| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/17/1987 | US4644093 Circuit board |
| 02/17/1987 | US4643935 Stacks laminated by prepreg layers between |
| 02/17/1987 | US4643777 Forming metal silicides |
| 02/17/1987 | US4642872 Terminal feeding and insertion device |
| 02/12/1987 | WO1987001007A1 Electric switchgear |
| 02/12/1987 | WO1987000969A1 Three-level interconnection scheme for integrated circuits |
| 02/12/1987 | WO1987000913A1 Heat sink formed of stacked fin elements |
| 02/12/1987 | DE3625860A1 Semiconductor device having a contact and device for producing it |
| 02/11/1987 | CN86105249A Semiconductor device and its manufacture |
| 02/10/1987 | US4642672 Semiconductor device having registration mark for electron beam exposure |
| 02/10/1987 | US4642671 Semi-conductor assembly |
| 02/10/1987 | US4642670 Chip carrier package |
| 02/10/1987 | US4642419 Four-leaded dual in-line package module for semiconductor devices |
| 02/10/1987 | US4642148 Reduced residual carbon |
| 02/10/1987 | US4641425 Method of making alumina interconnection substrate for an electronic component |
| 02/10/1987 | US4641420 Forming a smoothing region on sidewalls of aperture |
| 02/10/1987 | US4641418 Molding process for semiconductor devices and lead frame structure therefor |
| 02/10/1987 | CA1217879A Integrated circuits employing proton-bombarded algaas layers |
| 02/10/1987 | CA1217876A Semiconductor device and a method for fabricating the same |
| 02/10/1987 | CA1217875A Method of fabricating a substrate which includes one or more apertures therethrough |
| 02/04/1987 | EP0210801A2 Leaded chip carrier connector |
| 02/04/1987 | EP0210397A1 LSI circuits adaptable for custom design methods |
| 02/04/1987 | EP0210380A1 Electronic circuit interconnection system |
| 02/04/1987 | EP0210371A1 Semiconductor device having a plurality of leads |
| 02/03/1987 | USH208 Packaging microminiature devices |
| 02/03/1987 | US4641176 Semiconductor package with contact springs |
| 02/03/1987 | US4641108 Configurable analog integrated circuit |
| 02/03/1987 | US4640888 Etching a slit reflecting light as one peak |
| 02/03/1987 | US4640844 Method for the manufacture of gate electrodes formed of double layers of metal silicides having a high melting point and doped polycrystalline silicon |
| 02/03/1987 | US4640738 Protective layer is applied to etched via hole prior to metal deposition step |
| 02/03/1987 | US4640723 Lead frame and method for manufacturing the same |
| 02/03/1987 | US4640438 Pressure bonded coated substrate and preform |
| 02/03/1987 | US4640436 Hermetic sealing cover and a method of producing the same |
| 02/03/1987 | US4640010 Method of making a package utilizing a self-aligning photoexposure process |
| 02/03/1987 | US4640004 Method and structure for inhibiting dopant out-diffusion |
| 02/03/1987 | CA1217574A1 Integrated semiconductor circuit having an external contacting track level consisting of aluminum or of an aluminum alloy |
| 02/03/1987 | CA1217570A1 Electronic component package comprising a moisture retention element |
| 01/31/1987 | CN85102787A Circuit teaching device with cards and socket connecting units |
| 01/29/1987 | WO1987000689A1 Device for hardening, by means of inserts, an electrical component to protect it against radiations |
| 01/29/1987 | WO1987000686A1 Connection terminals between substrates and method of producing the same |
| 01/28/1987 | EP0209936A1 Electrical contact pin for printed circuit board |
| 01/28/1987 | EP0209794A2 Method for producing a contact for a semiconductor device |
| 01/28/1987 | EP0209654A2 Semiconductor device having wiring electrodes |
| 01/28/1987 | EP0209642A2 Ceramic microcircuit package |
| 01/28/1987 | EP0209630A2 Heat transfer element and its use in a circuit package |
| 01/27/1987 | US4639835 Device obtained by mounting two semiconductor components within a single housing |
| 01/27/1987 | US4639830 Packaged electronic device |
| 01/27/1987 | US4639829 Thermal conduction disc-chip cooling enhancement means |
| 01/27/1987 | US4639826 Protection against ionizing radiation |
| 01/27/1987 | US4639818 Vent hole assembly |
| 01/27/1987 | US4639760 High power RF transistor assembly |
| 01/27/1987 | US4639503 Thermosetting resin composition |
| 01/27/1987 | CA1217300A1 Polyimide composition for protecting photoreactive cells |
| 01/27/1987 | CA1217116A1 Semiconductor device and method of manufacturing the semiconductor device |
| 01/21/1987 | EP0209265A1 Lead frame for semiconductor devices |
| 01/21/1987 | EP0209208A2 Low-stress-inducing omnidirectional heat sink with domed attachment portion |
| 01/21/1987 | EP0209173A1 Method of manufacturing semiconductor devices comprising the mechanical connection of two bodies |
| 01/21/1987 | EP0208970A1 MOFSET having a thermal protection |
| 01/20/1987 | US4638458 Semiconductor memory address lines with varied interval contact holes |
| 01/20/1987 | US4638404 Clamping device for plate-shaped semiconductor components |
| 01/20/1987 | US4638348 Semiconductor chip carrier |
| 01/20/1987 | US4637456 Heat exchanger |
| 01/20/1987 | US4637130 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
| 01/20/1987 | EP0161282A4 Semiconductor package with internal heat exchanger. |
| 01/20/1987 | CA1216965A1 Method of manufacturing accurately contact windows in a semiconductor device and device made by such method |
| 01/20/1987 | CA1216964A1 Method for manufacturing an integrated semiconductor circuit having multi-layer aluminum or aluminum alloy wiring |
| 01/20/1987 | CA1216963A1 Interconnection device between the cells of a pre- implanted hyperfrequency integrated circuit |
| 01/20/1987 | CA1216960A1 Hermetic power chip packages |
| 01/17/1987 | CN85101150A Fluorine-containing polyamide-acid derivative and polyimide |
| 01/15/1987 | DE3524832A1 Fabrication of thin-film circuits |
| 01/14/1987 | EP0207981A1 Compositions of poly(imides) having phenylindane diamines and/or dianhydride moieties in the poly(imide) backbone |
| 01/13/1987 | US4636917 Precalibrated element for securing and locking semiconductors and heat sinks arranged in alternating rows |
| 01/13/1987 | US4636916 Apparatus for minimizing optically and thermally induced noise in precision electronic components |
| 01/13/1987 | US4636834 Submicron FET structure and method of making |
| 01/13/1987 | US4636832 Semiconductor device with an improved bonding section |
| 01/13/1987 | US4636647 Package for optical element |
| 01/13/1987 | US4636580 Static converter module with mounting lugs |
| 01/13/1987 | US4636404 Method and apparatus for forming low resistance lateral links in a semiconductor device |
| 01/13/1987 | US4636332 Thick film conductor composition |
| 01/13/1987 | US4636275 Prevents adhesive from flowing onto bonding pads |
| 01/13/1987 | US4635345 Method of making an intergrated vertical NPN and vertical oxide fuse programmable memory cell |
| 01/10/1987 | CN85102328A Cooling device of semiconductor integrated circuit board |
| 01/10/1987 | CN85101326A Terminal box for a solar cell module |
| 01/08/1987 | DE3522798A1 Immersion tank cooling for compact electronic components |
| 01/07/1987 | EP0207853A1 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card |
| 01/07/1987 | EP0207852A1 Method for mounting an integrated circuit on a support, resultant device and its use in an electronic microcircuit card |
| 01/07/1987 | EP0207607A1 Passivation of InP by plasma deposited phosphorus and effects of surface treatment thereon |
| 01/07/1987 | EP0207466A2 Circuit substrate |
| 01/07/1987 | CN86102617A Silver-filled glass metallizing pastes |
| 01/07/1987 | CN85104913A Semiconductor module for a high-speed switching arrangment |
| 01/07/1987 | CN85104878A Encapsulated electronic circuit device and method and apparatus for making same |
| 01/06/1987 | US4635093 Electrical connection |
| 01/06/1987 | US4635092 Tape automated manufacture of power semiconductor devices |
| 01/06/1987 | US4635091 Semiconductor device having overload protection |
| 01/06/1987 | US4635088 High speed-low power consuming IGFET integrated circuit |
| 01/06/1987 | US4635085 Semiconductor memory device |
| 01/06/1987 | US4634474 Coating of III-V and II-VI compound semiconductors |
| 01/06/1987 | US4634041 Process for bonding current carrying elements to a substrate in an electronic system, and structures thereof |
| 01/06/1987 | US4633583 Method of making a lead frame for integrated circuits |
| 01/06/1987 | US4633582 Method for assembling an optoisolator and leadframe therefor |