H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1987
11/25/1987	CN87103170A Ceramics materials based on mullite
11/25/1987	CN86107015A Method for manufacturing radiating device, and using it produetion radiator
11/24/1987	US4709353 Semiconductor memory
11/24/1987	US4709351 Semiconductor memory device having an improved wiring and decoder arrangement to decrease wiring delay
11/24/1987	US4709302 Alignment apparatus for electronic device package
11/24/1987	US4709301 For integrated circuit chip wires, polysiloxanes
11/24/1987	US4709254 Carrier element for an IC module
11/24/1987	US4709122 Nickel/indium alloy for use in the manufacture of a hermetically sealed container for semiconductor and other electronic devices
11/24/1987	US4709001 In situ low temperature siloxane gel
11/24/1987	US4708983 Arylene sulfide polymers of improved impact strength
11/24/1987	US4708904 Semiconductor device and a method of manufacturing the same
11/24/1987	US4708767 Method for providing a semiconductor device with planarized contacts
11/19/1987	WO1987007081A1 Semi-conductor component
11/19/1987	WO1987007080A1 Semi-conductor component
11/19/1987	WO1987007074A1 Transformer structure
11/19/1987	EP0246088A2 ROM mount for paging receiver and others
11/19/1987	EP0245934A2 Low pressure chemical vapor deposition of metal silicide
11/19/1987	EP0245770A2 Multilayer ceramic substrate with circuit patterns and his method for making
11/19/1987	EP0245698A2 Packaging a semiconductor chip device
11/19/1987	EP0245697A2 Multilayered thin film metallurgy for brazing input/output pins to a ceramic substrate
11/19/1987	EP0245627A1 Method for filling contact holes etched in an insulating layer, with tungsten, for the manufacture of highly integrated semi-conductor circuits
11/19/1987	EP0245559A2 Two component curable epoxy resin composition having a long pot life
11/19/1987	EP0245290A1 Glass intermetal dielectric
11/19/1987	DE3711790A1 Method of fabricating a semiconductor device
11/19/1987	DE3616233A1 Halbleiterbauelement Semiconductor device
11/19/1987	DE3616185A1 Halbleiterbauelement Semiconductor device
11/19/1987	DE3153395C2 Use of a very fine wire made of a copper/tin alloy
11/17/1987	US4707806 Semiconductor integrated circuit device having fuse-type information storing circuit
11/17/1987	US4707726 Heat sink mounting arrangement for a semiconductor
11/17/1987	US4707725 Fluorescent coating for uv sensitive semiconductor device
11/17/1987	US4707724 Semiconductor device and method of manufacturing thereof
11/17/1987	US4707723 Semiconductor device using a refractory metal as an electrode and interconnection
11/17/1987	US4707718 Read-only memory
11/17/1987	US4707717 Semiconductor memory device
11/17/1987	US4707416 Non-oxide ceramics-metal composite material
11/17/1987	US4706811 Surface mount package for encapsulated tape automated bonding integrated circuit modules
11/17/1987	CA1229428A1 Integrated circuit chip structure wiring and circuitry for driving highly capacitive on chip wiring nets
11/17/1987	CA1229411A1 Stacked double density memory module using industry standard memory chips
11/17/1987	CA1229364A1 Rotating rectifier assembly
11/12/1987	DE3713833A1 Hybridschaltung Hybrid circuit
11/12/1987	DE3613596A1 Heat exchanger and process for producing it
11/11/1987	EP0245179A2 System for detachably mounting semiconductors on conductor substrate.
11/11/1987	EP0245014A2 Seal structure for an integrated circuit
11/11/1987	EP0244995A2 Low resistance metal contact for silicon devices
11/11/1987	EP0244767A2 Hermetic semiconductor enclosure and process of manufacture
11/11/1987	EP0244707A2 Method of attachment of a heat-conductive element to an electric circuit chip
11/11/1987	EP0244696A2 Method of fabricating a multilayered ceramic substrate having solid non-porous metal conductors
11/11/1987	EP0244666A2 Balltape structure for tape automated bonding, multilayer packaging and universal chip interconnection
11/11/1987	EP0244605A2 Integrated circuit logic array unit for the construction of integrated circuits
11/11/1987	EP0244530A2 Thin oxide fuse in an integrated circuit
11/11/1987	EP0244462A1 Method for forming vertical interconnects in polyimide insulating layers
11/10/1987	US4706165 Multilayer circuit board
11/10/1987	US4706105 Semiconductor device and method of producing the same
11/10/1987	US4706102 Memory device with interconnected polysilicon layers and method for making
11/10/1987	US4705917 Microelectronic package
11/10/1987	US4705606 Thin-film electrical connections for integrated circuits
11/10/1987	US4705102 Boiling refrigerant-type cooling system
11/10/1987	CA1229155A1 High density lsi package for logic circuits
11/05/1987	WO1987006766A1 Multiple integrated circuit interconnection arrangement
11/05/1987	WO1987006765A1 Corrosion resistant pins for metal packaged microcircuits
11/05/1987	DE3615049A1 Voltage-protected semiconductor arrangement
11/04/1987	EP0244302A1 Housing to ensure the thermal stabilization of equipment such as electronic components contained therein
11/04/1987	EP0244188A2 Polyarylene thioether molding product
11/04/1987	EP0244071A1 RF spectrum analysing receiver
11/04/1987	EP0243793A2 Hydraulic manifold for water cooling of multi-chip electric modules
11/04/1987	EP0243723A2 A method for bonding a layer containing a refractory metal to a substrate
11/04/1987	EP0243710A2 Flexible finned heat exchanger
11/04/1987	EP0243707A2 A method of establishing a conductive via path
11/04/1987	EP0243637A2 Semi-conductor power module
11/03/1987	US4704658 Evaporation cooling module for semiconductor devices
11/03/1987	US4704626 Controlling expansion coefficients of glass
11/03/1987	US4704370 Sealing glass composition
11/03/1987	US4704320 Semiconductors, gap between ceramic base and conductor layer relieves stress
11/03/1987	US4704319 Apparatus and method for fabricating modules comprising stacked circuit-carrying layers
11/03/1987	US4704187 Etching, pressing
11/03/1987	US4703920 Manufacturing method for integrated circuit chip carriers and work holder for use in the method
11/03/1987	US4703567 Connection of electrical component and its heat sink
11/03/1987	CA1228893A1 Semiconductor valve
10/1987
10/28/1987	EP0243318A2 Phenol ether containing epoxy groups
10/28/1987	EP0243034A2 Programmable bonding pad
10/28/1987	EP0243021A1 Impedance matching means
10/28/1987	EP0242962A1 Offset pad semiconductor lead frame
10/28/1987	EP0242744A2 Method of manufacturing an integrated circuit semiconductor device comprising a lithography step
10/28/1987	EP0242697A2 Adducts of metabrominated phenols and polyfunctional epoxides
10/28/1987	EP0242626A2 Method for mounting electronic components on a substrate
10/28/1987	EP0242558A2 Screenable paste for use as a barrier layer on a substrate during maskless cladding
10/28/1987	EP0242540A1 Method and structure for reducing resistance in integrated circuits
10/28/1987	EP0242369A1 Surface mountable integrated circuit packages having solder bearing leads.
10/27/1987	US4703436 Wafer level integration technique
10/27/1987	US4703393 Mounting structure of flat-lead package-type electronic component
10/27/1987	US4703339 Aluminum-silicon alloy
10/27/1987	US4703338 Resin composition to seal electronic device
10/27/1987	US4703288 Interconnection lines for wafer-scale-integrated assemblies
10/27/1987	US4703074 Polyphenylene sulfide resin composition containing mixture of silicon compounds
10/27/1987	US4702796 High density region of first conductivity type
10/27/1987	US4702003 Method of fabricating a freestanding semiconductor connection
10/27/1987	US4701999 Method of making sealed housings containing delicate structures
10/27/1987	CA1228681A1 Method for the manufacture of gate electrodes formed of double layers of metal silicides having a high melting point and doped polycrystalline silicon
10/27/1987	CA1228680A1 Semiconductor device wiring including tunnelling layer
10/27/1987	CA1228475A1 Thick film conductor compositions

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