| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/19/1987 | EP0233029A2 An improved interconnect tape for use in tape automated bonding |
| 08/19/1987 | EP0232837A2 Plastic molded chip carrier package and method of fabricating the same |
| 08/19/1987 | EP0232767A2 Overglaze paste |
| 08/19/1987 | EP0232533A2 Method for producing an integrated circuit product having a polyimide film interconnection structure and product fabricated thereby |
| 08/19/1987 | EP0232401A1 Hybrid circuit packages |
| 08/18/1987 | US4688152 Molded pin grid array package GPT |
| 08/18/1987 | US4688151 Multilayered interposer board for powering high current chip modules |
| 08/18/1987 | US4688147 Cooling device attached to each surface of electronic parts on a printed-wiring board |
| 08/18/1987 | US4688077 Semiconductor device having radiator |
| 08/18/1987 | US4688075 Semiconductor body |
| 08/18/1987 | US4688070 Semiconductor integrated circuit device |
| 08/18/1987 | US4688064 Dynamic memory cell and method for manufacturing the same |
| 08/18/1987 | US4687949 Signal transmission circuit in a semiconductor integrated circuit |
| 08/18/1987 | US4687633 Lead material for ceramic package IC |
| 08/18/1987 | US4687597 Copper conductor compositions |
| 08/18/1987 | US4687552 Rhodium capped gold IC metallization |
| 08/18/1987 | US4686759 Method of manufacturing a semiconductor device |
| 08/18/1987 | CA1225770A1 Thermosetting epoxy resin compositions |
| 08/13/1987 | WO1987004859A1 Ignition switching device |
| 08/13/1987 | WO1987004855A1 Semiconductor device |
| 08/13/1987 | DE3604313A1 Power semiconductor module |
| 08/13/1987 | DE3604075A1 Packaging of power components |
| 08/13/1987 | DE3604074A1 Zuendschaltgeraet Ignitor |
| 08/13/1987 | DE3603714A1 Heat sink for thermally dissipating electric assemblies |
| 08/12/1987 | EP0232108A2 Process for manufacturing bumped tape for tape automated bonding and the product produced thereby. |
| 08/12/1987 | EP0232098A1 Heat sink for an electronic component |
| 08/12/1987 | EP0232044A2 Integrated circuit chip having a plurality of integrated circuit cells |
| 08/12/1987 | EP0231937A2 An arrangement of a semiconductor device for use in a card |
| 08/12/1987 | EP0231821A2 A semiconductor integrated circuit having wirings for power supply |
| 08/12/1987 | EP0231794A2 Method and apparatus for forming metal silicide/silicon structures |
| 08/12/1987 | EP0231560A1 Microwave component mounting |
| 08/12/1987 | EP0231271A1 Three-level interconnection scheme for integrated circuits |
| 08/12/1987 | CN86206814U Stepped semiconductor radiator |
| 08/11/1987 | US4686637 Apparatus and method for lead integrity determination for dip devices |
| 08/11/1987 | US4686606 Device for cooling integrated circuit chip |
| 08/11/1987 | US4686602 Protective circuit arrangement for protecting semiconductor components |
| 08/11/1987 | US4686559 Topside sealing of integrated circuit device |
| 08/11/1987 | US4686492 Impedance match connection using multiple layers of bond wires |
| 08/11/1987 | US4685998 Conductive bonds top of dielectric layer; microcomputer chip |
| 08/11/1987 | US4685987 Curing and bodning in situ silicone rubber coatings containing thermoconductive particles |
| 08/11/1987 | US4685606 Oxide-free extruded thermal joint |
| 08/11/1987 | US4685211 Method of producing a cooled electronic assembly |
| 08/11/1987 | US4685196 Method for making planar FET having gate, source and drain in the same plane |
| 08/11/1987 | CA1225466A1 Electrical contact in semiconductor devices |
| 08/05/1987 | EP0230689A2 Bipolar semiconductor device with wall spacer and method of making |
| 08/05/1987 | EP0230675A2 Ceramic wiring substrate and process for producing the same |
| 08/05/1987 | EP0230648A2 Method of forming an alignment mark |
| 08/04/1987 | US4685033 Multilayer wiring substrate |
| 08/04/1987 | US4684975 Molded semiconductor package having improved heat dissipation |
| 08/04/1987 | US4684974 Electrode connection structure of flat device |
| 08/04/1987 | US4684973 Semiconductor integrated circuit device having ground connections arranged to eliminate mutual interference between island-disposed electronic circuits |
| 08/04/1987 | US4684884 Universal test circuit for integrated circuit packages |
| 08/04/1987 | US4684763 Hermetically sealable package for electronic component |
| 08/04/1987 | US4684543 Starting mixture for an insulating composition comprising a lead glass, silk-screening ink comprising such a mixture, and the use of said ink for the protection of hybrid microcircuits on ceramic substrates |
| 08/04/1987 | CA1225185A1 Rubbery compounds as modifiers for poly(arylene sulfide) |
| 07/30/1987 | WO1987004566A1 Interconnects for wafer-scale-integrated assembly |
| 07/30/1987 | DE3644243A1 Agent for controlling the incipient etching of tin-lead alloys |
| 07/29/1987 | EP0230154A2 Integrated circuit structures comprising current busses |
| 07/29/1987 | EP0230078A1 Method of encapsulating an electronic component by means of a synthetic resin |
| 07/29/1987 | EP0229850A1 Connection terminals between substrates and method of producing the same |
| 07/28/1987 | US4683489 Common housing for two semi-conductor bodies |
| 07/28/1987 | US4683423 Leadless chip test socket |
| 07/28/1987 | US4683253 Resin molding compound for sealing electronic parts |
| 07/28/1987 | US4683163 Vitreous semiconductor supporting structure and device realized with such a structure |
| 07/28/1987 | US4682651 Segmented heat sink device |
| 07/28/1987 | US4682414 Multi-layer circuitry |
| 07/28/1987 | US4682407 Means and method for stabilizing polycrystalline semiconductor layers |
| 07/23/1987 | DE3601829A1 Large-scale integrated electronic chip |
| 07/23/1987 | DE3601140A1 Device for liquid cooling of an electrical component, especially a semiconductor component |
| 07/22/1987 | EP0229426A1 Method of manufacturing a semiconductor device, in which a metallization with a thick connection electrode is provided on a semiconductor body |
| 07/21/1987 | US4682270 Integrated circuit chip carrier |
| 07/21/1987 | US4682269 Heat dissipation for electronic components on a ceramic substrate |
| 07/21/1987 | US4682208 For radiating heat |
| 07/21/1987 | US4682207 On a printed circuit board |
| 07/21/1987 | US4682204 Fuse element for integrated circuit memory device |
| 07/21/1987 | US4681778 Method and apparatus for making electrical connections utilizing a dielectric-like metal film |
| 07/21/1987 | US4681655 Masking and etching an anodized aluminum support |
| 07/21/1987 | US4681654 Polyimide windows |
| 07/21/1987 | US4681221 Holder for plastic leaded chip carrier |
| 07/21/1987 | CA1224575A1 Heat sink mounting and method of making |
| 07/21/1987 | CA1224445A1 Transparent container for electrostatic sensitive electronic components |
| 07/16/1987 | WO1987004316A1 Ultra high density pad array chip carrier |
| 07/15/1987 | EP0228953A1 Encapsulation housing for an electronic circuit |
| 07/15/1987 | EP0228889A2 Low dielectric constant ceramic plate |
| 07/15/1987 | EP0228869A2 Method of manufacturing an electronic component package |
| 07/15/1987 | EP0228431A1 Device for hardening, by means of inserts, an electrical component to protect it against radiations. |
| 07/15/1987 | CN86107676A Interdiffusion resistant fe-ni alloys having improved glass sealing |
| 07/14/1987 | US4680673 Encapsulated housing for dissipating heat produced by electrical circuits |
| 07/14/1987 | US4680619 Memory cells |
| 07/14/1987 | US4680618 Encapsulating a semiconductor |
| 07/14/1987 | US4680617 Encapsulated electronic circuit device, and method and apparatus for making same |
| 07/14/1987 | US4680613 Low impedance package for integrated circuit die |
| 07/14/1987 | US4680612 Aluminum interconnect layer |
| 07/14/1987 | US4680610 Semiconductor component comprising bump-like, metallic lead contacts and multilayer wiring |
| 07/14/1987 | US4680600 Semiconductor device |
| 07/14/1987 | US4680568 Electrical component having fuse element, and method of using same |
| 07/14/1987 | US4680471 Integrated circuit packaging |
| 07/14/1987 | US4680377 Polyimide prepolymer composition from unsaturated bisimide and diamine containing unreacted reactants |
| 07/14/1987 | US4680075 Thermoplastic plug method of fabricating an integrated circuit package having bonding pads in a stepped cavity |
| 07/14/1987 | US4679871 IC package connector |