| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/02/1988 | US4723155 Semiconductor device having a programmable fuse element |
| 02/02/1988 | US4723082 Signal transfer circuit for use in laminated multilayer electric circuit |
| 02/02/1988 | US4723062 Hydrogen containing silicon nitride film over area to be cut with a laser beam |
| 02/02/1988 | US4722914 Substrate with through-holes for insertion of semiconductor dies |
| 02/02/1988 | US4722913 Doped semiconductor vias to contacts |
| 02/02/1988 | US4722908 Fabrication of a bipolar transistor with a polysilicon ribbon |
| 02/02/1988 | US4722441 Package structure for semiconductors |
| 02/02/1988 | US4722137 High frequency hermetically sealed package for solid-state components |
| 02/02/1988 | CA1232372A1 Method for encapsulating semiconductor components mounted on a carrier tape |
| 02/02/1988 | CA1232367A1 Packaging microminiature devices |
| 02/02/1988 | CA1232364A1 Wafer-scale-integrated assembly |
| 01/28/1988 | WO1988000573A1 Spherical corundum particles, process for their production, and highly heat-conductive rubber or plastic composition containing them |
| 01/28/1988 | DE3724703A1 Entkopplungskondensator fuer schaltkreisbausteine mit rasterfoermigen kontaktstiftanordnungen und daraus bestehende entkopplungsanordnungen Decoupling capacitor for circuit-blocks with rasterfoermigen-pin arrangements and existing arrangements resulting decoupling |
| 01/28/1988 | DE3719535A1 Strahlungsfestes halbleiterschaltungsbauteil Radiation-resistant semiconductor circuit component |
| 01/27/1988 | EP0254692A1 Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink |
| 01/27/1988 | EP0254640A1 Realization method of an electronic memory card and card obtained by this method |
| 01/27/1988 | EP0254444A1 Moulded integrated-circuit module |
| 01/27/1988 | EP0254071A2 Amorphous thin film transistor device |
| 01/27/1988 | EP0254070A2 Electrical device |
| 01/27/1988 | EP0253886A1 Interconnects for wafer-scale-integrated assembly |
| 01/27/1988 | CN87104825A Thermally enhanced lsi integrated circuit package |
| 01/27/1988 | CN85107077B 半导体器件及其制造法 Semiconductor device and manufacturing method |
| 01/26/1988 | US4722060 Integrated-circuit leadframe adapted for a simultaneous bonding operation |
| 01/26/1988 | US4721996 Spring loaded module for cooling integrated circuit packages directly with a liquid |
| 01/26/1988 | US4721995 Integrated circuit semiconductor device formed on a wafer |
| 01/26/1988 | US4721994 Lead frame for semiconductor devices |
| 01/26/1988 | US4721993 Interconnect tape for use in tape automated bonding |
| 01/26/1988 | US4721992 Hinge tape |
| 01/26/1988 | US4721991 Semiconductor with connectors of alloy containing iron, silicon and group 4,5, or 6 metal |
| 01/26/1988 | US4721831 Module for packaging and electrically interconnecting integrated circuit chips on a porous substrate, and method of fabricating same |
| 01/26/1988 | US4721689 Method for simultaneously forming an interconnection level and via studs |
| 01/26/1988 | US4720916 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped |
| 01/26/1988 | US4720908 Process for making contacts and interconnects for holes having vertical sidewalls |
| 01/26/1988 | CA1232083A1 Microwave transistor package |
| 01/26/1988 | CA1232082A1 Flat package for integrated circuit memory chips |
| 01/21/1988 | DE3623288A1 Arrangement of semiconductor components on a heat sink |
| 01/20/1988 | EP0253764A1 Method and device for increasing system security in a laser writing process |
| 01/20/1988 | EP0253746A1 Method and apparatus for dynamic testing of thin-film conductor |
| 01/20/1988 | EP0253691A2 Silicon die bonding process |
| 01/20/1988 | EP0253299A1 Metallization for integrated-circuit arrangements |
| 01/20/1988 | EP0253295A1 Thermally enhanced LSI integrated circuit package |
| 01/20/1988 | EP0253225A2 Method for mounting components on a conductor network for the circuit support of an electro-mechanic watch movement and partially equipped conductor network of a clock-circuit support |
| 01/20/1988 | EP0253126A1 Heat sink |
| 01/20/1988 | EP0252977A1 Ultra high density pad array chip carrier |
| 01/19/1988 | US4720771 Heat sink assembly for a circuit board mounted integrated circuit |
| 01/19/1988 | US4720770 Constant impedance integrated circuit connector |
| 01/19/1988 | US4720742 Semiconductor device carrier |
| 01/19/1988 | US4720741 Antistatic and antitack coating for circuit devices |
| 01/19/1988 | US4720737 Semiconductor device having a protection circuit with lateral bipolar transistor |
| 01/19/1988 | US4720690 Sculptured stripline interface conductor |
| 01/19/1988 | US4720470 Method of making electrical circuitry |
| 01/19/1988 | US4720431 Silicone encapsulated devices |
| 01/19/1988 | US4720424 Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating |
| 01/19/1988 | US4720419 Steel coated with glaze |
| 01/19/1988 | US4720401 Enhanced adhesion between metals and polymers |
| 01/19/1988 | US4720396 Solder finishing integrated circuit package leads |
| 01/14/1988 | WO1988000430A1 Apparatus and method for compensation of thermal expansion of cooling fluid in enclosed electronic packages |
| 01/14/1988 | WO1988000396A1 Multiple-plate hybrid device |
| 01/14/1988 | WO1988000394A1 Staggered radial-fin heat sink device for integrated circuit package |
| 01/14/1988 | WO1988000393A1 Reduced-stress heat sink device |
| 01/14/1988 | WO1988000161A1 Electrical device transport medium |
| 01/13/1988 | EP0252814A1 Process for the programmable laser linking of two superposed conductors of an integrated-circuit interconnection network, and resulting integrated circuit |
| 01/13/1988 | EP0252679A2 Semiconductor device having two electrodes with an insulating film between them |
| 01/13/1988 | EP0252519A1 Aluminum nitride circuit substrate |
| 01/13/1988 | EP0252518A1 Circuit substrate |
| 01/13/1988 | EP0252429A1 Electronic semiconductor device having cooling means |
| 01/13/1988 | EP0252115A1 Compressive pedestal for microminiature connections. |
| 01/13/1988 | EP0252094A1 Stripline mount for semiconductor lasers. |
| 01/13/1988 | EP0129562B1 Solar cell comprising a protective polyimide coating and method for protecting solar cells |
| 01/12/1988 | US4719502 Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used |
| 01/12/1988 | US4719500 Semiconductor device and a process of producing same |
| 01/12/1988 | US4719498 Optoelectronic integrated circuit |
| 01/12/1988 | US4719434 Monolithic microwave integrated circuit |
| 01/12/1988 | US4719250 Encapsulation of electronic components |
| 01/12/1988 | US4719140 Integrated circuit pellet, electrode terminals, adhesive bonding |
| 01/12/1988 | US4719125 Cyclosilazane polymers as dielectric films in integrated circuit fabrication technology |
| 01/12/1988 | US4718977 Integrated circuits, aluminum and titanium |
| 01/12/1988 | US4718166 Method of making a connector |
| 01/12/1988 | CA1231465A1 Integrated circuit architecture and fabrication method therefor |
| 01/07/1988 | EP0251880A2 Reduction in power rail perturbation and in the effect thereof on integrated circuit performance |
| 01/07/1988 | EP0251879A2 Solder finishing integrated circuit package leads |
| 01/07/1988 | EP0251865A1 Method and apparatus for improving the sensitivity and signal to noise ratio of piezoelectric transducers comprising several sensors connected in parallel |
| 01/07/1988 | EP0251836A1 Integral heat pipe module |
| 01/07/1988 | EP0251828A1 Insulating resin composition and semiconductor device using the same |
| 01/07/1988 | EP0251600A2 Laminated sheet material for packaging electronic components |
| 01/07/1988 | EP0251523A1 A method of producing a semiconductor device showing a good ohmic contact between a plurality of wiring layers |
| 01/07/1988 | EP0251347A1 Method of covering a device with a first layer of silicon nitride and with a second layer of a polyimide, and device covered by means of the method |
| 01/07/1988 | EP0251260A1 Semiconductor power module |
| 01/07/1988 | EP0251218A2 Electrically insulating substrate material of polycrystalline silicon carbide and process of manufacture by not isostatic pressing |
| 01/07/1988 | EP0251206A1 Antistatic and antitack coating for circuit devices |
| 01/07/1988 | EP0250736A2 Assembly for handling flexible film substrates |
| 01/07/1988 | EP0250541A1 Chip interface mesa |
| 01/07/1988 | EP0250450A1 Lead finishing for a surface mount package |
| 01/07/1988 | EP0132720B1 Integrated semiconductor circuit having an external aluminium or aluminium alloy contact interconnection layer |
| 01/05/1988 | US4717988 Universal wafer scale assembly |
| 01/05/1988 | US4717948 Semiconductor device |
| 01/05/1988 | US4717886 Operational amplifier utilizing resistors trimmed by metal migration |
| 01/05/1988 | US4717690 Overglaze inks |
| 01/05/1988 | US4717687 Doping, heating, forming oxide, increase temperature to diffuse dope, remove oxide and coat with epitaxial layer |
| 01/05/1988 | US4717617 Applying a silicon layer, then annealing |