Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/1985
02/12/1985US4499371 Electrical connection system
02/12/1985US4499333 Electronic component cap and seal
02/12/1985US4499147 With eutectic oxide coating
02/12/1985US4498721 Electrical connector for an electronic package
02/12/1985US4498530 Flexible thermal conduction element for cooling semiconductor devices
02/12/1985US4498232 Automatic insertion and removal device for components
02/12/1985US4498226 Method for manufacturing three-dimensional semiconductor device by sequential beam epitaxy
02/12/1985CA1182591A1 Fabrication of semiconductor modules with ceramic substrates and detection of residual glass
02/12/1985CA1182582A1 Semiconductor chip package
02/12/1985CA1182539A1 Dual-in-line package assembly
02/05/1985US4498122 High-speed, high pin-out LSI chip package
02/05/1985US4498121 Copper alloys for suppressing growth of Cu-Al intermetallic compounds
02/05/1985US4498096 Axial lead semiconductor device
02/05/1985US4498047 Integrated circuit mounting apparatus
02/05/1985US4497922 Compositions of materials for forming protective film in semiconductor device
02/05/1985US4497875 Ceramic substrate with metal plate
02/05/1985US4497665 Method for manufacturing semiconductor device
02/05/1985US4497106 Semiconductor device and a method of manufacturing the same
02/05/1985CA1182219A1 Means and method for disabling access to a memory
01/1985
01/31/1985WO1985000468A1 A semiconductor die having undedicated input/output cells
01/31/1985WO1985000467A1 Electronic circuit chip connection assembly and method
01/30/1985EP0132326A2 Passivation and insulation of III-V devices
01/29/1985US4496965 For an integrated circuit device
01/29/1985US4496634 Diffraction grating wire arrays in parallel
01/29/1985CA1181871A1 Stacked mos devices with polysilicon interconnects
01/29/1985CA1181868A1 Integrated circuit carrier assembly
01/23/1985EP0131807A2 Method of reducing alpha particle emissions from a ceramic material
01/22/1985US4495546 Hybrid integrated circuit component and printed circuit board mounting said component
01/22/1985US4495515 Electrically isolating two piece mounting washer arrangement
01/22/1985US4495377 Substrate wiring patterns for connecting to integrated-circuit chips
01/22/1985US4495376 Carrier for integrated circuit
01/22/1985US4495222 Metallization means and method for high temperature applications
01/22/1985US4495221 Aluminum, copper, silicon, to reduce tunnelling and thinning
01/22/1985US4495026 Preferential etching of aluminum-silver-aluminum layers on a thyristor substrate
01/22/1985US4494688 Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
01/22/1985CA1181534A1 Method of providing raised contact portions on contact areas of an electronic microcircuit
01/22/1985CA1181265A1 Composite material
01/16/1985EP0131242A2 Multi-layer ceramic substrate and method for the production thereof
01/16/1985EP0131004A1 Microwave packages
01/16/1985EP0020665B1 Three-dimensionally structured microelectronic device
01/15/1985US4494217 Semiconductor memories with α shield
01/15/1985US4494173 Three-dimensional insulating structure for high voltage components
01/15/1985US4494172 High-speed wire wrap board
01/15/1985US4494135 Programmable read only memory cell having an electrically destructible programmation element integrally formed with a junction diode
01/15/1985US4493856 Selective coating of metallurgical features of a dielectric substrate with diverse metals
01/15/1985US4493757 Device for applying blot-shaped coverings by electro-plating
01/15/1985US4493145 Integrated circuit device having easily cleaned region between mother board and chip carriers mounted thereon
01/15/1985US4493143 Method for making a semiconductor device by using capillary action to transport solder between different layers to be soldered
01/09/1985EP0130737A1 Semiconductor device having input protection circuit
01/09/1985EP0130691A2 Method of aligning two members utilizing marks provided thereon
01/09/1985EP0130591A2 Semiconductor device of resin-seal type
01/09/1985EP0130571A2 A semiconductor device comprising an alpha-rays shielding layer
01/09/1985EP0130552A2 Electronic device method using a leadframe with an integral mold vent means
01/09/1985EP0130497A2 Alignment technique for a scanning beam
01/09/1985EP0130489A1 Tube-shaped container for the incorporation of semiconductor components
01/09/1985EP0130417A2 A method of fabricating an electrical interconnection structure for an integrated circuit module
01/09/1985EP0130412A1 Semiconductor device having a protection circuit
01/09/1985EP0130279A2 Heat radiator assembly for cooling electronic parts
01/09/1985EP0130207A1 Semiconductor chip package.
01/08/1985US4493057 Method of making high density semiconductor device such as floating gate electrically programmable ROM or the like
01/08/1985US4492739 Eutectic fine wire arrays
01/08/1985US4492738 Diffraction grating wire arrays in series
01/08/1985US4492717 Coating surface containing step-like irregularities with glass, heating to cause glass to fill in and etching
01/08/1985CA1180824A1 Integrated circuit device having internal dampening for a plurality of power supplies
01/08/1985CA1180823A1 Ceramic integrated circuit device
01/08/1985CA1180808A1 Personal card comprising a safety switch
01/02/1985EP0129966A1 High cooling efficiency circuit module
01/02/1985EP0129915A1 A method of manufacturing an integrated circuit device
01/02/1985EP0129914A1 A method for manufacturing an integrated circuit device
01/02/1985EP0129562A1 Solar cell comprising a protective polyimide coating and method for protecting solar cells.
01/02/1985CA1180485A Epoxy composition and sealing of integrated circuit modules therewith
01/02/1985CA1180469A Plastic encapsulated semiconductor device and method for manufacturing the same
01/02/1985CA1180456A Large scale integration data processor signal transfer mechanism
01/01/1985US4491860 Titanium, tungsten, nitride, films
01/01/1985US4491856 Semiconductor device having contacting but electrically isolated semiconductor region and interconnection layer of differing conductivity types
01/01/1985US4491377 Mounting housing for leadless chip carrier
01/01/1985US4490902 Lead frame for molded integrated circuit package
12/1984
12/27/1984EP0129476A2 Planar interconnection for integrated circuits
12/27/1984EP0129389A2 A method of producing a layered structure
12/27/1984EP0129294A1 PC board-transparent quiet connector for integrated circuits
12/27/1984EP0129137A2 Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture
12/27/1984EP0128993A1 Reference determining process for correcting mechanical movements when writing lines in a metallized grid by means of a laser, and apparatus therefor
12/27/1984EP0128986A2 Monolithic microwave integrated circuit and method for selecting it
12/25/1984US4490737 Smooth glass insulating film over interconnects on an integrated circuit
12/25/1984US4490697 Signal propagating device for a plurality of memory cells
12/25/1984US4489482 Impregnation of aluminum interconnects with copper
12/25/1984US4489478 Process for producing a three-dimensional semiconductor device
12/19/1984EP0128822A1 Method of producing memory cards, and cards obtained thereby
12/19/1984EP0128799A1 Method of producing a hybrid circuit, and hybrid circuit obtained by this method
12/19/1984EP0128675A1 A method of fabricating an integrated circuit having multi-layer wiring with a fuse and a fuse opening
12/19/1984EP0128304A1 Method of forming a metallic silicide
12/19/1984EP0128191A1 Integrated circuit carrier and assembly
12/19/1984EP0128154A1 Flat bag filled with heat-conducting liquid or paste.
12/18/1984US4489374 Rectifying apparatus for automotive A.C. generator
12/18/1984US4489365 Universal leadless chip carrier mounting pad
12/18/1984US4489364 Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
12/18/1984US4489241 Exposure method with electron beam exposure apparatus
12/18/1984US4488674 Bonding wire, semiconductor device having the same, and bonding method using the same
12/18/1984US4488592 For fluid cooling an electronics package
12/18/1984US4488349 Method of repairing shorts in parallel connected vertical semiconductor devices by selective anodization