| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/15/1988 | US4730665 Apparatus for cooling high-density integrated circuit packages |
| 03/15/1988 | CA1234228A1 Semiconductor device |
| 03/10/1988 | WO1988001827A1 Circuit package attachment apparatus and method |
| 03/10/1988 | WO1988001793A1 Thermally insulative and electrically conductive interconnect and process for making same |
| 03/09/1988 | EP0259282A2 A method for producing thin conductive and semi-conductive layers in monocrystal silicon |
| 03/09/1988 | EP0259222A2 Outer lead tape automated bonding system |
| 03/09/1988 | EP0259179A2 Overvoltage protection device |
| 03/09/1988 | EP0258962A2 Semiconductor devices having selectively actuable links and a method of manufacturing said devices |
| 03/09/1988 | EP0258691A2 Voltage regulator for a generator |
| 03/09/1988 | EP0258444A1 Semiconductor device |
| 03/09/1988 | EP0258312A1 Mounting arrangement for solid state devices. |
| 03/09/1988 | EP0258295A1 Ignition switching device |
| 03/09/1988 | CN85108637B Electronic circuit device and method of producing the same |
| 03/08/1988 | US4730235 Cascadable carrier for high power semiconductors or other electronic components |
| 03/08/1988 | US4730232 High density microelectronic packaging module for high speed chips |
| 03/08/1988 | US4730228 Overtemperature detection of power semiconductor components |
| 03/08/1988 | US4730156 Self-monitor system for microprocessor for detecting erroneous connection of terminals |
| 03/08/1988 | US4729426 Bonded clip heat sink |
| 03/08/1988 | US4729165 Method of applying an integrated circuit on a substrate having an electrically conductive run |
| 03/08/1988 | CA1233910A1 Mounting structure of flat-lead package-type electronic component |
| 03/03/1988 | DE3629567A1 Semiconductor block |
| 03/02/1988 | EP0258149A2 Low dose emitter vertical fuse |
| 03/02/1988 | EP0258147A2 Fabrication of a bipolar transistor with a polysilicon ribbon |
| 03/02/1988 | EP0258098A1 Encapsulated semiconductor device and method of producing the same |
| 03/02/1988 | EP0258056A2 Integrated circuit package having coaxial pins |
| 03/02/1988 | EP0257948A2 Conductive via plug for CMOS devices |
| 03/02/1988 | EP0257870A2 A semiconductor device, making and testing thereof |
| 03/02/1988 | EP0257801A2 Method of making a flexible microcircuit |
| 03/02/1988 | EP0257681A2 Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
| 03/02/1988 | EP0257466A2 Low thermal expansion,heat conducting laminates having layersof metal and reinforced polymer matrix composite |
| 03/02/1988 | EP0257277A2 Method for simultaneously forming a interconnection level and via studs |
| 03/02/1988 | EP0257204A1 Seal for an opening to a cavity and integrated circuit package |
| 03/02/1988 | EP0257201A2 Minimization of engineering change pads |
| 03/02/1988 | EP0257119A1 Integrated wiring system for VLSI |
| 03/01/1988 | US4729063 Plastic molded semiconductor integrated circuit device with nail section |
| 03/01/1988 | US4729061 Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
| 03/01/1988 | US4729060 Cooling system for electronic circuit device |
| 03/01/1988 | US4729010 Integrated circuit package with low-thermal expansion lead pieces |
| 03/01/1988 | US4728627 Method of making multilayered interconnects using hillock studs formed by sintering |
| 03/01/1988 | US4728372 Nickel, silicon, magnesium |
| 03/01/1988 | US4728297 Socket for an electronic component |
| 03/01/1988 | US4728164 Electrical contact pin for printed circuit board |
| 03/01/1988 | US4727645 Device for surface mounting of components |
| 03/01/1988 | CA1233572A1 Terminal straightener for an integrated circuit package |
| 02/25/1988 | WO1988001437A1 Integrated circuit devices |
| 02/25/1988 | WO1988001259A1 Aluminum nitride sinter and semiconductor substrate formed therefrom |
| 02/25/1988 | DE3627372A1 Heat sink for electronic components |
| 02/24/1988 | EP0256715A2 Temperature sensing apparatus |
| 02/24/1988 | EP0256623A1 Socket for zig-zag inline package |
| 02/24/1988 | EP0256612A1 Chip carrier extraction tool |
| 02/24/1988 | EP0256568A2 Process for obtaining thin-film circuits and passive circuit made by said process |
| 02/24/1988 | EP0256557A2 Semiconductor device having thin film wiring layer and method of forming thin wiring layer |
| 02/24/1988 | EP0256494A2 Activatable conductive links for semiconductor devices |
| 02/24/1988 | EP0256357A2 Semiconductor chip including a bump structure for tape automated bonding |
| 02/24/1988 | CN87105600A Pressure contact gto-thyristor rectifier |
| 02/23/1988 | US4727554 Temperature controller for semiconductor devices |
| 02/23/1988 | US4727493 Integrated circuit architecture and fabrication method therefor |
| 02/23/1988 | US4727455 Semiconductor power module with an integrated heat pipe |
| 02/23/1988 | US4727454 Semiconductor power module |
| 02/23/1988 | US4727410 High density integrated circuit package |
| 02/23/1988 | US4727221 Semiconductor memory device |
| 02/23/1988 | US4727048 Silica-germanium dioxide glass isolated islands |
| 02/23/1988 | US4726983 Alternating layers of metal and a compound of the same metal with a reactive gas |
| 02/23/1988 | US4726859 Wire for bonding a semiconductor device |
| 02/23/1988 | US4726776 Socket for zig-zag inline package |
| 02/18/1988 | DE3627417A1 Process for producing low-resistance connections in the insulating layer between two metallisation levels |
| 02/17/1988 | EP0255911A2 Metal-dielectric-metal layer structure with low resistance via connections |
| 02/17/1988 | EP0173733A4 Capacitive device. |
| 02/16/1988 | US4725924 Electronic unit especially for microcircuit cards and card comprising such a unit |
| 02/16/1988 | US4725922 IC lead retaining mechanism in IC package carrier |
| 02/16/1988 | US4725918 Protective insert for chip carriers |
| 02/16/1988 | US4725878 Semiconductor device |
| 02/16/1988 | US4725791 For altering an electrical parameter of a utilization circuit |
| 02/16/1988 | US4725692 Electronic device and lead frame used thereon |
| 02/16/1988 | US4725480 Vitreous glass covering |
| 02/16/1988 | US4724611 Method for producing semiconductor module |
| 02/16/1988 | CA1232978A1 Process for minimizing distortion in multilayer ceramic substrates |
| 02/16/1988 | CA1232971A1 Metal cored board and method for manufacturing same |
| 02/11/1988 | WO1988001102A1 Semiconductor devices having improved metallization |
| 02/10/1988 | EP0255589A2 A wireable circuit cell for a vlsi circuit |
| 02/09/1988 | US4724530 Five transistor CMOS memory cell including diodes |
| 02/09/1988 | US4724475 Semiconductor device |
| 02/09/1988 | US4724473 Micropackage for encapsulating an electronic component |
| 02/09/1988 | US4724472 Semiconductor device |
| 02/09/1988 | US4724471 Electrostatic discharge input protection network |
| 02/09/1988 | US4724283 Stacks of aluminum nitride and wiring layers of aluminum nitride and refractory metal |
| 02/09/1988 | US4724280 Package for integrated circuit |
| 02/09/1988 | US4724223 Method of making electrical contacts |
| 02/09/1988 | US4724220 Masking, photon bombardment |
| 02/09/1988 | US4724182 Low surface roughness, accuracy |
| 02/07/1988 | US4803538 Thyristor with adjustable base-to-emitter resistance |
| 02/05/1988 | EP0174950A4 Wafer scale package system and header and method of manufacture thereof. |
| 02/04/1988 | DE3639430C1 Circuit arrangement to protect computers |
| 02/04/1988 | DE3626151A1 Voltage supply for an integrated semiconductor circuit |
| 02/03/1988 | EP0254948A2 Microelectronic device and thick film hybrid circuit |
| 02/03/1988 | EP0254910A1 Pressure-contacted GTO thyristor |
| 02/02/1988 | USH434 Having a gold pad with an open area surrounded by a solder immiscible material |
| 02/02/1988 | US4723197 Semiconductors; lateral interconnects |
| 02/02/1988 | US4723195 Assembly including a modular electrical circuit and connector |
| 02/02/1988 | US4723156 EPROM device and a manufacturing method thereof |