| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/1988 | US4737208 Method of fabricating multilayer structures with nonplanar surfaces |
| 04/12/1988 | US4737116 Impedance matching block |
| 04/12/1988 | US4737112 Anisotropically conductive composite medium |
| 04/12/1988 | US4737033 Alignment key and method of making the same |
| 04/12/1988 | US4736521 Modules; interior powder wire line layer and through holes |
| 04/12/1988 | CA1235199A1 Lead member and method for fixing thereof |
| 04/07/1988 | WO1988002554A1 High-frequency power transistor with bipolar epitaxial technology |
| 04/07/1988 | WO1988002553A2 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 04/07/1988 | WO1988002552A1 Multichip integrated circuit packaging configuration and method |
| 04/07/1988 | WO1988002551A1 Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
| 04/07/1988 | WO1988002550A1 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging |
| 04/07/1988 | WO1988002542A1 Low-temperature monolithic chip |
| 04/07/1988 | WO1988002411A1 Material for conductive parts of electronic and electric appliances |
| 04/07/1988 | WO1988002386A1 Encapsulating compositions |
| 04/06/1988 | EP0262910A2 Encapsulating compositions |
| 04/06/1988 | EP0262848A2 Method of fabricating multilayer structures with nonplanar surfaces |
| 04/06/1988 | EP0262830A2 Method of ensuring contact in a deposited layer |
| 04/06/1988 | EP0262780A1 Marching interconnecting lines in semiconductor integrated circuits |
| 04/06/1988 | EP0262575A2 Self-aligned internal mobile ion getter for multi-layer metallization on integrated circuits |
| 04/06/1988 | EP0262493A2 Electronic package with distributed decoupling capacitors |
| 04/06/1988 | EP0262284A1 Connection apparatus for integrated circuit |
| 04/06/1988 | EP0262193A1 Process for forming a fuse programmable read-only memory device. |
| 04/05/1988 | US4736276 High density; mullite, sillimanite, silicon dioxide, magnesium oxide |
| 04/05/1988 | US4736273 Power semiconductor device for surface mounting |
| 04/05/1988 | US4736236 Tape bonding material and structure for electronic circuit fabrication |
| 04/05/1988 | US4736235 Ultra-high frequency diode structure whose external connections are provided by two metal beam leads |
| 04/05/1988 | US4736233 Interconnect and contact system for metal-gate MOS VLSI devices |
| 04/05/1988 | US4736070 Miniaturized lighting or overload protective device and protective device used therein |
| 04/05/1988 | US4736012 Heat resistant polyimides |
| 04/05/1988 | US4735891 Printed multilayer circuits by coating metal foil, exposure, and development |
| 04/05/1988 | CA1234926A1 Method of making packaged ic chip |
| 03/31/1988 | DE3632944A1 High-frequency power transistor |
| 03/30/1988 | EP0262088A1 Arrangement for positioning and synchronizing a writinglaser beam |
| 03/30/1988 | EP0261939A2 Circuit protection device |
| 03/30/1988 | EP0261938A2 Circuit protection device |
| 03/30/1988 | EP0261846A1 Method of forming a metallization film containing copper on the surface of a semiconductor device |
| 03/30/1988 | EP0261799A1 Method for producing a terminal electrode of a semi-conductor device |
| 03/30/1988 | EP0261324A1 Plastic package for large chip size integrated circuit |
| 03/30/1988 | EP0261194A1 Interconnection systems for electrical circuits. |
| 03/30/1988 | EP0261138A1 Inverted chip carrier |
| 03/29/1988 | US4734825 Integrated circuit stackable package |
| 03/29/1988 | US4734820 Cryogenic packaging scheme |
| 03/29/1988 | US4734819 Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package |
| 03/29/1988 | US4734755 Alternating load stable switchable semiconductor device |
| 03/29/1988 | US4734754 Semiconductor device having improved structure of multi-wiring layers |
| 03/29/1988 | US4734753 Thermocompression bonding of copper leads to a metallized ceramic substrate |
| 03/29/1988 | US4734749 Semiconductor mesa contact with low parasitic capacitance and resistance |
| 03/29/1988 | US4734315 Low power circuitry components |
| 03/29/1988 | US4734255 Use of a copper-titanium-cobalt alloy as the material for electronic components |
| 03/29/1988 | US4734233 Sintered conductive layer of tungsten and oxides of silicon, aluminum, magnesium |
| 03/29/1988 | US4733813 Method and apparatus for soldering elements on the corresponding pads of a wafer, in particular a wafer having high-density integrated circuits |
| 03/29/1988 | US4733720 Water cooling means for insertable component parts groups in devices of power electronics |
| 03/29/1988 | CA1234641A1 Heat transfer element with nucleate boiling surface and bimetalic fin formed from element |
| 03/24/1988 | WO1988002197A1 Circuit utilizing resistors trimmed by metal migration |
| 03/24/1988 | WO1988002184A1 Semiconducteur mounting assembly |
| 03/24/1988 | WO1988002182A1 Method of manufacturing integrated circuits |
| 03/24/1988 | WO1988002123A1 Integrated circuits |
| 03/23/1988 | EP0261078A1 Process for selectively forming at least one metal or alloy coating strip on a substrate of another metal and integrated circuit lead frame achieved by this process |
| 03/23/1988 | EP0261013A1 Electronic component housing provided with connexion pins, forming a detachable housing |
| 03/23/1988 | EP0260969A1 Chip carrier |
| 03/23/1988 | EP0260906A2 Method of producing semiconductor device and semiconductor device |
| 03/23/1988 | EP0260857A2 Multilayer wiring substrate |
| 03/23/1988 | EP0260490A1 Bonding sheet for electronic component and method of bonding electronic component using the same |
| 03/23/1988 | EP0260471A1 Power semiconductor device |
| 03/23/1988 | EP0260370A2 Semiconductor device comprising a housing with cooling means |
| 03/23/1988 | EP0260360A1 Resin-sealed semiconductor device |
| 03/22/1988 | US4733331 Heat dissipation mechanism for power semiconductor elements |
| 03/22/1988 | US4733293 Heat sink device assembly for encumbered IC package |
| 03/22/1988 | US4733292 Preparation of fragile devices |
| 03/22/1988 | US4733291 Microminiature device |
| 03/22/1988 | US4733290 Semiconductor device and method of fabrication |
| 03/22/1988 | US4733289 Resin-molded semiconductor device using polyimide and nitride films for the passivation film |
| 03/22/1988 | US4733014 Lead frame |
| 03/22/1988 | US4732867 Silicon doping |
| 03/22/1988 | US4732865 Self-aligned internal mobile ion getter for multi-layer metallization on integrated circuits |
| 03/22/1988 | US4732843 Irradiation cross-linkable thermostable polymer system, for microelectronic applications |
| 03/22/1988 | US4732801 Bonding layer with inclusions between refractory and substrate |
| 03/22/1988 | US4732798 Multilayer ceramic substrate and method of making the same |
| 03/22/1988 | US4732733 Copper-base alloys for leadframes |
| 03/22/1988 | US4732731 Homogeneity, electroconductivity |
| 03/22/1988 | US4732646 Method of forming identically positioned alignment marks on opposite sides of a semiconductor wafer |
| 03/22/1988 | EP0204767A4 Method for fabricating modules comprising stacked circuit-carrying layers. |
| 03/17/1988 | DE3716196A1 Anordnung aus einem elektronische bauelemente tragenden keramiksubstrat und einer waermeabfuehreinrichtung Assembly of electronic components supporting a ceramic substrate and a heat rejection |
| 03/16/1988 | EP0260125A2 Electrostatic discharge protection circuit |
| 03/16/1988 | EP0259826A1 Semiconductor device having silicon oxynitride film with improved moisture resistance |
| 03/16/1988 | EP0259631A2 Semiconductor device having power supply lines |
| 03/16/1988 | EP0259490A1 A method of producing a semiconductor device |
| 03/16/1988 | EP0259446A1 Lead frame having non-conductive tie-bar for use in integrated circuit packages |
| 03/16/1988 | EP0113763B1 Lead frame and method |
| 03/15/1988 | US4731753 Preventing erasure by weak uv rad |
| 03/15/1988 | US4731701 Integrated circuit package with thermal path layers incorporating staggered thermal vias |
| 03/15/1988 | US4731700 Semiconductor connection and crossover apparatus |
| 03/15/1988 | US4731699 Mounting structure for a chip |
| 03/15/1988 | US4731693 Connection apparatus for integrated circuit |
| 03/15/1988 | US4731644 Semiconductor power module with ceramic substrate |
| 03/15/1988 | US4731643 Logic-circuit layout for large-scale integrated circuits |
| 03/15/1988 | US4731642 Semiconductor memory device with means to prevent word line breakage |
| 03/15/1988 | US4731346 Chemical vapor deposition, semiconductors |
| 03/15/1988 | US4731282 Anisotropic-electroconductive adhesive film |
| 03/15/1988 | US4730666 Flexible finned heat exchanger |