Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1985
05/28/1985CA1188007A1 Method for producing integrated mos field effect transistors with an additional track level of metal silicides
05/28/1985CA1187674A1 Cast solder leads for leadless semiconductor circuits
05/22/1985EP0142447A2 Semiconductor package
05/22/1985EP0142282A2 A method of making diamond heatsink assemblies
05/22/1985EP0142186A2 Method of manufacturing a pattern of conductive material
05/22/1985EP0142149A2 Use of fluorine containing polyimides for aligning layers of liquid crystal display devices.
05/22/1985EP0141990A1 Device for detachably attaching a cooling member to an integrated component
05/21/1985US4519050 Radiation shield for an integrated circuit memory with redundant elements
05/21/1985US4518983 Assembly-heat sink for semiconductor devices
05/21/1985US4518982 High current package with multi-level leads
05/21/1985US4518981 Multilayer structure containing dielectric and silicon layers
05/21/1985US4518818 Encapsulating case able to resist high external pressures
05/21/1985US4518636 Selective plating
05/21/1985US4518631 Epoxide and organosilicon reactants
05/21/1985US4518112 Process for controlled braze joining of electronic packaging elements
05/21/1985US4517738 Method for packaging electronic parts
05/21/1985US4517731 Double polysilicon process for fabricating CMOS integrated circuits
05/21/1985US4517729 Method for fabricating MOS device with self-aligned contacts
05/21/1985CA1187625A1 Tape automated bonding for integrated circuits
05/21/1985CA1187321A1 Laser printable polyarylene sulfide compositions
05/15/1985EP0141526A1 Ceramic with anisotropic heat conduction
05/15/1985EP0141274A2 I2L circuit
05/15/1985EP0141262A1 Device for attaching a cooling member to the cooling face of an integrated component
05/15/1985EP0141179A2 Combined circuit with varistor
05/14/1985US4517624 Device for cooling a plurality of integrated modules combined on a flexible printed circuitboard to form logic cards
05/14/1985US4517585 Heat sink for semi-conductor devices having terminals projecting from a heat sink transfer face
05/14/1985US4517584 Ceramic packaged semiconductor device
05/14/1985US4517583 Semiconductor integrated circuit including a fuse element
05/14/1985US4517225 Method for manufacturing an electrical interconnection by selective tungsten deposition
05/14/1985US4517051 Multi-layer flexible film module
05/14/1985CA1187208A1 Thermal conduction element for semiconductor devices
05/09/1985WO1985002087A1 Semiconductor package with internal heat exchanger
05/09/1985WO1985002046A1 Data medium provided with an integrated circuit and manufacturing process thereof
05/08/1985EP0140619A2 Anisotropic-electroconductive adhesive film and circuit connecting method using the same
05/08/1985EP0140600A2 Improvements in diamond heatsink assemblies
05/08/1985EP0140584A1 Master-slice-type semiconductor integrated circuit device
05/08/1985EP0140554A1 Diamond heatsink assemblies
05/08/1985EP0140230A1 Integrated circuit record carrier and process for making the same
05/08/1985EP0140119A2 Method of making a chip cooling device
05/08/1985EP0139924A2 Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
05/07/1985US4516149 Semiconductor device having ribbon electrode structure and method for fabricating the same
05/07/1985US4516071 Split-cross-bridge resistor for testing for proper fabrication of integrated circuits
05/07/1985US4515898 Glass bonding means and method
05/07/1985US4515668 Dopes, sputtering, semiconductors
05/07/1985US4515425 IC socket with IC package pressing means
05/07/1985US4515269 Magazine for electronic devices
05/02/1985EP0139549A1 Method for aligning a connecting line above an electrical contact hole of an integrated circuit
05/02/1985EP0139528A2 Lead member and method for fixing thereof
05/02/1985EP0139517A2 Improvements in or relating to diamond heatsink assemblies
05/02/1985EP0139431A2 Method of mounting a carrier for a microelectronic silicon chip
05/02/1985EP0139364A2 Multiple path signal distribution to large scale integration chips
05/02/1985EP0139334A2 Semiconductor-glass support structure and devices provided with such a structure
05/02/1985EP0139205A2 Method of producing semiconductor components having a metal substrate
05/02/1985EP0139029A1 Improved semiconductor package
04/1985
04/30/1985US4514785 Method of manufacturing an identification card and an identification manufactured, by this method
04/30/1985US4514752 Displacement compensating module
04/30/1985US4514751 Compressively stresses titanium metallurgy for contacting passivated semiconductor devices
04/30/1985US4514750 Integrated circuit package having interconnected leads adjacent the package ends
04/30/1985US4514749 VLSI Chip with ground shielding
04/30/1985US4514646 Semiconductor integrated circuit device including a protective resistor arrangement for output transistors
04/30/1985US4514588 Encapsulated electronic components and encapsulation compositions
04/30/1985US4514587 High power semiconductor package
04/30/1985US4514321 Thick film conductor compositions
04/30/1985US4514028 CRT updated method and apparatus for identifying integrated circuit pins
04/30/1985US4513905 Nitride barrier layer to improve conductor bonding
04/30/1985CA1186419A1 Semiconductor device comprising a field effect transistor
04/30/1985CA1186418A1 Electrostatic discharge protected integrated circuit module
04/25/1985WO1985001835A1 Semiconductor integrated circuit including a lead frame chip support
04/25/1985EP0074378A4 Semiconductor device including plateless package.
04/25/1985EP0070862A4 Button rectifier package for non-planar die.
04/24/1985EP0138650A1 Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients
04/24/1985EP0138048A2 Press-packed semiconductor device
04/23/1985US4513355 Metallization and bonding means and method for VLSI packages
04/23/1985US4513351 Electronic assembly with forced convection cooling
04/23/1985US4513346 Means to improve the dielectric performance of an insulative conduit with a flow of liquid dielectric coolant therein
04/23/1985US4513310 Semiconductor device capable of structural selection
04/23/1985US4513062 Ceramic body having a metallized layer
04/23/1985US4512950 High adhesive strength and wettability
04/23/1985CA1186071A1 Power semiconductor device
04/23/1985CA1186070A1 Laser activated polysilicon connections for redundancy
04/23/1985CA1185920A1 Electrolytic water elimination in electronic device using hygroscopic insulator
04/17/1985EP0137684A2 Surface finishing process
04/17/1985EP0137554A2 Method of manufacturing a semiconductor device and semiconductor device manufactured by the use of such a method
04/17/1985EP0137385A1 Integrated circuit package (1111111)
04/17/1985EP0137349A2 Dual-in-line connector assembly
04/16/1985US4511914 Power bus routing for providing noise isolation in gate arrays
04/16/1985US4511911 Dense dynamic memory cell structure and process
04/16/1985US4511705 Polyamideacid from a diaminosiloxane
04/16/1985US4511445 Process of enhancing conductivity of material
04/16/1985US4510678 Method for manufacturing a monolithically integrable circuit with a multilayer wiring structure
04/16/1985US4510677 Cases with flat terminal lugs for medium power semi-conductor components and a process for manufacturing same
04/16/1985US4510673 Method of producing a semiconductor device
04/10/1985EP0136888A1 Large scale integration circuitry
04/10/1985EP0136872A2 Stabiliser optical source
04/10/1985EP0136408A1 Synthetic diamond heat sink
04/10/1985EP0136350A1 Inverted polycide sandwich structure and method
04/09/1985US4510519 Electrically isolated semiconductor power device
04/09/1985US4510283 Silicone-type coating resin solution
04/09/1985US4510195 Electronic elements or solar cells
04/09/1985US4509839 Heat dissipator for semiconductor devices
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