Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1985
07/02/1985US4527181 High density semiconductor memory array and method of making same
07/02/1985US4527010 Electronic part mounting construction and method for manufacturing the same
07/02/1985US4526859 Metallization of a ceramic substrate
07/02/1985US4526429 Compliant pin for solderless termination to a printed wiring board
07/02/1985US4526185 Holding apparatus for use in cleaner or dryer for dual pin type electronic parts
07/02/1985CA1189984A1 Contact structure for securing a semiconductor substrate to a mounting body
07/02/1985CA1189982A1 Electrical multilayer contact for microelectronic structure
07/02/1985CA1189748A1 Maskless coating of metallurgical features of a dielectric substrate
07/01/1985EP0069762A4 Universal interconnection substrate.
06/1985
06/26/1985EP0146463A2 Compliant lead frame for surface mount semiconductor packages
06/26/1985EP0146330A2 Integrated circuit device with textured bar pad
06/26/1985EP0146036A2 Method of forming multilayer ceramic substrates from large area green sheets
06/26/1985EP0145955A2 Read only semiconductor memory device and manufacturing method
06/26/1985EP0145927A1 Integrated circuit fet structure
06/26/1985EP0145862A2 Metallization of a ceramic substrate
06/25/1985US4525769 Equipment box for a power converter arrangement
06/25/1985US4525766 Method and apparatus for forming hermetically sealed electrical feedthrough conductors
06/25/1985US4525734 Hydrogen charged thin film conductor
06/25/1985US4525733 Patterning method for reducing hillock density in thin metal films and a structure produced thereby
06/25/1985US4525732 Distributed IMPATT structure
06/25/1985US4525597 Ceramic leadless packages and a process for manufacturing the same
06/25/1985US4525434 Manganese, zinc, nickel, aluminum
06/25/1985US4525422 Copper phosphate protective coatings on copper
06/25/1985US4525383 Method for manufacturing multilayer circuit substrate
06/25/1985US4525297 Polyolefins, carbon particles, foaming and crosslinking,
06/25/1985CA1189636A1 Apparatus for cooling integrated circuit chips
06/25/1985CA1189635A1 Apparatus for cooling integrated circuit chips
06/20/1985WO1985002751A1 Partially aligned multi-layered circuitry
06/20/1985WO1985002715A1 Semiconductor device pad area protection structure
06/19/1985EP0145694A2 Protection device against the perturbations and/or interferences in the vicinity of integrated circuits
06/19/1985EP0145599A2 Alumina interconnection substrate for an electronic component, and method for its production
06/19/1985EP0145595A2 Integrated circuit device
06/19/1985EP0145327A2 Electrical interface arrangement
06/19/1985EP0145256A1 Darlington transistor pair units
06/19/1985EP0145036A1 A semidonductor device having an interconnection structure
06/19/1985EP0145033A1 Semiconductor device having an interdigital electrode configuration and its manufacture
06/19/1985EP0144909A2 Integrated power switching semiconductor devices including IGT and MOSFET structures
06/19/1985EP0144887A2 Semiconductor component having metallic bump contacts and multilayer interconnection
06/19/1985EP0144866A2 Semiconductor device comprising a substrate
06/19/1985EP0144826A2 Thixotropic curable coating compositions
06/19/1985EP0144680A1 IC device and a system for testing the same
06/19/1985EP0144661A2 Method for forming a film of a polyimide dielectric material on an electronic component and the resulting component
06/19/1985EP0144579A2 Cooling body for the liquid cooling of power semiconductor devices
06/19/1985EP0144343A1 Integrated circuit module and method of making same
06/18/1985US4524378 Anodizable metallic contacts to mercury cadmium telleride
06/18/1985US4524377 Integrated circuit
06/18/1985US4524280 Method for detecting displacement of semiconductor device
06/18/1985US4524238 Semiconductor packages
06/18/1985US4523975 Forming metal conductor, then dielectric layer, polymerizing negative isoprene resist, plasma etching and forming second dielectric layer
06/18/1985US4523372 Multilayer
06/18/1985US4523371 Method of fabricating a resin mold type semiconductor device
06/18/1985CA1189196A1 Process for the manufacture of substrates to interconnect electronic components and articles made by said process
06/12/1985EP0144208A1 A protecting circuit for a semiconductor device
06/12/1985EP0144071A2 Liquid cooling type high frequency solid state device arrangement
06/12/1985EP0143963A2 Electronic components comprising cured vinyl and/or acetylene terminated copolymers and methods for forming the same
06/12/1985EP0143887A2 Distributed impatt structure
06/11/1985US4523219 Semiconductor component with pressure contact
06/11/1985US4523218 Lead frame for integrated circuits and method of fabricating the same
06/11/1985US4523216 CMOS device with high density wiring layout
06/11/1985US4522893 Contact device for releasably connecting electrical components
06/11/1985US4522656 Controlled melting and vaporization to produce pattern
06/11/1985CA1188805A1 Identification card with integrated circuit
06/10/1985EP0086812A4 Improved glass bonding means and method.
06/06/1985WO1985002515A1 Printed-circuit board for mounting electronic element and method of manufacture thereof
06/06/1985WO1985002496A1 METHOD OF FABRICATING AlGaAs SEMICONDUCTOR DEVICES HAVING HIGH AND LOW RESISTIVITY REGIONS
06/05/1985EP0143700A2 Process for making integrated circuits having connectors comprising tantalum silicides, and integrated circuits made by this process
06/05/1985EP0143652A2 Process for forming multi-layer interconnections
06/05/1985EP0143607A2 Semiconductor package
06/05/1985EP0143493A2 Programmable thick film networks and method for making same
06/05/1985EP0143441A2 Lead frame and the method of manufacturing the same
06/05/1985EP0143262A1 Device for attaching a cooling member to an integrated component
06/05/1985EP0143244A2 Contact electrode for power semiconductor components
06/04/1985US4521829 Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards
06/04/1985US4521828 Component module for piggyback mounting on a circuit package having dual-in-line leads
06/04/1985US4521827 Heat sink mounting
06/04/1985US4521801 Semiconductor device with composite lead wire
06/04/1985US4521799 Crossunder within an active device
06/04/1985US4521794 Electrode and semiconductor device provided with the electrode
06/04/1985US4521727 Hall effect circuit with temperature compensation
06/04/1985US4521476 Hybrid integrated circuit and preparation thereof
06/04/1985US4521469 Copper plastic laminates
06/04/1985US4521449 Process for forming a high density metallurgy system on a substrate and structure thereof
06/04/1985US4521448 Method of manufacturing semiconductor device
06/04/1985US4521170 Power semiconductor component for liquid cooling
06/04/1985US4520647 Surface finishing process
06/04/1985US4520561 Method of fabricating an electronic circuit including an aperture through the substrate thereof
06/04/1985US4520554 Sintering together two aluimun-silicon layers
06/04/1985CA1188426A1 Identification of repaired integrated circuits
05/1985
05/29/1985EP0142938A1 Semiconductor integrated circuit including a lead frame chip support
05/29/1985EP0142825A2 Silicone rubber as modifier for Poly(Arylene Sulfide)
05/29/1985EP0142678A2 Semiconductor rectifier
05/28/1985US4520461 Integrated high voltage distribution and control systems
05/28/1985US4520384 Power semiconductor component for cooling by boiling or liquids
05/28/1985US4520383 Power semiconductor component for boiling cooling
05/28/1985US4520041 Flowable polymer forms flat surface; ion etched to expose second insulating layer
05/28/1985US4519851 Method for providing pinhole free dielectric layers
05/28/1985US4519850 -molten metal layer; themperature gradient
05/28/1985US4519660 Electrical connectors with quasi-terminal pins
05/28/1985US4519447 System for temperature maintenance
05/28/1985CA1188010A1 Package for a semiconductor chip
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