| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/25/1987 | EP0215557A2 Copper-chromium-polyimide composite |
| 03/25/1987 | EP0215542A2 Method of manufacturing a semiconductor device including forming a multi-level interconnection layer |
| 03/25/1987 | EP0215462A2 Paste for bonding semi-conductors to ceramic underlayers |
| 03/25/1987 | EP0112894B1 Power bus routing for gate arrays |
| 03/24/1987 | US4652977 Microelectronics module |
| 03/24/1987 | US4652974 Method and structure for effecting engineering changes in a multiple device module package |
| 03/24/1987 | US4652973 Chip carrier mounting apparatus |
| 03/24/1987 | US4652970 High density LSI package for logic circuits |
| 03/24/1987 | US4652902 Power semiconductor device |
| 03/24/1987 | US4652465 Process for the production of a silver coated copper powder and conductive coating composition |
| 03/24/1987 | US4652336 Sputtering, multilayer, aluminum, titanium |
| 03/24/1987 | US4651415 Leaded chip carrier |
| 03/24/1987 | US4651409 Method of fabricating a high density, low power, merged vertical fuse/bipolar transistor |
| 03/24/1987 | CA1219687A1 Method and structure for inhibiting dopant out- diffusion |
| 03/24/1987 | CA1219684A1 Semiconductor package |
| 03/18/1987 | EP0214916A1 Process for making an interconnection substrate for electronic components |
| 03/18/1987 | EP0214621A2 A package comprising a substrate and at least one electronic component |
| 03/18/1987 | EP0214465A1 Plating process for an electronic part |
| 03/18/1987 | EP0214414A1 Method of producing a semiconductor body contacted on both sides |
| 03/18/1987 | EP0214307A1 Semiconducteur circuit device |
| 03/18/1987 | EP0214230A1 Laminated semiconductor assembly |
| 03/18/1987 | EP0214229A1 Logic circuit having improved testability for defective via contacts. |
| 03/17/1987 | US4651192 Ceramic packaged semiconductor device |
| 03/17/1987 | US4651191 Semiconductor device and fabrication method thereof |
| 03/17/1987 | US4650923 Resistors, circuits |
| 03/17/1987 | US4650922 Thermally matched mounting substrate |
| 03/17/1987 | US4650744 Method of manufacturing semiconductor device |
| 03/17/1987 | US4650285 Hot alignment assembly method for optoelectronic packages |
| 03/17/1987 | US4650107 Method for the bubble-free joining of a large-area semiconductor component by means of soldering to a component part serving as substrate |
| 03/17/1987 | US4649992 Diamond heatsink assemblies |
| 03/17/1987 | US4649990 Heat-conducting cooling module |
| 03/17/1987 | US4649637 Method for producing resin-molded semiconductor device having heat radiating plate embedded in the resin |
| 03/17/1987 | CA1219104A1 Copper alloys for suppressing growth of cu-al intermetallic compounds |
| 03/12/1987 | WO1987001510A1 Microelectronic package |
| 03/12/1987 | WO1987001509A1 Manufacture of a hybrid electronic or optical device |
| 03/12/1987 | EP0183722A4 High density ic module assembly. |
| 03/11/1987 | EP0213974A1 Micromodule with embedded contacts and a card containing circuits comprising such a micromodule |
| 03/11/1987 | EP0213774A1 Anisotropically electrically conductive article |
| 03/11/1987 | EP0213764A2 Preparation of fragile sheet-like devices, such as lead frames |
| 03/11/1987 | EP0213575A2 Method of manufacturing a semiconductor device employing a film carrier tape |
| 03/11/1987 | EP0213409A1 Structure for the quality testing of a semiconductor substrate |
| 03/11/1987 | EP0213352A2 Method of manufacturing a lateral transistor |
| 03/10/1987 | US4649460 Single-in-line integrated electronic component |
| 03/10/1987 | US4649418 Data card and method of manufacturing same |
| 03/10/1987 | US4649417 Multiple voltage integrated circuit packaging substrate |
| 03/10/1987 | US4649416 Microwave transistor package |
| 03/10/1987 | US4649415 Semiconductor package with tape mounted die |
| 03/10/1987 | US4649412 Read only semiconductor memory device with polysilicon drain extensions |
| 03/10/1987 | US4649125 Peroxide |
| 03/10/1987 | US4649070 Ceramic with conductive thin film |
| 03/10/1987 | US4648179 Process of making interconnection structure for semiconductor device |
| 03/05/1987 | DE3624096A1 Method for producing a semiconductor element to which contact is made on both sides |
| 03/04/1987 | EP0213105A2 Method for assembling an optoisolator and leadframe therefor |
| 03/04/1987 | EP0213014A1 Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate |
| 03/04/1987 | EP0213010A1 Method of the preparation of a ceramic cordierite powder sinterable at low temperatures, powder obtainable by the method and ceramic composition obtained by sintering the powder |
| 03/04/1987 | EP0212994A2 Method and apparatus for packaging semiconductor device and the like |
| 03/04/1987 | EP0212890A2 Preparation of fragile sheet-like devices, such as lead frames |
| 03/04/1987 | EP0212521A1 Package for integrated circuit |
| 03/04/1987 | EP0212219A2 Visibility enhancement of first order alignment marks |
| 03/04/1987 | EP0212124A1 Method of fabricating a multilayer ceramic substrate |
| 03/03/1987 | US4648008 Mounting device for a thick layer electronic module |
| 03/03/1987 | US4647959 Integrated circuit package, and method of forming an integrated circuit package |
| 03/03/1987 | US4647867 High-frequency, high-gain, push-pull amplifier circuit |
| 03/03/1987 | US4647472 Process of producing a semiconductor device |
| 03/03/1987 | US4647340 Programmable read only memory using a tungsten fuse |
| 03/03/1987 | US4647134 IC socket contact |
| 03/03/1987 | US4647133 Electrical interconnect system |
| 03/03/1987 | CA1218766A1 Self-aligning, self-loading semiconductor clamp |
| 03/03/1987 | CA1218765A1 Contact material for compression bonded semiconductor devices |
| 03/03/1987 | CA1218764A2 Semiconductor die-attach technique and composition therefor |
| 03/03/1987 | CA1218761A1 Method and apparatus for tape automated bonding of integrated circuits |
| 03/03/1987 | CA1218739A1 Composite substrate for electronic components |
| 02/26/1987 | WO1987001240A1 Hybrid circuit packages |
| 02/26/1987 | DE3529182A1 High-current rectifier installation having semi-conductor valves |
| 02/25/1987 | EP0211716A1 Method for continuously producing micromodules for cards comprising components, continuous strip of micromodules, and micromodule realized by such a method |
| 02/25/1987 | EP0211628A1 Multiple heat pipes for linear beam tubes having common coolant and vaporizing surface area enhancement |
| 02/25/1987 | EP0211620A2 Process and apparatus for sealing semiconductor packages |
| 02/25/1987 | EP0211619A2 A multilayer ceramic circuit board |
| 02/25/1987 | EP0211618A2 Integrated circuit package |
| 02/25/1987 | EP0211609A2 Chemically sensitive semiconductor devices and their production |
| 02/25/1987 | EP0211603A1 Method of making ceramic dielectric bodies |
| 02/25/1987 | EP0211318A1 Process for selectively filling contact holes made by etching in insulating layers with electrically conductive materials for the manufacture of high-density integrated semiconductor circuits, and apparatus used for this process |
| 02/25/1987 | CN86105621A Process and apparatus for production od clad sheets |
| 02/25/1987 | CN86102300A Buried interconnect for silicon |
| 02/24/1987 | US4646267 Semiconductor memory |
| 02/24/1987 | US4646203 Mounting structure for semiconductor devices |
| 02/24/1987 | US4646132 IC socket having a backup power cell and circuit |
| 02/24/1987 | US4646131 Rectifier device |
| 02/24/1987 | US4646130 Semiconductor device for current rectification |
| 02/24/1987 | US4646129 Hermetic power chip packages |
| 02/24/1987 | US4646126 Semiconductor device |
| 02/24/1987 | US4646125 Semiconductor device including Darlington connections |
| 02/24/1987 | US4645688 Composition for protective coating material |
| 02/24/1987 | US4645552 Process for fabricating dimensionally stable interconnect boards |
| 02/24/1987 | US4645279 Chip carrier socket having improved contact terminals |
| 02/24/1987 | CA1218470A1 Semiconductor device with polycrystalline silicon active region and ic including semiconductor device |
| 02/24/1987 | CA1218468A1 Method of screen printing conductive elements |
| 02/24/1987 | CA1218201A1 Copper alloys with improved solderability shelf life |
| 02/17/1987 | USRE32351 Method of manufacturing a passivating composite comprising a silicon nitride (SI1 3N4) layer and a phosphosilicate glass (PSG) layer for a semiconductor device layer |
| 02/17/1987 | US4644385 Cooling module for integrated circuit chips |