Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1984
12/18/1984CA1179788A1 Semiconductor device
12/12/1984EP0128102A2 Impregnation of aluminum interconnects with copper
12/12/1984EP0128079A2 Electronic component encapsulating housing protected against radiations
12/12/1984EP0127946A1 Method of producing a via in a semiconductor device
12/12/1984EP0127857A1 Solderable stainless steel article and method for making same
12/12/1984EP0127750A1 Encapsulated semiconductor device in a cup-shaped container
12/12/1984EP0127655A1 Integrated circuit mounting apparatus
12/11/1984US4488267 Integrated circuit chips with removable drivers and/or buffers
12/11/1984US4488262 Electronically programmable read only memory
12/11/1984US4488167 Current converter assembly in a flat housing
12/11/1984US4488060 High voltage ramp rate control systems
12/11/1984US4487999 Microwave chip carrier
12/11/1984US4487795 Method of forming patterned conductor lines
12/11/1984US4487653 Forming recesses in inactive regions
12/11/1984US4487638 Mixture of low and high melting metal powders
12/11/1984US4486948 Method for forming lead frame for integrated circuit devices
12/11/1984US4486946 Method for using titanium-tungsten alloy as a barrier metal in silicon semiconductor processing
12/11/1984US4486945 Method of manufacturing semiconductor device with plated bump
12/11/1984US4486944 Method of making single poly memory cell
12/11/1984EP0076802A4 High current package with multi-level leads.
12/05/1984EP0127401A1 Electro-optical element package
12/05/1984EP0127281A1 An electrode for a semiconductor device
12/05/1984EP0127115A2 Heat sink structure for an electronic package
12/05/1984EP0127100A2 Semiconductor integrated circuit device
12/05/1984EP0127089A1 Semiconductor device having first and second electrodes and method of producing the same
12/05/1984EP0127020A2 Method of manufacturing multi-layer semiconductor device
12/04/1984US4486769 Dense nonvolatile electrically-alterable memory device with substrate coupling electrode
12/04/1984US4486705 Method of testing networks on a wafer having grounding points on its periphery
12/04/1984US4486622 Prevention of formation of moistuire
12/04/1984US4486511 Solder composition for thin coatings
12/04/1984US4486464 Josephson junction devices and semiconductors
12/04/1984US4485553 Method for manufacturing an integrated circuit device
12/04/1984CA1179070A1 Packaged semiconductor device which provides for enhanced power dissipation
11/1984
11/28/1984EP0126664A2 Wire bonding method for producing a semiconductor device and semiconductor device produced by this method
11/28/1984EP0126621A2 Alignment marks on semiconductor wafers and method of manufacturing the marks
11/28/1984EP0126606A2 Heat sink assemblies and electrical insulators used therein
11/22/1984WO1984004648A1 Integrated circuit module and method of making same
11/21/1984EP0125767A2 A coated or encapsulated product
11/21/1984EP0125537A2 A method for packing a plurality of wire segments in a wiring bay composed of wiring channels
11/20/1984US4484292 High speed machine for the physical design of very large scale integrated circuits
11/20/1984US4484244 Protection circuit for integrated circuit devices
11/20/1984US4484215 Flexible mounting support for wafer scale integrated circuits
11/20/1984US4484214 pn Junction device with glass moats and a channel stopper region of greater depth than the base pn junction depth
11/20/1984US4484213 Binary weighted resistor and package
11/20/1984US4484212 Semiconductor device
11/20/1984US4483898 Liquids with reduced spreading tendency
11/20/1984US4483389 Telescoping thermal conduction element for semiconductor devices
11/20/1984US4483067 Method of manufacturing an identification card and an identification manufactured, for example, by this method
11/16/1984EP0113763A4 Lead frame and method.
11/14/1984EP0124954A2 Semiconductor devices comprising metallic silicide elements
11/14/1984EP0124715A1 Clip-fastening of a solid state device to a heatsink
11/14/1984EP0124705A1 Semiconductor device with a semiconductor wafer and ring-shaped insulating body
11/14/1984EP0124624A1 Semiconductor device
11/13/1984US4482915 Lead frame for plastic encapsulated semiconductor device
11/13/1984US4482914 Contact structure of semiconductor device
11/13/1984US4482913 Junctions/p-n/
11/13/1984US4482912 Stacked structure having matrix-fibered composite layers and a metal layer
11/13/1984US4482907 Planar-type field-effect transistor having metallized-well electrodes and a method of fabrication of said transistor
11/13/1984US4482825 Semiconductor device having a circuit for generating a voltage higher than a supply voltage and responsive to variations in the supply voltage
11/13/1984US4482820 Integrated circuit having stray capacitance compensation
11/13/1984US4482781 Stabilization of semiconductor device package leads
11/13/1984US4482665 Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions
11/13/1984US4482611 Copper, chromium, zirconium alloy coated with zinc;diodes, transistors, integrated circuits
11/13/1984US4482394 Method of making aluminum alloy film by implanting silicon ions followed by thermal diffusion
11/13/1984US4481984 Electronic component lead straightening device and method
11/13/1984US4481708 Reduced internal temperature technique for hermetic sealing of enclosures
11/13/1984CA1177975A1 Glass passivated high power semiconductor devices
11/13/1984CA1177957A1 Shorted junction type programmable read only memory semi-conductor devices
11/08/1984WO1984004441A1 Printed-wiring substrate
11/07/1984EP0124428A1 Lighter mounting for electronic components
11/07/1984EP0124421A1 Manufacturing process for a thermal dissipation device via pins, and device obtained thereby
11/07/1984EP0124358A2 Method for disconnecting interconnection using focused ion beam
11/07/1984EP0124256A1 MESFETs and methods of manufacturing MESFETs
11/07/1984EP0124181A2 Semiconductor device comprising a semiconductor body on which conductive tracks are disposed which are interconnected through a window in an insulating layer and method manufacturing same
11/07/1984EP0124115A2 Semiconducter ROM device and method for manufacturing the same
11/07/1984EP0124106A1 Poly(arylene sulfide) compositions
11/07/1984EP0124029A2 Well-coolable modular circuit carrying an electrical component
11/07/1984EP0123954A2 Structure containing a layer consisting of polyimide and an inorganic filler and method for producing such a structure
11/07/1984EP0123795A2 Unitary heat sink for an electronic device module
11/07/1984EP0123692A1 Leadless chip carrier for logic components
11/07/1984EP0123689A1 Microcircuit package and sealing method.
11/06/1984US4481526 Semiconductor device
11/06/1984US4481525 Heat dissipator for integrated circuit chips
11/06/1984US4481524 Semiconductor memory device having stacked polycrystalline silicon layers
11/06/1984US4481263 Programmable read only memory
11/06/1984US4481261 Blister-resistant dielectric
11/06/1984CA1177580A1 Button rectifier package for non-planar die
10/1984
10/31/1984EP0123309A2 Method of producing stable, low ohmic contacts in integrated semiconductor circuits
10/31/1984EP0123262A2 Resin encapsulated semiconductor device and process for producing the same
10/30/1984US4480288 Multi-layer flexible film module
10/30/1984US4480262 Semiconductor casing
10/30/1984US4480261 Contact structure for a semiconductor substrate on a mounting body
10/30/1984US4480199 Identification of repaired integrated circuits
10/30/1984US4480150 Lead frame and method
10/30/1984US4480148 Electrical device package
10/30/1984US4480045 Alumina-based ceramic composition and substrate obtained by means of this composition
10/30/1984US4480013 Substrate for use in semiconductor apparatus
10/30/1984US4479830 Ion implanting impurity, them silicon ions, then activation
10/24/1984EP0122687A2 A semiconductor device comprising packing means for protecting parts of the device
10/24/1984EP0122631A2 Electronic device having a multi-layer wiring structure
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