Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1987
10/22/1987WO1987006411A1 Improvements in or relating to integrated circuits
10/21/1987EP0242295A1 X-ray shielded electronic circuit box
10/21/1987EP0241739A1 Method of modifying surfaces and application of the method in forming layered structures
10/21/1987CN87101985A Bonding of microelectronic circuits
10/20/1987US4701781 Pre-testable semiconductor die package
10/20/1987US4701780 Integrated verticle NPN and vertical oxide fuse programmable memory cell
10/20/1987US4701779 Isolation diffusion process monitor
10/20/1987US4701723 Connection construction for electronic component
10/20/1987US4701573 Semiconductor chip housing
10/20/1987US4701561 Separation of aldehydes from ketones via acid-catalyzed cyclotrimerization of the aldehyde
10/20/1987US4701482 Epoxy resin composition for encapsulation of semiconductor devices
10/20/1987US4701427 Sintered silicon carbide ceramic body of high electrical resistivity
10/20/1987US4701363 Process for manufacturing bumped tape for tape automated bonding and the product produced thereby
10/20/1987US4701342 Copolymers from trialkylsilylalkyl methacrylate and halogenated styrene derivatives or halogenated vinyl naphthalene derivatives
10/20/1987US4701236 Integrated circuit chip mounted in film; adhesive with protective layer, varnish covering
10/20/1987US4701134 Electrical connector providing switchable connections between elements
10/20/1987US4700879 Method for manufacturing semiconductor power modules with an insulated contruction
10/20/1987US4700473 Method of making an ultra high density pad array chip carrier
10/20/1987CA1228429A1 Vitreous semiconductor supporting structure and device realized with such a structure
10/15/1987DE3710820A1 Led-anordnung Led arrangement
10/14/1987EP0241290A1 Cooling system for electronic components
10/14/1987EP0241236A2 Cavity package for saw devices and associated electronics
10/14/1987EP0241046A2 Semiconductor device having fuse-type memory element
10/14/1987EP0240807A1 Circuit arrangement for detecting an excess temperature in semiconductor power devices
10/14/1987EP0240746A2 Metal layers for use in electronic circuit interconnection system
10/14/1987EP0240690A1 Thyristor having an adjustable base emitter resistor
10/14/1987EP0240654A1 Copper conductor compositions
10/14/1987EP0133101B1 Interconnection device for the cells of a pre-implanted hyperfrequency integrated circuit
10/13/1987US4700276 Ultra high density pad array chip carrier
10/13/1987US4700273 Circuit assembly with semiconductor expansion matched thermal path
10/13/1987US4700272 Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages
10/13/1987US4700215 Polycide electrodes for integrated circuits
10/13/1987US4700214 Electrical circuitry
10/13/1987US4700212 Semiconductor integrated circuit device of high degree of integration
10/13/1987US4699888 Silver-glass mixture to bond ceramic and semiconductor
10/13/1987US4699871 Methods for developing high speed chip carriers with impedance matching packaging
10/13/1987US4699831 Composite with glass and metal particles; thermal conductivity housings for electronic apparatus
10/13/1987US4699830 Laminated sheet material for packaging electronic components
10/13/1987US4699803 Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers
10/13/1987US4699208 Cooling apparatus for an electrical cabinet of a textile machine
10/13/1987US4698901 Mesa semiconductor device
10/13/1987CA1228173A1 Cooling system for electronic circuit device
10/13/1987CA1228172A1 Leadless chip carrier adapter
10/08/1987WO1987006092A1 Interconnection systems for electrical circuits
10/08/1987WO1987006062A1 Inverted chip carrier
10/08/1987WO1987006059A1 Process for forming a fuse programmable read-only memory device
10/08/1987DE3611346A1 Device for vertical mounting of semiconductor components, especially transistors
10/07/1987EP0240433A2 Single bonding shelf, multi-row, wire-bond finger layout for integrated circuit package
10/07/1987EP0240070A2 Process for manufacturing semi-conductor devices
10/07/1987EP0239833A2 Integrated circuit device with an improved interconnection line
10/07/1987EP0239746A2 Method for manufacturing a semiconductor device
10/07/1987CN87102401A Heat-resistant plastic semiconductor device
10/06/1987US4698663 Heatsink package for flip-chip IC
10/06/1987US4698662 Multichip thin film module
10/06/1987US4698661 Encapsulating box for a power semiconductor with improved input-output insulator
10/06/1987US4698660 Resin-molded semiconductor device
10/06/1987US4698659 Stacked complementary metal oxide semiconductor inverter
10/06/1987US4698627 Programmable semiconductor switch for a light influencing display and method for making same
10/06/1987US4698125 Method of producing a layered structure
10/06/1987CA1227886A1 Liquid-cooling module system for electronic circuit components
10/06/1987CA1227726A1 Synthetic diamond heat sink
10/05/1987EP0163731A4 Semiconductor device pad area protection structure.
10/01/1987DE3610459A1 Arrangement for making thermal contact between electrical components and heat sinks
09/1987
09/30/1987EP0239494A1 Integrated circuit housing
09/30/1987EP0239322A2 Cooled component assembly
09/30/1987EP0239315A1 Semiconductor device having an encapsulating package
09/30/1987EP0238915A1 Connection and circuit arrangement
09/30/1987EP0238694A1 Method of forming identically positioned alignment marks on opposite sides of a semiconductor wafer
09/30/1987EP0238665A1 Semiconductor device
09/30/1987EP0238651A1 Magnetically sealed multichip integrated circuit package.
09/30/1987EP0097157B1 Cooling means for integrated circuit chip device
09/29/1987US4697205 Combined with semiconductor circuit; wick of glass mixed with semiconductor material
09/29/1987US4697204 Leadless chip carrier and process for fabrication of same
09/29/1987US4697203 Resin package with window
09/29/1987US4697139 Logic circuit having testability for defective via contacts
09/29/1987US4696851 Hybrid and multi-layer circuitry
09/29/1987US4696828 Passivation of InP by plasma deposited phosphorus
09/29/1987US4696704 Material for lead frames
09/29/1987US4696097 Poly-sidewall contact semiconductor device method
09/24/1987DE3610036A1 Kontaktieren von mikroelektronischen schaltungen Contact of microelectronic circuits
09/24/1987DE3609083A1 Electronic apparatus
09/23/1987EP0238418A2 Method of manufacturing semiconductor device having package structure
09/23/1987EP0238314A2 Computer-aided automatic wiring method for semiconductor integrated circuit device
09/23/1987EP0238282A2 Hybrid IC device and method for manufacturing same
09/23/1987EP0238181A2 Cover for semiconductor device packages
09/23/1987EP0238089A2 Three-dimensional integrated circuit and manufacturing method therefor
09/23/1987EP0238066A2 A method for effecting adhesion of silicon or silicon dioxide plates
09/23/1987EP0237932A2 Wiring layout for bipolar and unipolar insulated gate transistors
09/23/1987EP0237851A2 Method for contacting microelectric circuits
09/23/1987EP0237808A2 Multilayered interposer board for powering high current chip modules
09/23/1987EP0237741A2 Thermal conduction device
09/23/1987EP0237739A2 Semiconductor power module and method of producing the module
09/23/1987EP0237725A1 Plastic integrated circuit package having reduced moisture absorbtion
09/23/1987CN87101815A Cermet substrate with glass adhesion component
09/22/1987US4695925 IC card
09/22/1987US4695924 For mounting on a printed circuit board
09/22/1987US4695872 High density micropackage for IC chips
09/22/1987US4695870 Inverted chip carrier
09/22/1987US4695869 GAAS semiconductor device
09/22/1987US4695868 Patterned metallization for integrated circuits
1 ... 2195 2196 2197 2198 2199 2200 2201 2202 2203 2204 2205 2206 2207 2208 2209 2210 2211 2212 2213 2214 2215 ... 2262