H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/1987
01/06/1987	US4633573 Microcircuit package and sealing method
01/02/1987	DE3523061A1 Semiconductor chip arrangement
12/1986
12/30/1986	US4633371 Heat pipe heat exchanger for large scale integrated circuits
12/30/1986	US4633366 Laminar electrical component with magnesium orthoborate
12/30/1986	US4633291 High-gain semiconductor device with capacitive coupling
12/30/1986	US4633239 Integrated circuit package holder
12/30/1986	US4632884 Cutting off corner
12/30/1986	US4632806 Electroconductivity
12/30/1986	US4632798 Reaction injection molding
12/30/1986	US4632724 Visibility enhancement of first order alignment marks
12/30/1986	US4632294 Process and apparatus for individual pin repair in a dense array of connector pins of an electronic packaging structure
12/30/1986	US4631819 Low stress, tolerance free method for mounting power devices
12/30/1986	US4631805 Ultrasonic bonding copper ribbon between patterned metal and leads to encapsulate semiconductor
12/30/1986	EP0207012A2 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method
12/30/1986	EP0206980A2 Heat sink for semiconductor devices and method for manufacturing the same
12/30/1986	EP0206938A2 Germanosilicate spin-on glasses
12/30/1986	EP0206937A2 Stress relieved intermediate insulating layer for multilayer metalization
12/30/1986	EP0206919A1 Encapsulating resin for thermal marking
12/30/1986	EP0206771A2 Packaged semiconductor device
12/30/1986	EP0206717A2 Coating compositions
12/30/1986	EP0206696A2 Multi-layer semiconductor device
12/30/1986	EP0206650A1 Photoelectric conversion device
12/30/1986	EP0206620A2 Self-heating, self-soldering bus bar
12/30/1986	EP0206481A2 Semiconductor device having a multi-layered wiring
12/30/1986	EP0206444A1 Semiconductor device with interconnection and insulating layers
12/30/1986	EP0206337A2 Multilayer wiring substrate with engineering change pads
12/30/1986	EP0206325A2 Method for fabricating an optical isolator.
12/30/1986	EP0205746A2 Semiconductor power module comprising a ceramic substrate
12/30/1986	EP0205728A2 Arrangement of input-output pins of an integrated circuit package
12/30/1986	EP0205686A1 Die-bonding electroconductive paste
12/30/1986	EP0075588B1 Process for fabricating a self-aligned buried channel and the product thereof
12/30/1986	EP0040629B1 Fine-line solid state device
12/30/1986	EP0026788B1 Semiconductor device
12/23/1986	US4631705 Semiconductor integrated circuit memory device
12/23/1986	US4631636 High density packaging technique for electronic systems
12/23/1986	US4631573 Heat sink structure
12/23/1986	US4631572 Multiple path signal distribution to large scale integration chips
12/23/1986	US4631571 Semiconductor device for use in a large scale integration circuit
12/23/1986	US4631570 Integrated circuit having buried oxide isolation and low resistivity substrate for power supply interconnection
12/23/1986	US4631568 Bipolar transistor construction
12/23/1986	US4631160 Firing fine grain thin ceramic coating to reduce surface defects on a ceramic base
12/23/1986	US4630355 Electric circuits having repairable circuit lines and method of making the same
12/23/1986	US4630343 Flat glass surface
12/23/1986	CA1215799A1 Liquids with reduced spreading tendency
12/23/1986	CA1215788A1 Integrated circuit processing methods
12/18/1986	WO1986007492A1 Lead frame deflashing
12/17/1986	EP0205190A2 Method of producing a resin packaged semiconductor device
12/17/1986	EP0205183A2 Clad sheet and process and apparatus for producing same
12/17/1986	EP0204767A1 Method for fabricating modules comprising stacked circuit-carrying layers.
12/16/1986	US4630174 Circuit package with external circuit board and connection
12/16/1986	US4630172 Semiconductor chip carrier package with a heat sink
12/16/1986	US4630171 Support for a high-speed component, in particular a microwave frequency component, the support including incorporated decoupling members
12/16/1986	US4630096 High density IC module assembly
12/16/1986	US4630095 Packaged semiconductor device structure including getter material for decreasing gas from a protective organic covering
12/16/1986	US4629824 IC package sealing technique
12/16/1986	US4629756 Tetrafluoroethylene copolymer and copper flakes heat resistance; infrared rays
12/16/1986	US4629681 Polyimide insulating layer
12/16/1986	US4629635 Vapor deposition
12/16/1986	US4628990 Cooling equipment for an integrated circuit chip
12/16/1986	US4628590 Method of manufacture of a semiconductor device
12/16/1986	CA1215477A1 Semiconductor device comprising a layer of tungsten between conductive tracks
12/16/1986	CA1215474A1 Semiconductor chip packages having solder layers of enhanced durability
12/16/1986	CA1215458A1 Cooling device, in which converters or rectifiers or other semiconductor components are immersed in boiling liquid
12/10/1986	EP0204631A2 Semiconductor structures having polysiloxane leveling film
12/10/1986	EP0204568A2 Low power circuitry components
12/10/1986	EP0204261A2 Multilayer wiring board and method of manufacturing the same
12/10/1986	EP0204177A1 Connection arrangement for semiconductor integrated circuits
12/10/1986	EP0204102A2 Direct connection of lead frame having flexible, tapered leads and mechanical die support
12/10/1986	EP0204004A1 Wiring structure of a terminal circuit
12/10/1986	CN86103388A Decoupling of plated printed circuit and its constitution
12/09/1986	US4628407 Circuit module with enhanced heat transfer and distribution
12/09/1986	US4628406 Method of packaging integrated circuit chips, and integrated circuit package
12/09/1986	US4628343 Semiconductor integrated circuit device free from mutual interference between circuit blocks formed therein
12/09/1986	US4628339 Polycrystalline silicon Schottky diode array
12/09/1986	US4628338 High melting point metal or silicide contactors
12/09/1986	US4628149 Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
12/09/1986	US4628147 Semiconductor housings
12/09/1986	US4628146 Casing for electrical components, component assemblies or integrated circuits
12/09/1986	US4628016 Group iii metal and group 5 metal intermetallics
12/09/1986	US4627988 Method for applying material to a semiconductor wafer
12/09/1986	US4627960 Copper-based alloy
12/09/1986	US4627678 Electronic package assembly and accessory component therefor
12/09/1986	US4627152 Method of synthesizing a circuit
12/04/1986	WO1986007193A1 Cooled stack of electrically isolated semiconductors
12/04/1986	WO1986007192A1 Integrated semiconductor circuit and method for producing it, and use of such a circuit for providing a flow meter
12/03/1986	EP0203589A2 Method and apparatus for airtightly packaging semiconductor package
12/03/1986	EP0203389A1 Multipurpose copper alloys with moderate conductivity and high strength, and process for manufacturing them
12/03/1986	EP0203225A2 MESFET transistor with air layer between the connections of the gate electrode and the substrate and the respective fabrication process
12/02/1986	US4626960 Semiconductor device having soldered bond between base and cap thereof
12/02/1986	US4626889 Stacked differentially driven transmission line on integrated circuit
12/02/1986	US4626818 Multilayer-alumina substrate, in organic glaze, conductor pattern and second inorganic glaze
12/02/1986	US4626805 Surface mountable microwave IC package
12/02/1986	US4626479 Nickle-boron and nickel-phosphorus interface
12/02/1986	US4626478 Solders, brazes or epoxy as bonding material
12/02/1986	CA1214878A1 Piggyback code switch device
11/1986
11/26/1986	EP0203025A1 Gate array with reduced isolation
11/26/1986	EP0202858A2 A multilayered ceramic wiring circuit board and the method of producing the same
11/26/1986	EP0202704A1 Electrode system for a semiconductor device and method of manufacturing it
11/26/1986	EP0202573A2 CMOS unit cell and method for the automatic layout of such a cell
11/26/1986	EP0202540A1 Electron beam mask

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