H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/1988
01/05/1988	US4717449 Dielectric barrier material
01/05/1988	US4717436 Wire for bonding a semiconductor device
01/05/1988	US4717066 Method of bonding conductors to semiconductor devices
01/05/1988	CA1231183A1 Semiconductor device with staggered chip elements
01/05/1988	CA1231182A1 Integrated circuit package
12/1987
12/29/1987	US4716494 Retention system for removable heat sink
12/29/1987	US4716452 Semiconductor integrated circuit device constructed by polycell technique
12/29/1987	US4716450 Semiconductor integrated circuit having complementary field effect transistors
12/29/1987	US4716124 Using a flexible metal tape carrier; testing at full-rated current
12/29/1987	US4716082 Packages for microcircuit chips
12/29/1987	US4716049 Compressive pedestal for microminiature connections
12/29/1987	US4715941 Oxygen plasma etching of silicon-containing substance
12/29/1987	US4715892 Cermet substrate with glass adhesion component
12/29/1987	US4715438 Staggered radial-fin heat sink device for integrated circuit package
12/29/1987	US4715430 Environmentally secure and thermally efficient heat sink assembly
12/29/1987	US4715189 Open cycle cooling of electrical circuits
12/29/1987	US4715115 Package for water-scale semiconductor devices
12/23/1987	EP0250269A2 Integrated circuit semiconductor device having improved wiring structure
12/23/1987	EP0250251A2 Feed-through strips
12/23/1987	EP0250146A1 Palladium plated lead frame for integrated circuit
12/23/1987	EP0250078A2 Programmable low impedance interconnect circuit element
12/23/1987	EP0249834A2 Production of fine structures for the establishment of contacts on semi-conductors
12/23/1987	EP0249762A1 Identifying semiconductor wafers with bar code patterns thereon
12/23/1987	EP0249755A2 Hybrid integrated circuit apparatus
12/22/1987	US4714981 Cover for a semiconductor package
12/22/1987	US4714953 Welded wire cooling
12/22/1987	US4714952 Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
12/22/1987	US4714951 Integrated circuit device which includes a continous layer which consists of conducting portions which are of a silicide of a refractory metal and insulating portions which are of an oxide of the metal
12/22/1987	US4714949 Electrostatic discharge protection using thin nickel fuse
12/22/1987	US4714687 Glass-ceramics suitable for dielectric substrates
12/22/1987	US4714570 Conductor paste and method of manufacturing a multilayered ceramic body using the paste
12/22/1987	US4714516 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
12/17/1987	DE3619636A1 Housing for integrated circuits
12/16/1987	EP0249378A2 Package for integrated circuit
12/16/1987	EP0249256A2 A semiconductor device with an aluminium interconnect layer containing a small percentage of vanadium
12/16/1987	EP0249168A2 Solder leveling method and apparatus
12/16/1987	EP0248883A1 Selective deposition process.
12/16/1987	CN87104031A Ceramic multilayer circuit board and semiconductor module
12/16/1987	CN86201268U High-power turning diode
12/15/1987	US4713730 Microwave plug-in signal amplifying module solderment apparatus
12/15/1987	US4713682 Dielectric barrier material
12/15/1987	US4713634 Semiconductor device mounted in a housing having an increased cutoff frequency
12/15/1987	US4712609 Heat sink structure
12/15/1987	US4712388 Cryostat cooling system
12/15/1987	CA1230441A1 Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
12/09/1987	EP0248668A2 Process for fabricating multilevel metal integrated circuits and structures produced thereby
12/09/1987	EP0248445A2 Semiconductor device having a diffusion barrier and process for its production
12/09/1987	EP0248338A1 Highly pure titanium and process for producing the same
12/09/1987	EP0248267A2 Monolitically intergrated circuit with parallel circuit branches
12/09/1987	EP0248266A2 Logic circuit with a plurality of complementary field effect transistors
12/09/1987	EP0248258A2 Improved heat sink device using composite metal alloy
12/08/1987	US4712161 Hybrid and multi-layer circuitry
12/08/1987	US4712159 Heat sink clip assembly
12/08/1987	US4712158 Cooling system for electronic circuit components
12/08/1987	US4712129 Integrated circuit device with textured bar cover
12/08/1987	US4712128 Semiconductor devices having contact arrangement
12/08/1987	US4712127 High reliability metal and resin container for a semiconductor device
12/08/1987	US4712126 Low resistance tunnel
12/08/1987	US4712125 Structure for contacting a narrow width PN junction region
12/08/1987	US4711807 With argon content
12/08/1987	US4711791 Method of making a flexible microcircuit
12/08/1987	US4711700 Method for densifying leadframe conductor spacing
12/08/1987	US4711023 Process for making single-in-line integrated electronic component
12/08/1987	CA1230184A1 Liquid cooling type high frequency solid state device
12/08/1987	CA1230172A2 Microwave integrated circuit immune to adverse shielding effects
12/03/1987	WO1987007471A1 Electrical circuit interconnection
12/03/1987	WO1987007470A1 Electrical circuit interconnection
12/02/1987	EP0247783A2 Method of refractory metal deposition
12/02/1987	EP0247775A2 Semiconductor package with high density I/O lead connection
12/02/1987	EP0247644A1 Integrated circuit die-to-lead frame connection using an intermediate bridging member
12/02/1987	EP0247635A2 Dissipation resistance with forced air cooling for an electronic rectifier, in particular for an electric propulsion device
12/02/1987	EP0247617A2 Multilayer ceramic substrate with circuit patterns
12/02/1987	EP0247492A2 Silicone encapsulated devices
12/01/1987	US4710897 Semiconductor memory device comprising six-transistor memory cells
12/01/1987	US4710852 Spring retainer for encapsulated semiconductor device
12/01/1987	US4710798 Integrated circuit chip package
12/01/1987	US4710797 Integrated circuit frame, silicone resin encapsulated by epoxy resin containing window
12/01/1987	US4710796 Containing curing agent, phosphine compound and antimony oxide
12/01/1987	US4710795 Semiconductor power module
12/01/1987	US4710791 Protection device in an integrated circuit
12/01/1987	US4710592 Multilayer wiring substrate with engineering change pads
12/01/1987	US4710479 Powdered mixture with solder glass; low melting, low expansion; semiconductors; electronics
12/01/1987	US4710398 Semiconductor device and manufacturing method thereof
12/01/1987	US4710250 Laminating, firing ceramic sheets; marking chip cavity location
12/01/1987	US4709754 Heat transfer element with nucleate boiling surface and bimetallic fin formed from element
12/01/1987	US4709468 Method for producing an integrated circuit product having a polyimide film interconnection structure
12/01/1987	CA1229933A1 Plastic pin grid array chip carrier
12/01/1987	CA1229932A1 SEMICONDUCTOR STRUCTURE HAVING .alpha. PARTICLE RESISTANT FILM AND METHOD OF MAKING SAME
12/01/1987	CA1229816A1 Impregnation of aluminum interconnects with copper
11/1987
11/26/1987	DE3617611A1 Thermally conductive and electrically insulating interlayer for the build-up and fixing of semiconductor elements, and arrangement using such interlayers
11/26/1987	DE3616969A1 Housing for integrated circuits
11/25/1987	EP0246893A2 Semiconductor device comprising an insulating wiring substrate and method of manufacturing it
11/25/1987	EP0246692A2 Surface-mounted electrical power resistor
11/25/1987	EP0246657A2 Integrated circuit chips cooling module having coolant leakage prevention device
11/25/1987	EP0246574A2 Power semiconductor device
11/25/1987	EP0246539A2 Improved silicon packages for power semiconductor devices
11/25/1987	EP0246458A2 Module for packaging semiconductor integrated circuit chips on a base substrate
11/25/1987	EP0246432A2 Fluid impingement heatsink with crossflow capability
11/25/1987	EP0246304A1 Open cycle cooling of electrical circuits
11/25/1987	EP0246270A1 Multilayer ceramic laser package.

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