Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2013
08/13/2013US8508038 Method for producing an integrated circuit and resulting film chip
08/13/2013US8508037 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same
08/13/2013US8508036 Ultra-thin near-hermetic package based on rainier
08/13/2013US8508035 Circuit connector apparatus and method therefor
08/13/2013US8508034 Electronic devices
08/13/2013US8508033 Semiconductor device
08/13/2013US8508031 Electronic device and method of producing the same
08/13/2013US8508030 LED module
08/13/2013US8508029 Semiconductor package including an integrated waveguide
08/13/2013US8508028 Chip package and method for forming the same
08/13/2013US8508027 Semiconductor device and manufacturing method thereof
08/13/2013US8508026 Integrated circuit packaging system with connection supports and method of manufacture thereof
08/13/2013US8508025 Folded leadframe multiple die package
08/13/2013US8508024 Chip package structure and package substrate
08/13/2013US8508023 System and method for lowering contact resistance of the radio frequency (RF) shield to ground
08/13/2013US8508022 Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
08/13/2013US8508017 Test device and semiconductor integrated circuit device
08/13/2013US8507996 Block contact plugs for MOS devices
08/13/2013US8507957 Integrated circuit layouts with power rails under bottom metal layer
08/13/2013US8507955 Sensor device having MOS circuits, a gas or humidity sensor and a temperature sensor
08/13/2013US8507954 Integrated CMOS porous sensor having sensor electrodes formed with the interconnect conductors of a MOS circuit
08/13/2013US8507946 Electrostatic discharge protection device
08/13/2013US8507921 Single crystal compound semiconductor substrate
08/13/2013US8507909 Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor
08/13/2013US8507908 Probe and probe card
08/13/2013US8507379 Semiconductor device and manufacturing method thereof
08/13/2013US8507377 Semiconductor device, method of manufacturing the same, and phase shift mask
08/13/2013US8507321 Chip package and method for forming the same
08/13/2013US8507316 Protecting T-contacts of chip scale packages from moisture
08/13/2013US8505613 Die having a via filled with a heat-dissipating material
08/13/2013DE202013005998U1 Optische Empfangseinheit, insbesondere für einen nach dem Streulichtprinzip arbeitenden optischen Rauchmelder, mit selbsttätiger optischer Ausrichtung Optical receiver unit, especially for a working according to the principle of scattered light optical smoke detector with automatic optical alignment
08/08/2013WO2013116631A1 Light emitting laminate and method of making thereof
08/08/2013WO2013116601A1 Fastener assembly and method for heat sink mounting
08/08/2013WO2013116168A1 Method for making a redistributed electronic device using a transferrable redistribution layer
08/08/2013WO2013116167A1 Method for making a redistributed wafer using transferable redistribution layers
08/08/2013US20130203217 Semiconductor device
08/08/2013US20130200535 Overlay mark for multiple pre-layers and currently layer
08/08/2013US20130200534 Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
08/08/2013US20130200533 Package-on-package assembly with wire bond vias
08/08/2013US20130200532 Semiconductor Device Using Diffusion Soldering
08/08/2013US20130200531 Circuit Board, Method for Fabricating the Same and Semiconductor Package Using the Same
08/08/2013US20130200529 Semiconductor Device Packaging Methods and Structures Thereof
08/08/2013US20130200528 Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
08/08/2013US20130200527 Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Molding
08/08/2013US20130200526 Semiconductor devices having through electrodes and methods for fabricating the same
08/08/2013US20130200525 Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices
08/08/2013US20130200524 Package-on-package type semiconductor packages and methods for fabricating the same
08/08/2013US20130200523 Semiconductor device and manufacturing method thereof
08/08/2013US20130200522 Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
08/08/2013US20130200521 Inductors and wiring structures fabricated with limited wiring material
08/08/2013US20130200520 Three-dimensional (3d) integrated circuit with enhanced copper-to-copper bonding
08/08/2013US20130200519 Through silicon via structure and method of fabricating the same
08/08/2013US20130200518 Devices Including Metal-Silicon Contacts Using Indium Arsenide Films and Apparatus and Methods
08/08/2013US20130200517 Interposer frame and method of manufacturing the same
08/08/2013US20130200516 Hybrid substrate, production method therefor, and semiconductor integrated circuit package
08/08/2013US20130200515 Semiconductor package and method of forming the same
08/08/2013US20130200514 Semiconductor packages and methods of manufacturing the same
08/08/2013US20130200513 No-flow underfill for package with interposer frame
08/08/2013US20130200512 Package with interposer frame and method of making the same
08/08/2013US20130200511 Reducing stress in multi-die integrated circuit structures
08/08/2013US20130200510 Semiconductor device, heat radiation member, and manufacturing method for semiconductor device
08/08/2013US20130200509 Semiconductor package
08/08/2013US20130200508 Semiconductor package structure
08/08/2013US20130200507 Two-sided die in a four-sided leadframe based package
08/08/2013US20130200506 Method of preventing epoxy bleed out of lead frame and lead frame manufactured by using the same
08/08/2013US20130200505 Package manufacturing method and semiconductor device
08/08/2013US20130200504 Electronic component module and method for producing same
08/08/2013US20130200503 Protective layers in semiconductor packaging
08/08/2013US20130200502 Semiconductor Device and Method of Manufacturing Thereof
08/08/2013US20130200493 Electrostatic discharge protection device
08/08/2013US20130200481 Semiconductor device having groove-shaped via-hole
08/08/2013US20130200443 Interface Engineering to Optimize Metal-III-V Contacts
08/08/2013US20130200430 Electronic device with mircofilm antenna and related methods
08/08/2013US20130200429 Epitaxy level packaging
08/08/2013US20130200397 Semiconductor device
08/08/2013US20130200371 Device for detecting a laser attack in an integrated circuit chip
08/08/2013US20130200017 Greenhouse shelf structure with modularized solar power facility
08/08/2013US20130200016 Ballasted roof and ground mounted solar panel racking system
08/08/2013DE112008000994B4 Mikrochip mit aktiver Temperatursteuerung und Verfahren zu dessen Herstellung Microchip with active temperature control and process for its preparation
08/08/2013DE102013201868A1 Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool
08/08/2013DE102013101258A1 Halbleiterbauelement unter Verwendung von Diffusionslöten Semiconductor device using diffusion soldering
08/08/2013DE102013101222A1 Halbleitervorrichtung und Verfahren für ihre Herstellung Semiconductor device and methods for their preparation
08/08/2013DE102012201847A1 Elektronisches Bauelement Electronic component
08/08/2013DE102012105871A1 Verstellbarer Mäanderlinienwiderstand Adjustable Mäanderlinienwiderstand
08/08/2013DE102010015903B4 Ausrichtung eines rekonfigurierten Wafers Orientation of a reconfigured wafer
08/08/2013DE102009033442B4 Halbleiterbauelement mit einer Copolymerschicht und Verfahren zur Herstellung eines solchen Halbleiterbauelements A semiconductor device comprising a copolymer and method for producing such a semiconductor device
08/08/2013DE102006059501B4 Halbleitervorrichtung mit Halbleiterelement, Isolationssubstrat und Metallelektrode A semiconductor device having the semiconductor element, insulation substrate and metal electrode
08/07/2013EP2624320A1 Led module
08/07/2013EP2624297A1 Power semiconductor module and method for manufacturing same
08/07/2013EP2624296A1 Protection of an integrated circuit against invasive attacks
08/07/2013EP2624295A2 Semiconductor device and communication system including the same
08/07/2013EP2624294A1 Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board
08/07/2013EP2624293A1 Element housing package, and electronic device using the same
08/07/2013EP2624290A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2624289A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2624286A1 Method of manufacturing semiconductor device
08/07/2013EP2623874A1 Cooler and refrigeration device provided with same
08/07/2013EP2622654A1 Method for manufacturing of an electric actuator
08/07/2013EP2622636A1 Power routing with integrated decoupling capacitance
08/07/2013EP2622633A1 Corner structure for ic die
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