| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/03/1986 | EP0192989A2 Integrated circuit with a semiconductor capacitor and process for its production |
| 09/03/1986 | EP0192646A1 Diffusion barrier layer for integrated-circuit devices. |
| 09/02/1986 | US4609937 Power semiconductor device with O-ring seal |
| 09/02/1986 | US4609936 Foundations, aluminum, hardness, metals |
| 09/02/1986 | US4609935 Silicon oxide and nitride films, shields, polycrystalline, contactors, apertures, potentials |
| 09/02/1986 | US4609241 Programmable programmed socket |
| 09/02/1986 | US4609040 Self-securing heat sink |
| 09/02/1986 | US4608751 Method of making dynamic memory array |
| 09/02/1986 | CA1210874A1 Hermetically sealable package for hybrid solid-state electronic devices and the like |
| 08/28/1986 | WO1986005030A1 Laminated semiconductor assembly |
| 08/28/1986 | WO1986004995A1 Logic circuit having improved testability for defective via contacts |
| 08/27/1986 | EP0192541A1 Cooling device for integrated semi-conductor circuits |
| 08/27/1986 | EP0192468A2 Electronic package assembly and accessory component therefor |
| 08/27/1986 | EP0192269A1 Method for the electrical insulating and levelling of structured surfaces |
| 08/27/1986 | EP0192093A1 Semiconductor device and method of manufacturing the same |
| 08/27/1986 | EP0191981A1 Multilayer circuit |
| 08/26/1986 | US4608668 Semiconductor device |
| 08/26/1986 | US4608592 Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage |
| 08/26/1986 | US4608583 FET amplifier |
| 08/26/1986 | US4608354 Silicon nitride substrate |
| 08/26/1986 | US4608316 Ceramic wiring board and process for producing the same |
| 08/26/1986 | US4607685 Mechanical attachment; grippers, screws |
| 08/26/1986 | CA1210528A1 Method for fabricating mos device with self-aligned contacts |
| 08/26/1986 | CA1210519A1 Circuit module with enhanced heat transfer and distribution |
| 08/20/1986 | EP0191434A2 Improved solder connection between microelectronic chip and substrate and method of manufacture |
| 08/20/1986 | EP0191419A2 Semiconductor power module with integrated heat pipe |
| 08/20/1986 | EP0191037A1 Semiconductor-on-insulator (soi) devices and soi ic fabrication method. |
| 08/20/1986 | CN85201478U Terminal block for solar cell assembly |
| 08/19/1986 | US4607277 Semiconductor assembly employing noneutectic alloy for heat dissipation |
| 08/19/1986 | US4607276 Tape packages |
| 08/19/1986 | US4607275 Semiconductor element with disk-shaped housing |
| 08/19/1986 | US4607273 Power semiconductor device |
| 08/19/1986 | US4606962 Electrically and thermally conductive adhesive transfer tape |
| 08/19/1986 | CA1210067A1 Isfet sensor and method of manufacture |
| 08/13/1986 | EP0190820A2 Zirconium thin-film metal conductor systems |
| 08/13/1986 | EP0190490A2 Thin-film electrical connections for integrated circuits |
| 08/13/1986 | EP0190386A1 Copper-based alloy and lead frame made of it |
| 08/13/1986 | EP0190308A1 Electrical connector device. |
| 08/13/1986 | EP0190259A1 Rotating rectifier assembly |
| 08/13/1986 | EP0070861B1 Wafer and method of testing networks thereon |
| 08/13/1986 | CN85109678A Housing for an electronic device |
| 08/13/1986 | CN85107549A Diffusion isolation layer for maskless cladding process |
| 08/13/1986 | CN85107248A Plastic encapsulated sc device |
| 08/12/1986 | US4605949 Semiconductor device with interdigitated electrodes |
| 08/12/1986 | US4605947 Silicon overcoatings |
| 08/12/1986 | US4605567 Photopolymerization of allyl anhydride-modified polysiloxanes reacted with hydroxyethyl acrylate |
| 08/12/1986 | US4605533 Lead frame coated with aluminum as a packaging material in integrated circuits |
| 08/12/1986 | US4605532 Copper alloys having an improved combination of strength and conductivity |
| 08/12/1986 | US4605277 Connector and method of making |
| 08/12/1986 | US4605058 Heat dissipating retainer for electronic package |
| 08/12/1986 | CA1209725A1 Integrated circuit mounting apparatus |
| 08/12/1986 | CA1209721A2 Plastic encapsulated semiconductor device and lead frame therefor |
| 08/12/1986 | CA1209720A1 System for packaging of electronic circuits |
| 08/12/1986 | CA1209719A1 Low-stress-inducing omnidirectional heat sink |
| 08/12/1986 | CA1209716A1 Semiconductor component and method of manufacture |
| 08/12/1986 | CA1209654A1 Seal on wiring inlet for canned semi-conductor package |
| 08/06/1986 | EP0190077A2 A package structure for a semiconductor chip |
| 08/06/1986 | EP0190070A2 Semiconductor structure |
| 08/06/1986 | EP0189745A1 Lead material for ceramic package IC |
| 08/06/1986 | EP0189598A1 Method for manufacturing a semiconductor device |
| 08/05/1986 | US4604678 Circuit board with high density electrical tracers |
| 08/05/1986 | US4604677 Ceramic structural body and a method of manufacturing the same |
| 08/05/1986 | US4604643 Semiconductor rectifier device |
| 08/05/1986 | US4604642 Fe-Ni-Cu leadframe |
| 08/05/1986 | US4604641 Semiconductor device and method for manufacturing the same |
| 08/05/1986 | US4604639 Semiconductor memory device |
| 08/05/1986 | US4604495 Semiconductor device and process for producing same |
| 08/05/1986 | US4604435 Thermosetting epoxy resin compositions |
| 08/05/1986 | US4604291 Method for manufacture of aluminum-coated lead frame |
| 08/05/1986 | US4603897 Vacuum pickup apparatus |
| 08/05/1986 | US4603804 Automatic soldering apparatus |
| 08/05/1986 | US4603473 Method of fabricating integrated semiconductor circuit |
| 08/05/1986 | CA1209281A1 Multi-level aluminum metallization structure for semiconductor device |
| 08/05/1986 | CA1209279A1 Clip-fastening of a solid state device to a heatsink |
| 08/05/1986 | CA1209235A1 Base for a semiconductor laser and its production process |
| 08/05/1986 | CA1209220A1 Compliant pin for solderless termination to a printed wiring board |
| 07/30/1986 | EP0188838A1 Housing for an electronic component |
| 07/30/1986 | EP0036867B1 Double cavity semiconductor chip carrier |
| 07/29/1986 | US4603374 Packaging module for a semiconductor wafer |
| 07/29/1986 | US4603345 Module construction for semiconductor chip |
| 07/29/1986 | US4603344 Semiconductor assembly |
| 07/29/1986 | US4603180 Thermosetting resin composition |
| 07/29/1986 | US4602678 Interfacing of heat sinks with electrical devices, and the like |
| 07/29/1986 | US4602420 Method of manufacturing a semiconductor device |
| 07/29/1986 | CA1208809A1 Method for electrical connections to silicon and an improved semiconductor device |
| 07/24/1986 | EP0105324A4 OHMIC CONTACT FOR N-TYPE GaAs. |
| 07/23/1986 | EP0187968A2 Adhesion characterization test site |
| 07/23/1986 | EP0187767A1 Integrated circuit having buried oxide isolation and low resistivity substrate for power supply interconnection |
| 07/23/1986 | EP0120918A4 An aluminum-metal silicide interconnect structure for integrated circuits and method of manufacture thereof. |
| 07/22/1986 | US4602318 Substrates to interconnect electronic components |
| 07/22/1986 | US4602271 Personalizable masterslice substrate for semiconductor chips |
| 07/22/1986 | US4602270 Gate array with reduced isolation |
| 07/22/1986 | US4602125 Mounting pad with tubular projections for solid-state devices |
| 07/22/1986 | US4601972 Hybrid integrated circuits, acrylate |
| 07/22/1986 | US4601958 Plated parts and their production |
| 07/22/1986 | US4601939 Semiconductors |
| 07/22/1986 | US4601331 Multiple heat pipes for linear beam tubes having common coolant and vaporizing surface area enhancement |
| 07/22/1986 | US4601096 Method for fabricating buried channel field effect transistor for microwave and millimeter frequencies utilizing molecular beam epitaxy |
| 07/17/1986 | WO1986004079A1 Compositions of poly(imides) having phenylindane diamines and/or dianhydride moieties in the poly(imide) backbone |
| 07/16/1986 | EP0187706A2 A method of coating an organic substrate with a metal |