Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1985
12/03/1985US4556896 For a semiconductor device
12/03/1985US4556598 Porcelain tape for producing porcelainized metal substrates
12/03/1985US4556145 One piece flatpack chip carrier
12/03/1985CA1197629A1 Semiconductor device with built-up low resistance contact
12/03/1985CA1197627A1 Device enclosure for high density tape bonding
12/03/1985CA1197617A1 Static ram cell
11/1985
11/27/1985EP0162677A2 Method of forming a semiconductor device comprising an optical and an electronic element
11/27/1985EP0162521A2 Package for semiconductor devices
11/27/1985EP0162428A2 Encapsulated electronic circuit device, and method and apparatus for making same
11/27/1985EP0162145A1 Method of melting a fuse using a laser beam
11/26/1985CA1197324A1 Multi-layer circuitry
11/25/1985EP0148927A4 A semiconductor die having undedicated input/output cells.
11/21/1985EP0161983A2 Input protection arrangement for VLSI integrated circuit devices
11/21/1985EP0161981A2 Integrated circuits with several aluminium alloy interconnection levels and method of manufacture
11/21/1985EP0161734A2 Integrated circuit architecture and fabrication method therefor
11/21/1985EP0161282A1 Semiconductor package with internal heat exchanger.
11/21/1985EP0161273A1 Semiconductor integrated circuit including a lead frame chip support
11/21/1985EP0029858B1 Semiconductor device
11/19/1985US4554644 Static RAM cell
11/19/1985US4554643 Electrically erasable programmable MNOS read only memory
11/19/1985US4554575 Low stress leadless chip carrier and method of assembly
11/19/1985US4554574 Rectifier assembly for parallel connection of diodes
11/19/1985US4554573 Glass-sealed ceramic package type semiconductor device
11/19/1985US4554404 Support for lead frame for IC chip carrier
11/19/1985US4554229 Multilayer hybrid integrated circuit
11/13/1985EP0161166A1 Compact combiner consisting of semiconductor devices functioning in the hyperfrequency region
11/13/1985EP0161026A2 Formation of electromigration resistant aluminium alloy conductors
11/13/1985EP0160941A2 High voltage interconnect system for a semiconductor integrated circuit
11/12/1985US4553192 High density planar interconnected integrated circuit package
11/12/1985US4553190 Transparent container for electrostatic sensitive electronic components
11/12/1985US4553050 Transmission line terminator-decoupling capacitor chip for off-chip driver
11/12/1985US4553020 Electronic component package comprising a moisture-retention element
11/12/1985US4552818 Silicone encapsulant containing porphyrin
11/12/1985US4552691 For integrated circuits, silver, copper powder
11/12/1985US4552206 Heat sinks for integrated circuit modules
11/12/1985US4551907 Process for fabricating a semiconductor device
11/11/1985EP0123689A4 Microcircuit package and sealing method.
11/10/1985CN85200309U Sensor for the temperature measurement and control in a wider temperature range
11/06/1985EP0160392A2 Semiconductor memory device having double layered word lines
11/06/1985EP0160222A2 Novel nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices
11/05/1985US4551789 Multilayer ceramic substrates with several metallization planes
11/05/1985US4551788 Multi-chip carrier array
11/05/1985US4551787 Apparatus for use in cooling integrated circuit chips
11/05/1985US4551747 Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation
11/05/1985US4551746 Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
11/05/1985US4551745 Package for semiconductor device
11/05/1985US4551741 Dram with polysi bit lines and added junction capacitance
11/05/1985CA1196428A1 Low temperature melting binary glasses for leveling surfaces of integrated circuits containing isolation grooves
10/1985
10/30/1985EP0159935A2 Method for inhibiting dopant out-diffusion
10/30/1985EP0159928A2 Semiconductor integrated circuit device having fuse-type information storing circuit
10/30/1985EP0159797A2 Thyristor device and process for producing it
10/30/1985EP0159722A2 Heat transfer apparatus
10/30/1985EP0159593A2 Electrical connector and method for making the same
10/30/1985EP0159472A2 Electronic module comprising a substrate, a cap and sealant means
10/30/1985EP0159443A2 Method of forming conductor path
10/30/1985EP0159408A2 Method of manufacturing a semiconductor device comprising resistors
10/30/1985EP0104231A4 A self-positioning heat spreader.
10/29/1985US4550405 Deskew circuit for automatic test equipment
10/29/1985US4550390 Semiconductor memory device
10/29/1985US4550248 Identification card having an IC module
10/29/1985US4549407 Evaporative cooling
10/29/1985CA1196113A1 Contact device for releasably connecting electrical components
10/29/1985CA1196110A1 Thermal conduction element for semiconductor device packages
10/29/1985CA1196109A1 High-frequency circuit device
10/29/1985CA1196034A1 Alumina-based ceramic composition and substrate obtained by means of this composition
10/24/1985WO1985004780A1 Multilayer hybrid integrated circuit
10/23/1985EP0159208A1 Method of manufacturing miniaturized electronic power circuits
10/23/1985EP0159179A2 Improved bipolar transistor construction
10/23/1985EP0158749A1 Semiconducteur device having pressure loaded members
10/22/1985US4549247 Carrier element for IC-modules
10/22/1985US4549200 Repairable multi-level overlay system for semiconductor device
10/22/1985US4549199 Semiconductor device providing a contact structure which can be miniaturized
10/22/1985US4549036 Circular integrated circuit package
10/22/1985US4548451 Pinless connector interposer and method for making the same
10/22/1985CA1195782A1 Lead frame for plastic encapsulated semiconductor device
10/16/1985EP0158550A1 Hyperfrequency semiconductor device with external beam lead connections
10/16/1985EP0158509A2 Lead materials for semiconductor devices
10/16/1985EP0158222A2 Semiconductor integrated circuit having multiple-layered connection
10/16/1985EP0157938A2 Case for electrical components
10/16/1985EP0157936A1 Moulding and coating compositions
10/16/1985EP0082167B1 Semiconductor rectifier
10/15/1985US4547834 Structure for assembling complex electronic circuits
10/15/1985US4547830 Using high melting, low resistance metal wire encapsulated in resin as fuse
10/15/1985US4547795 Leadless chip carrier with frangible shorting bars
10/15/1985US4547625 Forming silica and borosilicate glass into mixture and sintering
10/15/1985US4547624 Method and apparatus for reducing package height for microcircuit packages
10/15/1985US4546535 Small area field effect transistor device and making contact
10/15/1985CA1195437A1 Alignment target for electron-beam write system
10/15/1985CA1195434A1 Chip cooling assembly
10/15/1985CA1195432A1 Protection circuit for integrated circuit devices
10/10/1985WO1985004523A1 Conductive, protective layer for multilayer metallization
10/10/1985WO1985004522A1 Impedance-matched leads
10/10/1985WO1985004521A1 Integrated circuit add-on components
10/10/1985WO1985004520A1 Integrated-circuit leadframe adapted for a simultaneous bonding operation
10/10/1985WO1985004519A1 Nitride bonding layer
10/10/1985WO1985004518A1 Integrated circuits with contact pads in a standard array
10/09/1985EP0157685A1 Corrosion resistant microcircuit package
10/09/1985EP0157590A2 Packaged electronic device
10/09/1985EP0157505A2 High-frequency semiconductor device
10/09/1985EP0157428A2 Semiconductor memory device with low-noise structure
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