| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/16/1986 | EP0187580A1 Housing for a high-frequency power component cooled by circulation of water |
| 07/16/1986 | EP0187464A1 Leadless chip carrier adapter |
| 07/15/1986 | USRE32207 Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide |
| 07/15/1986 | US4600960 Four terminal pulse suppressor |
| 07/15/1986 | US4600907 Coplanar microstrap waveguide interconnector and method of interconnection |
| 07/15/1986 | US4600658 Bonding pads, semiconductors, dielectriecs silicon, adhesion, multilayer, barriers, intermetallics |
| 07/15/1986 | US4600624 Composite insulator structure |
| 07/15/1986 | US4600611 Film carrier for manufacturing semiconductor devices |
| 07/15/1986 | US4600600 Method for the galvanic manufacture of metallic bump-like lead contacts |
| 07/15/1986 | US4599792 Buried field shield for an integrated circuit |
| 07/15/1986 | US4599791 Aluminum, gallium, arsenide, dopes |
| 07/15/1986 | CA1207917A1 Semiconductor package |
| 07/15/1986 | CA1207880A1 Flex-pack interconnection apparatus |
| 07/09/1986 | EP0186829A2 Method and metallic material for joining component parts together |
| 07/09/1986 | EP0186818A2 Chip to pin interconnect method |
| 07/09/1986 | EP0186769A2 Integrated circuit chip structure with wiringnet capacitive load compensation |
| 07/09/1986 | EP0186720A1 Multifunction prediffused CMOS array |
| 07/09/1986 | EP0186667A1 Mounting semi-conductor chips. |
| 07/09/1986 | CN85108637A Electronic circuit device and method of producing the same |
| 07/08/1986 | US4599639 Semiconductor device |
| 07/08/1986 | US4599636 Two terminal axial lead suppressor and diode bridge device |
| 07/08/1986 | US4598473 For minimizing the occurance of bent leads of an electric component |
| 07/08/1986 | US4598462 Method for making semiconductor device with integral fuse |
| 07/08/1986 | CA1207469A1 Method of producing mos transistors |
| 07/08/1986 | CA1207468A1 Intergrated semiconductor circuits with contact interconnect levels comprised of an aluminum/silicon alloy |
| 07/08/1986 | CA1207464A1 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
| 07/08/1986 | CA1207420A1 Display device |
| 07/08/1986 | CA1207381A1 Integrated alternator bridge heat sink |
| 07/08/1986 | CA1207173A1 Hermetic sealing of gallium arsenide components |
| 07/02/1986 | EP0186585A2 Die bonding process |
| 07/02/1986 | EP0186411A2 Semiconductor device in which a semiconductor chip is fixed to a base |
| 07/02/1986 | EP0186099A2 Crosslinkable organopolysiloxanes, process for their preparation and use of these organopolysiloxanes |
| 07/02/1986 | EP0185995A2 Programmable semiconductor switch for a light influencing display and method of making same |
| 07/02/1986 | EP0185787A1 Plastic encapsulated semiconductor component |
| 07/02/1986 | EP0185708A1 Zif socket for chip carriers |
| 07/02/1986 | CA1207088A Transient absorption semiconductor device |
| 07/02/1986 | CA1206819A Resin-molded semiconductor device and a process for manufacturing the same |
| 07/01/1986 | US4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
| 07/01/1986 | US4598307 Integrated circuit device having package with bypass capacitor |
| 07/01/1986 | US4598167 Multilayered ceramic circuit board |
| 07/01/1986 | US4597825 Intermediate passivation and cleaning of compound semiconductor surfaces |
| 07/01/1986 | US4597617 Pressure interconnect package for integrated circuits |
| 07/01/1986 | US4597163 Method of improving film adhesion between metallic silicide and polysilicon in thin film integrated circuit structures |
| 06/25/1986 | EP0185326A2 Method and tool for individual pin exchange in a dense array of connector pins of an electronic packaging structure |
| 06/25/1986 | EP0185244A1 Electrical power component |
| 06/24/1986 | US4596353 Lead tinning system |
| 06/24/1986 | US4596070 Interdigitated IMPATT devices |
| 06/24/1986 | US4596069 Three dimensional processing for monolithic IMPATTs |
| 06/24/1986 | CA1206549A1 Module mounting assembly |
| 06/19/1986 | WO1986003622A1 Process for fabricating multi-level-metal integrated circuits at high yields |
| 06/18/1986 | EP0184849A1 Pick-up device for electronic components |
| 06/18/1986 | EP0184608A2 Process for the manufacture of mechanically separable multiconnectors for the electrical connection of micro-electronic components, and multiconnectors manufactured by this process |
| 06/17/1986 | US4595945 Plastic package with lead frame crossunder |
| 06/17/1986 | US4595647 Method for encapsulating and marking electronic devices |
| 06/17/1986 | US4595603 Method of making diamond heatsink assemblies |
| 06/17/1986 | US4595480 Transport means for magazine and lead frames |
| 06/17/1986 | US4595471 Composition contains organic titanium or tin compounds |
| 06/17/1986 | US4595096 Integrated circuit chip carrier |
| 06/17/1986 | US4594862 Heat transfer arrangement |
| 06/17/1986 | US4594770 Method of making semiconductor casing |
| 06/17/1986 | CA1206276A1 Integrated circuit carrier and assembly |
| 06/17/1986 | CA1206275A1 Pre-matched module for an ultra-high frequency diode and a process for forming the biasing connection for the diode |
| 06/17/1986 | CA1206272A1 Leadless chip carrier for logic components |
| 06/17/1986 | CA1205976A1 Process for producing antimony trioxide having a low alpha-ray strength |
| 06/11/1986 | EP0184171A2 Device having improved contact metallization |
| 06/11/1986 | EP0184146A1 Boiling/cooling container system for power semiconductor devices |
| 06/11/1986 | EP0183916A1 Leads of a microwave circuit mounted on a substrate |
| 06/11/1986 | EP0183910A2 Process for the manufacture of deformable multiconnectors for the electrical connection of micro-electronic components, and multiconnectors manufactured by this process |
| 06/11/1986 | EP0183724A1 Integrated circuit package. |
| 06/11/1986 | EP0183722A1 High density ic module assembly. |
| 06/10/1986 | US4594643 Device for fixing a cooling member on the cooling surface of an integrated module |
| 06/10/1986 | US4594613 Solid-state imaging device assembly |
| 06/10/1986 | US4594606 Semiconductor device having multilayer wiring structure |
| 06/10/1986 | US4594473 Substrate having at least one fine-wired conductive layer |
| 06/10/1986 | US4594221 Multipurpose copper alloys with moderate conductivity and high strength |
| 06/10/1986 | US4593454 Process for manufacturing an integrated circuit with tantalum silicide connections utilizing self-aligned oxidation |
| 06/10/1986 | CN85109419A 半导体器件 Semiconductor devices |
| 06/10/1986 | CN85104650A Mos rear end processing |
| 06/05/1986 | WO1986003367A1 Device for surface mounting of components |
| 06/05/1986 | WO1986003365A1 Wiring structure of a terminal circuit |
| 06/05/1986 | WO1986003340A1 Semiconductor device provided with a metal layer |
| 06/05/1986 | WO1986003338A1 Apparatus and method for fabricating modules comprising stacked circuit-carrying layers |
| 06/05/1986 | WO1986003337A1 Process for fabricating dimensionally stable interconnect boards and product produced thereby |
| 06/04/1986 | EP0183598A2 A shielded integrated circuit package |
| 06/04/1986 | EP0183517A2 Semiconductor memory device wirings |
| 06/04/1986 | EP0183016A1 Material for a semiconductor device and process for its manufacture |
| 06/04/1986 | EP0182977A1 Method for making studs for interconnecting metallization layers at different levels in semiconductor chip |
| 06/03/1986 | USH73 Integrated circuit packages |
| 06/03/1986 | US4593362 Bay packing method and integrated circuit employing same |
| 06/03/1986 | US4593342 Heat sink assembly for protecting pins of electronic devices |
| 06/03/1986 | US4592944 Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article |
| 06/03/1986 | US4592928 Method and compositions for inhibiting leakage current in silicon diodes |
| 06/03/1986 | US4592802 Method of fabrication of aluminum contacts through a thick insulating layer in an integrated circuit |
| 06/03/1986 | US4592794 Glass bonding method |
| 06/03/1986 | US4592132 Process for fabricating multi-level-metal integrated circuits at high yields |
| 06/03/1986 | US4592131 Method for manufacturing resin-sealed semiconductor device |
| 06/03/1986 | CA1205578A1 Method for manufacturing an integrated circuit device |
| 06/03/1986 | CA1205577A1 Semiconductor device |
| 06/03/1986 | CA1205576A1 Method of manufacturing an integrated circuit device |
| 06/03/1986 | CA1205575A1 Method for manufacturing an integrated circuit device |