Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/1987
07/14/1987US4679310 Method of making improved metal silicide fuse for integrated circuit structure
07/14/1987US4679308 Implanting a gettering agent, ashing
07/14/1987CA1224279A1 Semiconductor device
07/14/1987CA1224278A1 Integrated circuit chip assembly
07/08/1987EP0228320A1 Gate array
07/08/1987EP0228212A2 Integrated circuit device
07/08/1987EP0228200A2 Thermal protective device with bimetal for semiconductor devices and the like
07/08/1987EP0228161A2 Improved metal silicide fuse for integrated circuit structureand method of making same
07/07/1987US4679118 Electronic chip-carrier heat sinks
07/07/1987US4678889 Method of laser trimming in semiconductor wafer
07/07/1987US4678637 Copper-chromium-titanium-silicon alloy and application thereof
07/07/1987US4678432 Heat treatment method
07/07/1987US4678358 Glass compression seals using low temperature glass
07/07/1987US4678266 Use of pnictide films for wave-guiding in opto-electronic devices
07/07/1987US4678114 Semiconductors
07/07/1987US4677741 Method of manufacturing package for high power integrated circuit
07/07/1987US4677735 Method of providing buried contacts for N and P channel devices in an SOI-CMOS process using a single N+polycrystalline silicon layer
07/07/1987CA1223782A1 Process for planarizing a substrate
07/06/1987EP0207981A4 Compositions of poly(imides) having phenylindane diamines and/or dianhydride moieties in the poly(imide) backbone.
07/02/1987WO1987004010A1 Chip interface mesa
07/02/1987WO1987004009A1 Compressive pedestal for microminiature connections
07/02/1987WO1987004008A1 Lead finishing for a surface mount package
07/01/1987EP0227549A2 Semiconductor memory device including read only memory element for storing fixed information
07/01/1987EP0227398A1 Improved electronic circuit microelement and base assembly
07/01/1987EP0227381A1 Semiconductor memory device
07/01/1987EP0227371A1 Ceramic substrates and methods of manufacturing same
07/01/1987EP0226997A2 Liquid crystal display device
06/1987
06/30/1987US4677528 Flexible printed circuit board having integrated circuit die or the like affixed thereto
06/30/1987US4677526 Plastic pin grid array chip carrier
06/30/1987US4677520 Static charge protector for integrated circuits
06/30/1987US4677454 Thyristor with self-centering housing means
06/30/1987US4677254 Process for minimizing distortion in multilayer ceramic substrates and the intermediate unsintered green ceramic substrate produced thereby
06/30/1987US4677031 Increased flexibility; varied copper alloy concentrations
06/30/1987US4676864 Bonding method of semiconductor device
06/30/1987US4676827 Oxygen free copper ally; prevention of damage to bonding pad
06/30/1987US4676571 Leaded chip carrier connector
06/30/1987US4676300 Heat radiation control device
06/30/1987US4675985 Method for manufacturing a semiconductor memory device having a high radiation resistance
06/30/1987CA1223670A1 Integrated circuit chip wiring arrangement providing reduced circuit inductance and controlled voltage gradients
06/25/1987DE3545253A1 Device and method for installing heat-generating components in a housing
06/24/1987EP0226549A1 A monolithic integrated circuit, particularly of either the MOS or CMOS type, and method of manufacturing same
06/24/1987EP0226498A1 Lamelliform electrical connection element for two circuits
06/24/1987EP0226480A1 Method of manufacturing a housing for a microelectronic device with contact pads, and its use in cards containing components
06/24/1987EP0226433A2 High density printed wiring board
06/24/1987EP0226385A1 Rhodium capped gold IC metallization
06/24/1987EP0226316A1 Multilayer wiring substrate
06/24/1987EP0226293A2 Method for producing a buried contact Schottky logic array, and device produced thereby
06/24/1987EP0226208A2 Insulating film for semiconductor, production of the same and liquid composition for producing the same
06/24/1987EP0225919A1 Cooled stack of electrically isolated semiconductors
06/24/1987EP0225889A1 New alloys having high electrical and mechanical performances, fabrication thereof and applications thereof, particularly in the electric, electronic and connectics fields
06/23/1987US4675785 Heat distributing diode mounting assembly
06/23/1987US4675783 Heat pipe heat sink for semiconductor devices
06/23/1987US4675720 Enclosed thyristor valve
06/23/1987US4675718 Diode-containing connector
06/23/1987US4675717 Water-scale-integrated assembly
06/23/1987US4675716 Insulator coating for improved step coverage in VLSI devices
06/23/1987US4675472 Integrated circuit package and seal therefor
06/23/1987US4675243 Ceramic package for semiconductor devices
06/23/1987US4674808 Signal ground planes for tape bonded devices
06/23/1987US4674175 Polymer pellets joining metal grid contactor and integrated c ircuit chips
06/23/1987CA1223328A1 Equipment box for a power converter arrangement
06/23/1987CA1223138A1 Corrosion-resistant aluminum electronic material
06/18/1987WO1987003741A1 Selective deposition process
06/16/1987US4674005 Multiple fastening clip and device for the collective mounting of electronic power components
06/16/1987US4673969 Semiconductor device having multiple conductive layers and the method of manufacturing the semiconductor device
06/16/1987US4673967 Surface mounted system for leaded semiconductor devices
06/16/1987US4673966 Semiconductor integrated circuit
06/16/1987US4673961 Pressurized contact type double gate static induction thyristor
06/16/1987US4673958 Monolithic microwave diodes
06/16/1987US4673904 Micro-coaxial substrate
06/16/1987US4673772 Electronic circuit device and method of producing the same
06/16/1987US4673660 Sintered oxide dielectric body of batium, tin, boron, titanium, silicon and manganese oxides
06/16/1987US4673623 Layered and homogeneous films of aluminum and aluminum/silicon with titanium and tungsten for multilevel interconnects
06/16/1987US4672739 Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
06/16/1987EP0225374A1 Lead frame deflashing.
06/16/1987EP0225333A1 Mini chip carrier slotted array.
06/16/1987CA1223087A1 Cooling body for the liquid cooling of high-power semiconductor components
06/16/1987CA1223085A1 Partially aligned multi-layered circuitry
06/11/1987DE3619226A1 Wiring support
06/11/1987DE3542838A1 Bypass element
06/10/1987EP0225238A1 Cards comprising a component and micromodule with edge contacts
06/10/1987EP0225224A2 After oxide metal alloy process
06/10/1987EP0225108A1 Liquid cooling system for integrated circuit chips
06/10/1987EP0224968A2 Dielectric passivation
06/09/1987US4672422 Semiconductor rectifier unit
06/09/1987US4672421 Semiconductor packaging and method
06/09/1987US4672420 Integrated circuit structure having conductive, protective layer for multilayer metallization to permit reworking
06/09/1987US4672419 Metal gate, interconnect and contact system for VLSI devices
06/09/1987US4672418 Integrated circuit packages
06/09/1987US4672417 Alumina ceramic insulator; high speed switching
06/09/1987US4672358 Surface-mounted power resistors
06/09/1987US4672152 Multilayer ceramic circuit board
06/09/1987US4672151 Package for a microwave semiconductor device
06/09/1987US4671349 Well logging electronics cooling system
06/09/1987US4670970 Method for making a programmable vertical silicide fuse
06/09/1987US4670967 Forming multilayer interconnections for a semiconductor device by vapor phase growth process
06/09/1987CA1222810A1 Heat exchanger for an electronics cabinet
06/03/1987EP0224418A1 A programmable element for a semiconductor integrated circuit chip
06/03/1987EP0224274A2 Semiconductor device with protective means against overheating
06/03/1987EP0224263A2 Interdiffusion resistant Fe-Ni alloys having improved glass sealing
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