| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/03/1987 | EP0224141A2 Improved semiconductor power devices |
| 06/03/1987 | EP0177562A4 Nitride bonding layer. |
| 06/03/1987 | EP0176557A4 Impedance-matched leads. |
| 06/03/1987 | CN85101064A 半导体阀门 Semiconductor valve |
| 06/02/1987 | US4670771 Rectifier module |
| 06/02/1987 | US4670770 Integrated circuit chip-and-substrate assembly |
| 06/02/1987 | US4670678 Rotating rectifying device for the excitation of a synchronous machine |
| 06/02/1987 | US4670347 Radio frequency, electromagnetic interference |
| 06/02/1987 | US4670325 Polyamide imide copolymer with aluminum oxide-zinc oxide fill er |
| 06/02/1987 | US4670299 Preparation of lower alkyl polysilsesquioxane and formation of insulating layer of silylated polymer on electronic circuit board |
| 06/02/1987 | US4670297 Evaporated thick metal and airbridge interconnects and method of manufacture |
| 06/02/1987 | US4669535 Heat sink formed of stacked fin elements |
| 06/02/1987 | US4669177 Complimentary metal oxide semiconductor self-aligned gate |
| 06/02/1987 | CA1222576A1 Semiconductor device with improved support member |
| 06/02/1987 | CA1222575A1 Semiconductor wafer fabrication |
| 06/01/1987 | EP0179802A4 Integrated circuits with contact pads in a standard array. |
| 06/01/1987 | EP0177559A4 Integrated-circuit leadframe adapted for a simultaneous bonding operation. |
| 05/27/1987 | EP0223699A2 Signal ground planes for tape bonded devices |
| 05/27/1987 | EP0223698A2 Hillock immunization mask |
| 05/27/1987 | EP0223637A1 Method for making a metallic multilayer interconnection pattern of the components of a very dense integrated circuit |
| 05/27/1987 | EP0223527A2 Contact vias in semiconductor devices |
| 05/27/1987 | EP0223475A2 Microcircuit packaging member |
| 05/27/1987 | EP0223286A1 Diode and metal stud therefor |
| 05/27/1987 | EP0223234A2 Interconnection package suitable for electronic devices and methods for producing same |
| 05/27/1987 | EP0223220A2 Multilayer ceramic circuit board fired at a low temperature |
| 05/27/1987 | EP0222867A1 Optical provision of connections in integrated devices |
| 05/27/1987 | EP0222795A1 Polycide process in semiconductor fabrication. |
| 05/27/1987 | DE3618210A1 Wiring carrier for connecting semiconductor chips with a large number of pins |
| 05/26/1987 | US4669071 Photo sensor device and optical pickup device |
| 05/26/1987 | US4669028 Heat sink for solid state devices connected to a circuit board |
| 05/26/1987 | US4668973 Semiconductor device passivated with phosphosilicate glass over silicon nitride |
| 05/26/1987 | US4668644 Oxides of aluminum, magnesium, titanium; roasting; slurring; sintering |
| 05/26/1987 | US4668471 Copper alloy lead material for leads of a semiconductor device |
| 05/26/1987 | US4668037 Hermetic passage for an enclosure, especially a housing for semiconductors |
| 05/26/1987 | US4667404 Method of interconnecting wiring planes |
| 05/26/1987 | CA1222331A1 Integrated circuit package |
| 05/21/1987 | WO1987003074A1 Open cycle cooling of electrical circuits |
| 05/21/1987 | WO1987003013A1 Sputtering method for reducing hillocking in aluminum layers formed on substrates |
| 05/20/1987 | EP0222651A1 Device to limit the humidity in an enclosure, particularly for use in an electronic component casing |
| 05/20/1987 | EP0222618A2 Multilayer hybrid integrated circuit and process for producing |
| 05/20/1987 | EP0222259A2 Thick film conductor composition |
| 05/20/1987 | EP0222203A1 Semiconductor power module |
| 05/20/1987 | EP0222144A1 A wafer-scale semiconductor device |
| 05/19/1987 | US4667267 Decoupling capacitor for pin grid array package |
| 05/19/1987 | US4667220 Semiconductor chip module interconnection system |
| 05/19/1987 | US4667219 Semiconductor chip interface |
| 05/19/1987 | US4666796 Plated parts and their production |
| 05/19/1987 | US4666545 Method of making a mounting base pad for semiconductor devices |
| 05/19/1987 | US4666252 High yield liquid crystal display and method of making same |
| 05/19/1987 | US4666199 Chip carrier extraction tool |
| 05/19/1987 | CA1222071A1 Conductive die attach tape |
| 05/19/1987 | CA1222067A1 Integrated circuit having a pre-attached conductive mounting media and method of making the same |
| 05/14/1987 | DE3539518A1 Connecting elements, especially connecting tabs for sheathed electrical components, component groups or integrated circuits which are arranged on a carrier, especially surface-acoustic-wave (SAW) filters |
| 05/13/1987 | EP0221809A1 Hybrid circuit and method for producing such a circuit |
| 05/13/1987 | EP0221798A1 Method for making a metallic interconnection pattern of the components of a very dense integrated circuit |
| 05/13/1987 | EP0221624A1 MOS transistor and method of fabrication |
| 05/13/1987 | EP0221620A1 Leadless chip test socket |
| 05/13/1987 | EP0221531A2 High heat conductive insulated substrate and method of manufacturing the same |
| 05/13/1987 | EP0221496A2 Integrated circuit package |
| 05/13/1987 | EP0221431A2 Aligned interconnections between logic stages |
| 05/13/1987 | EP0221399A2 Semiconductor power module |
| 05/13/1987 | EP0221351A1 Integrated circuit with an electroconductive flat element |
| 05/12/1987 | US4665504 Fast switching |
| 05/12/1987 | US4665468 Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same |
| 05/12/1987 | US4665295 Laser make-link programming of semiconductor devices |
| 05/12/1987 | US4665111 Casting compound for electrical and electronic components and modules |
| 05/12/1987 | US4664946 Silicon carbide substrates and a method of producing the same |
| 05/12/1987 | US4663833 Adhesively fastening plate over opening containing chip |
| 05/12/1987 | US4663820 Removal of thickness of silicon surface before depositing nickel and silver |
| 05/07/1987 | WO1987002860A1 Surface mountable integrated circuit packages having solder bearing leads |
| 05/07/1987 | WO1987002834A1 Stripline mount for semiconductor lasers |
| 05/07/1987 | WO1987002833A1 Multilayer ceramic laser package |
| 05/07/1987 | WO1987002828A1 Glass intermetal dielectric |
| 05/07/1987 | WO1987002626A1 Method for forming vertical interconnects in polyimide insulating layers |
| 05/07/1987 | DE3539161A1 Convection heat sink |
| 05/06/1987 | EP0220698A2 Thyristor with a disc-shaped housing |
| 05/06/1987 | EP0220600A2 Carriers for pin grid array |
| 05/06/1987 | EP0220517A2 Semiconductor device having a contact area |
| 05/06/1987 | EP0220508A2 A multi-layer circuit board having a large heat dissipation |
| 05/06/1987 | EP0220503A2 Method and structure for effecting engineering changes in a multiple device module package |
| 05/06/1987 | EP0220500A1 Semiconductor device with reduced capacitive load and manufacturing process thereof |
| 05/06/1987 | EP0220493A2 Method for improving wirability of master-image DCVS chips |
| 05/06/1987 | EP0220469A1 Power thyristor |
| 05/06/1987 | EP0220444A2 Logic-circuit layout for large-scale integrated circuits |
| 05/06/1987 | EP0040251B1 Semiconductor memory device |
| 05/05/1987 | US4663651 Segmented lead frame strip for IC chip carrier |
| 05/05/1987 | US4663650 Packaged integrated circuit chip |
| 05/05/1987 | US4663649 SiC sintered body having metallized layer and production method thereof |
| 05/05/1987 | US4663215 Alumina interconnection substrate for an electronic component, and method of manufacture |
| 05/05/1987 | US4663191 Salicide process for forming low sheet resistance doped silicon junctions |
| 05/05/1987 | US4663190 Curing epoxy resin, dibasic acid, imidazole |
| 05/05/1987 | US4663186 Screenable paste for use as a barrier layer on a substrate during maskless cladding |
| 05/05/1987 | CA1221473A1 Semiconductor package with internal heat exchanger |
| 04/30/1987 | DE3537820A1 Electronic fuze |
| 04/29/1987 | EP0219933A2 Sintered silicon carbide ceramic body of high electrical resistivity |
| 04/29/1987 | EP0219827A2 Improved process for forming low sheet resistance metal silicide layers on semiconductor substrates |
| 04/29/1987 | EP0219812A2 Packaged semiconductor device having solderable external leads and process for its production |
| 04/29/1987 | EP0219692A2 Method for producing heat sink and heat sink thus produced |
| 04/29/1987 | EP0219674A1 Cooling device for electronic parts |
| 04/29/1987 | EP0219668A1 Logic-circuit layout for large-scale integrated circuits |