H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1987
09/22/1987	US4695867 Monolithically integrated planar semiconductor arrangement
09/22/1987	US4695856 Semiconductor device
09/22/1987	US4695715 Infrared imaging array employing metal tabs as connecting means
09/22/1987	US4695678 Electronic device carrier
09/22/1987	US4695517 Composite layer aluminum nitride base sintered body
09/22/1987	US4695515 Metal cored board and method for manufacturing same
09/22/1987	US4695481 Method of performing plating of an item having fine parts and a support device therefor
09/22/1987	US4695403 Thick film conductor composition
09/22/1987	US4695107 Integrated circuit sockets
09/22/1987	CA1227287A1 Packaging microminiature devices
09/22/1987	CA1227258A1 Dual-in-line connector assembly
09/16/1987	EP0237425A1 Integrated circuit with a modified architecture, and its production process
09/16/1987	EP0237255A2 Curable resin compositions and semiconductor devices coated and sealed with the same
09/16/1987	EP0237083A2 An electric device with an operation indicating lamp
09/16/1987	EP0237047A2 Cermet substrate with glass adhesion component
09/16/1987	EP0236914A2 Fabrication of electronic devices utilizing lithographic techniques
09/16/1987	EP0236739A1 Arrangement exposed to the variations in temperature
09/16/1987	EP0236629A2 Driving circuit of a liquid crystal display device
09/16/1987	EP0236493A1 Microelectronic package.
09/16/1987	EP0236484A1 Static charge protector for integrated circuits
09/16/1987	EP0236410A1 Manufacture of a hybrid electronic or optical device
09/16/1987	EP0236352A1 Multi-cell transistor.
09/15/1987	US4694428 Semiconductor memory
09/15/1987	US4694403 For compensating a signal transmission delay time
09/15/1987	US4694378 Apparatus for cooling integrated circuit chips
09/15/1987	US4694323 Apparatus for vapor-cooling a semiconductor
09/15/1987	US4694322 Press-packed semiconductor device
09/15/1987	US4694320 Semiconductor integrated circuit having multiple-layered connection
09/15/1987	US4694183 Optical isolator fabricated upon a lead frame
09/15/1987	US4694138 Applying polymer and metal to substrate, then heating to decompose polymer and weld metal
09/15/1987	US4693925 Improved step coverage
09/15/1987	US4693780 Electrical isolation and leveling of patterned surfaces
09/15/1987	US4693409 Method for directly bonding ceramic and metal members and laminated body of the same
09/15/1987	US4693303 Liquid cooling module with springy contact elements and an aperture plate slidable thereover
09/15/1987	CA1226967A1 Tape bonding material and structure for electronic circuit fabrication
09/15/1987	CA1226966A1 Integrated circuit chip package
09/11/1987	WO1987005442A1 Semiconductor device and method of fabricating the same
09/11/1987	WO1987005441A1 Semiconductor device and a method of producing the same
09/10/1987	DE3706344A1 Schaltungsblock Circuit block
09/09/1987	EP0236065A2 Liquid cooling system for integrated circuit chips
09/09/1987	EP0236034A2 Selective electroless plating of vias in vlsi devices
09/09/1987	EP0235925A2 Surface-mountable package for encapsulated tap-automated-bonded integrated circuit modules
09/09/1987	EP0235682A2 Aluminium nitride sintered body having conductive metallized layer
09/09/1987	EP0235657A1 Water-cooling device for units slidable into electronic power apparatuses
09/09/1987	EP0235504A1 Method of assembling a high frequency hermetically sealed package for solid state components
09/09/1987	EP0235503A2 hermetic high frequency surface mount microelectronic package
09/09/1987	EP0042420B1 Method for fabricating igfet integrated circuits
09/08/1987	US4692839 Multiple chip interconnection system and package
09/08/1987	US4692791 Monolithic IMPATT with stripline leads
09/08/1987	US4692789 For controlling large current at high speed
09/08/1987	US4692788 Semiconductor device with solder overflow prevention geometry
09/08/1987	US4692787 Small size and reduced current needs improve reliability and ease of programming
09/08/1987	US4692786 Three layers instead of two reduce defects and short-circuiting; very thin silica, nitride then thicker silica layers
09/08/1987	US4692349 Selective electroless plating of vias in VLSI devices
09/08/1987	US4692190 Trimming of metal interconnection layer by selective migration of metal atoms by energy beams
09/08/1987	US4691975 Integrated circuit tester socket
09/08/1987	US4691434 Method of making electrically conductive regions in monolithic semiconductor devices as applied to a semiconductor device
09/08/1987	CA1226619A1 Preset element used to keep in place and to bind semiconductors and heat sinks mounted in alternate positions in a column
09/07/1987	EP0155965A4 Wafer.
09/03/1987	DE3706274A1 Semiconductor component and method of fabricating it
09/03/1987	DE3706251A1 Semiconductor device
09/02/1987	EP0235025A1 Semiconductor component and encapsulation method therefor
09/02/1987	EP0234896A2 Improved micro-electronics devices and methods of manufacturing same
09/02/1987	EP0234487A2 Thin film circuit and method for manufacturing the same
09/02/1987	EP0234276A2 Insulated gate type field effect transistor
09/02/1987	EP0234085A1 Epoxy resin encapsulating composition
09/02/1987	EP0234021A1 Liquid cooling device for an electric component, in particular semiconductor component
09/02/1987	EP0233884A1 Device for surface mounting of components.
09/02/1987	CN87100973A Process for preparing semiconductor device
09/01/1987	US4691287 IC device and a system for testing the same
09/01/1987	US4691265 Semiconductor mounting assembly
09/01/1987	US4691225 Semiconductor device and a method of producing the same
09/01/1987	US4691221 Monolithically integrated bipolar Darlington circuit
09/01/1987	US4691078 Aluminum circuit to be disconnected and method of cutting the same
09/01/1987	US4690999 Molecularly-oriented polyimides based on para-aromatic diamines; films; protective coatings; integrated circuits
09/01/1987	US4690962 Blend of acetylenic oligomer with plasticizer and toughness agents
09/01/1987	US4690778 Electromagnetic shielding material
09/01/1987	US4690730 Oxide-capped titanium silicide formation
09/01/1987	US4690646 IC package connector with contacts of high density
09/01/1987	US4690275 Carrier member for integrated modules
09/01/1987	US4689872 Masking, oxidizing, anisotropic etching and doping give bipolar and field effect transistors
09/01/1987	CA1226374A1 Multilayer wiring substrate
08/1987
08/27/1987	WO1987005183A1 Mounting arrangement for solid state devices
08/27/1987	WO1987005153A1 Lead frame having non-conductive tie-bar for use in integrated circuit packages
08/27/1987	DE3605554A1 Closable heat sink
08/26/1987	EP0233824A2 Microcircuit package
08/26/1987	CN87100572A Ceramic wiring substrate and process for producing same
08/25/1987	US4689720 Thermal link
08/25/1987	US4689659 Temperature controller for semiconductor device
08/25/1987	US4689658 Modular semiconductor device
08/25/1987	US4689657 IC interconnect system using metal as a mask
08/25/1987	US4689654 Logic array chip
08/25/1987	US4689276 Alloy containing active material and inactive material
08/25/1987	US4689270 Composite substrate for printed circuits and printed circuit-substrate combination
08/25/1987	US4689262 Alternate layers of porcelain green sheet material and copper screens
08/25/1987	US4688870 Socket for electronic device
08/25/1987	CA1226072A1 Power semiconductor device with mesa type structure
08/24/1987	EP0136350A4 Inverted polycide sandwich structure and method.
08/19/1987	EP0233103A1 Cooling devices for semiconductors
08/19/1987	EP0233085A2 Ceramic wiring substrate and method of forming it

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