| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/29/1987 | EP0219659A1 Method for making an adhesion contact |
| 04/29/1987 | EP0219641A1 Integrated circuit comprising bipolar and complementary MOS transistors on a common substrate, and method of making the same |
| 04/29/1987 | EP0219627A1 Multilayer printed-circuit board |
| 04/29/1987 | EP0034166B1 Semiconductor embedded layer technology |
| 04/28/1987 | US4661887 Surface mountable integrated circuit packages having solder bearing leads |
| 04/28/1987 | US4661886 Magnetically sealed multichip integrated circuit package |
| 04/28/1987 | US4661837 Resin-sealed radiation shield for a semiconductor device |
| 04/28/1987 | US4661836 Fabricating integrated circuits |
| 04/28/1987 | US4661835 Semiconductor structure and method of its manufacture |
| 04/28/1987 | US4661834 Semiconductor structures and manufacturing methods |
| 04/28/1987 | US4661815 Gate array integrated device having mixed single column type and matrix type arrays |
| 04/28/1987 | US4661771 Method of screening resin-sealed semiconductor devices |
| 04/28/1987 | US4661653 Package assembly for semiconductor device |
| 04/28/1987 | US4661409 Using alternating electromagnetic field to activate hydrocarbon plasma; silicone adhesion |
| 04/28/1987 | US4661375 Method for increasing the height of solder bumps |
| 04/28/1987 | US4661214 Method and apparatus for electrically disconnecting conductors |
| 04/28/1987 | US4661204 Method for forming vertical interconnects in polyimide insulating layers |
| 04/28/1987 | EP0130207A4 Semiconductor chip package. |
| 04/23/1987 | WO1987002544A1 Transparent, electrostatic protective container with readily accessible identification means |
| 04/23/1987 | WO1987002333A1 Antistatic sheet material, package, and method of making |
| 04/23/1987 | DE3635154A1 Device having a semiconductor component mounted on a substrate |
| 04/22/1987 | EP0219408A1 Process and device for welding elements on the corresponding spots of a substrate, such as a high-density integrated-circuit substrate |
| 04/22/1987 | EP0219361A1 Miniaturized connection device for electrically conductive elements submitted to very high intensities |
| 04/22/1987 | EP0219346A2 Method for producing a poly emitter logic array, and device produced thereby |
| 04/22/1987 | EP0219315A2 Antistatic sheet material, package, and method of making |
| 04/22/1987 | EP0219285A2 Assembly of a substrate, an electrical device and a terminal |
| 04/22/1987 | EP0218852A1 Integrated circuit having NC pins, and method for its operation |
| 04/22/1987 | EP0218849A1 Support tape for a film-mounted circuit |
| 04/22/1987 | EP0218796A2 Semiconductor device comprising a plug-in-type package |
| 04/22/1987 | EP0218685A1 Electrostatic discharge input protection network. |
| 04/22/1987 | CN86106553A Electric component part having lead terminals |
| 04/22/1987 | CN86106280A Hermetically sealed electronic component |
| 04/21/1987 | US4660123 Appliance for releasable fastening of a cooling member to an integrated module |
| 04/21/1987 | US4660069 Device with captivate chip capacitor devices and method of making the same |
| 04/21/1987 | US4660067 Complementary MOS integrated circuit having means for preventing latch-up phenomenon |
| 04/21/1987 | US4659931 High density multi-layered integrated circuit package |
| 04/21/1987 | US4659611 Circuit substrate having high thermal conductivity |
| 04/21/1987 | US4659404 Method of making low thermal expansivity and high thermal conductivity substrate |
| 04/21/1987 | US4659378 Thin layer alloy of cobalt, iron, and germanium |
| 04/15/1987 | EP0218526A1 Heat dissipation arrangement for semiconductor power elements |
| 04/15/1987 | EP0218495A2 Chip carrier mounting apparatus |
| 04/15/1987 | EP0218438A2 Apparatus for mounting a semiconductor chip and making electrical connections thereto |
| 04/15/1987 | EP0218437A2 A microelectronics apparatus and method of interconnecting wiring planes |
| 04/15/1987 | EP0218117A2 Cyclosilazane polymers as dielectric films in integrated circuit fabrication technology |
| 04/14/1987 | US4658330 Mounting a hybrid circuit to a circuit board |
| 04/14/1987 | US4658151 Battery-supported integrated switching element |
| 04/14/1987 | US4657797 Metal layer confined by wrapping; dimensional stability |
| 04/14/1987 | US4657778 Electroless deposition of a copper seed layer, resist layer, copper electroplated, screen printed then air fired dielectric |
| 04/14/1987 | US4657172 Apparatus and method of solder coating integrated circuit leads |
| 04/14/1987 | US4656732 Integrated circuit fabrication process |
| 04/14/1987 | CA1220563A1 Semiconductor superlattice with controlled plasmon dispersion |
| 04/14/1987 | CA1220562A1 Pattern recessed by anisotropic reactive ion etching and dense multilayer metallization integrated circuits produced thereby |
| 04/14/1987 | CA1220561A1 Semiconductor device |
| 04/09/1987 | WO1987002181A1 Magnetically sealed multichip integrated circuit package |
| 04/08/1987 | EP0217676A2 Cooling system for electronic circuit device |
| 04/08/1987 | EP0217584A2 Highly thermoconductive ceramic substrate |
| 04/08/1987 | EP0217471A1 Semiconductor power device for surface mounting |
| 04/08/1987 | EP0217176A2 Composite material and method of manufacturing it |
| 04/08/1987 | EP0217118A2 Method for automatically separating useful and disturbing information into microscopic images, especially of wafer surfaces, for the automatic recognition of wafer identification marks |
| 04/08/1987 | EP0217082A1 Lead frame and method for producing an electronic element having such a lead frame |
| 04/08/1987 | EP0217063A1 Optical device |
| 04/07/1987 | USH260 Metallization for hermetic sealing of ceramic modules |
| 04/07/1987 | US4656499 Hermetically sealed semiconductor casing |
| 04/07/1987 | US4656491 Protection circuit utilizing distributed transistors and resistors |
| 04/07/1987 | US4656370 Integrated circuit with divided power supply wiring |
| 04/07/1987 | US4656101 Electronic device with a protective film |
| 04/07/1987 | US4656055 Double level metal edge seal for a semiconductor device |
| 04/07/1987 | US4656050 Polyimides |
| 04/07/1987 | US4654966 Method of making a dimensionally stable semiconductor device |
| 04/02/1987 | DE3534600A1 Integrated circuit with electric conductor tracks and method for producing it |
| 04/02/1987 | DE3533629A1 Gate array |
| 04/02/1987 | DE3528427A1 Electrical connecting tab for semiconductor components |
| 04/01/1987 | EP0216699A1 Hyperfrequency circuit with a low parasitic capacitance |
| 04/01/1987 | EP0216581A2 Via profiling in integrated circuits |
| 04/01/1987 | EP0216447A2 Mounting a hybrid circuit to a circuit board |
| 04/01/1987 | EP0216363A2 Electric component part having lead terminals |
| 04/01/1987 | EP0216352A2 Semiconductor element sealing structure |
| 04/01/1987 | EP0216286A2 Substrate for integrated components |
| 04/01/1987 | EP0216090A1 Housing for a heat-radiating circuit component in operation |
| 04/01/1987 | EP0216017A2 Method of manufacturing a semiconductor device including forming a multi-level interconnection layer |
| 03/31/1987 | US4654754 Thermal link |
| 03/31/1987 | US4654752 Terminal assembly and method of making terminal assembly |
| 03/31/1987 | US4654694 Electronic component box supplied with a capacitor |
| 03/31/1987 | US4654692 Semiconductor device of resin-seal type |
| 03/31/1987 | US4654690 Capacitive elements with reduced stray capacitance |
| 03/31/1987 | US4654689 Structure of power supply wirings in semiconductor integrated circuit |
| 03/31/1987 | US4654688 Semiconductor device having a transistor with increased current amplification factor |
| 03/31/1987 | US4654472 Electronic component package with multiconductive base forms for multichannel mounting |
| 03/31/1987 | US4654290 Laser markable molding compound, method of use and device therefrom |
| 03/31/1987 | US4654269 Spun glass layer |
| 03/31/1987 | US4654225 Laser printable polyarylene sulfide compositions process for encapsulating articles with optional laser printing |
| 03/31/1987 | US4654113 Process for fabricating a semiconductor device |
| 03/31/1987 | US4653579 Boiling cooling apparatus |
| 03/31/1987 | US4653175 Semiconductor structure having alpha particle resistant film and method of making the same |
| 03/31/1987 | CA1219964A1 Ic card and method for manufacturing the same |
| 03/26/1987 | WO1987001899A1 Static charge protector for integrated circuits |
| 03/26/1987 | WO1987001867A1 Multi-cell transistor |
| 03/26/1987 | WO1987001866A1 Semiconductor device |
| 03/25/1987 | EP0215667A2 Vent hole assembly |
| 03/25/1987 | EP0215602A2 Connection of electric component and heat sink therefor |