EP0132326A2 Passivation and insulation of III-V devices |
01/29/1985 | US4496965 For an integrated circuit device |
01/29/1985 | US4496634 Diffraction grating wire arrays in parallel |
01/29/1985 | CA1181871A1 Stacked mos devices with polysilicon interconnects |
01/29/1985 | CA1181868A1 Integrated circuit carrier assembly |
01/23/1985 | EP0131807A2 Method of reducing alpha particle emissions from a ceramic material |
01/22/1985 | US4495546 Hybrid integrated circuit component and printed circuit board mounting said component |
01/22/1985 | US4495515 Electrically isolating two piece mounting washer arrangement |
01/22/1985 | US4495377 Substrate wiring patterns for connecting to integrated-circuit chips |
01/22/1985 | US4495376 Carrier for integrated circuit |
01/22/1985 | US4495222 Metallization means and method for high temperature applications |
01/22/1985 | US4495221 Aluminum, copper, silicon, to reduce tunnelling and thinning |
01/22/1985 | US4495026 Preferential etching of aluminum-silver-aluminum layers on a thyristor substrate |
01/22/1985 | US4494688 Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore |
01/22/1985 | CA1181534A1 Method of providing raised contact portions on contact areas of an electronic microcircuit |
01/22/1985 | CA1181265A1 Composite material |
01/16/1985 | EP0131242A2 Multi-layer ceramic substrate and method for the production thereof |
01/16/1985 | EP0131004A1 Microwave packages |
01/16/1985 | EP0020665B1 Three-dimensionally structured microelectronic device |
01/15/1985 | US4494217 Semiconductor memories with α shield |
01/15/1985 | US4494173 Three-dimensional insulating structure for high voltage components |
01/15/1985 | US4494172 High-speed wire wrap board |
01/15/1985 | US4494135 Programmable read only memory cell having an electrically destructible programmation element integrally formed with a junction diode |
01/15/1985 | US4493856 Selective coating of metallurgical features of a dielectric substrate with diverse metals |
01/15/1985 | US4493757 Device for applying blot-shaped coverings by electro-plating |
01/15/1985 | US4493145 Integrated circuit device having easily cleaned region between mother board and chip carriers mounted thereon |
01/15/1985 | US4493143 Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered |
01/09/1985 | EP0130737A1 Semiconductor device having input protection circuit |
01/09/1985 | EP0130691A2 Method of aligning two members utilizing marks provided thereon |
01/09/1985 | EP0130591A2 Semiconductor device of resin-seal type |
01/09/1985 | EP0130571A2 A semiconductor device comprising an alpha-rays shielding layer |
01/09/1985 | EP0130552A2 Electronic device method using a leadframe with an integral mold vent means |
01/09/1985 | EP0130497A2 Alignment technique for a scanning beam |
01/09/1985 | EP0130489A1 Tube-shaped container for the incorporation of semiconductor components |
01/09/1985 | EP0130417A2 A method of fabricating an electrical interconnection structure for an integrated circuit module |
01/09/1985 | EP0130412A1 Semiconductor device having a protection circuit |
01/09/1985 | EP0130279A2 Heat radiator assembly for cooling electronic parts |
01/09/1985 | EP0130207A1 Semiconductor chip package. |
01/08/1985 | US4493057 Method of making high density semiconductor device such as floating gate electrically programmable ROM or the like |
01/08/1985 | US4492739 Eutectic fine wire arrays |
01/08/1985 | US4492738 Diffraction grating wire arrays in series |
01/08/1985 | US4492717 Coating surface containing step-like irregularities with glass, heating to cause glass to fill in and etching |
01/08/1985 | CA1180824A1 Integrated circuit device having internal dampening for a plurality of power supplies |
01/08/1985 | CA1180823A1 Ceramic integrated circuit device |
01/08/1985 | CA1180808A1 Personal card comprising a safety switch |
01/02/1985 | EP0129966A1 High cooling efficiency circuit module |
01/02/1985 | EP0129915A1 A method of manufacturing an integrated circuit device |
01/02/1985 | EP0129914A1 A method for manufacturing an integrated circuit device |
01/02/1985 | EP0129562A1 Solar cell comprising a protective polyimide coating and method for protecting solar cells. |
01/02/1985 | CA1180485A Epoxy composition and sealing of integrated circuit modules therewith |
01/02/1985 | CA1180469A Plastic encapsulated semiconductor device and method for manufacturing the same |
01/02/1985 | CA1180456A Large scale integration data processor signal transfer mechanism |
01/01/1985 | US4491860 Titanium, tungsten, nitride, films |
01/01/1985 | US4491856 Semiconductor device having contacting but electrically isolated semiconductor region and interconnection layer of differing conductivity types |
01/01/1985 | US4491377 Mounting housing for leadless chip carrier |
01/01/1985 | US4490902 Lead frame for molded integrated circuit package |
12/27/1984 | EP0129476A2 Planar interconnection for integrated circuits |
12/27/1984 | EP0129389A2 A method of producing a layered structure |
12/27/1984 | EP0129294A1 PC board-transparent quiet connector for integrated circuits |
12/27/1984 | EP0129137A2 Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture |
12/27/1984 | EP0128993A1 Reference determining process for correcting mechanical movements when writing lines in a metallized grid by means of a laser, and apparatus therefor |
12/27/1984 | EP0128986A2 Monolithic microwave integrated circuit and method for selecting it |
12/25/1984 | US4490737 Smooth glass insulating film over interconnects on an integrated circuit |
12/25/1984 | US4490697 Signal propagating device for a plurality of memory cells |
12/25/1984 | US4489482 Impregnation of aluminum interconnects with copper |
12/25/1984 | US4489478 Process for producing a three-dimensional semiconductor device |
12/19/1984 | EP0128822A1 Method of producing memory cards, and cards obtained thereby |
12/19/1984 | EP0128799A1 Method of producing a hybrid circuit, and hybrid circuit obtained by this method |
12/19/1984 | EP0128675A1 A method of fabricating an integrated circuit having multi-layer wiring with a fuse and a fuse opening |
12/19/1984 | EP0128304A1 Method of forming a metallic silicide |
12/19/1984 | EP0128191A1 Integrated circuit carrier and assembly |
12/19/1984 | EP0128154A1 Flat bag filled with heat-conducting liquid or paste. |
12/18/1984 | US4489374 Rectifying apparatus for automotive A.C. generator |
12/18/1984 | US4489365 Universal leadless chip carrier mounting pad |
12/18/1984 | US4489364 Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface |
12/18/1984 | US4489241 Exposure method with electron beam exposure apparatus |
12/18/1984 | US4488674 Bonding wire, semiconductor device having the same, and bonding method using the same |
12/18/1984 | US4488592 For fluid cooling an electronics package |
12/18/1984 | US4488349 Method of repairing shorts in parallel connected vertical semiconductor devices by selective anodization |