| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/11/1988 | EP0266827A1 Electronic component without leads, solid electrolytic capacitor and method of manufacturing same |
| 05/11/1988 | EP0266368A1 Corrosion resistant pins for metal packaged microcircuits |
| 05/11/1988 | DE3735985A1 Waermeleitender modul fuer gedruckte schaltungsplattenanordnung Waermeleitender module for printed circuit board assembly |
| 05/11/1988 | DE3735818A1 Kapsel eines leuchtelements mit integrierter kuehlkoerper- und ueberlastungsstromschutzschaltung Capsule of a luminous elements with integrated heat sink and ueberlastungsstromschutzschaltung |
| 05/11/1988 | DE3721929A1 Method for fabricating hermetically tight electrical conductor tracks in semiconductor elements |
| 05/11/1988 | DE3638102A1 Device for mounting heat-generating components on a heat sink |
| 05/11/1988 | DE3637513A1 Method of producing finely structured contact electrodes of power semiconductor components |
| 05/11/1988 | CN87104536A Integral heat pipe module |
| 05/10/1988 | US4744009 Protective carrier and securing means therefor |
| 05/10/1988 | US4744008 Flexible film chip carrier with decoupling capacitors |
| 05/10/1988 | US4744007 Large scale integrated package; multi-chip |
| 05/10/1988 | US4743956 Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging |
| 05/10/1988 | US4743639 Arylene sulfide polymers of improved impact strength |
| 05/10/1988 | US4743568 Multilevel interconnect transfer process |
| 05/10/1988 | US4743489 For mounting plurality of electronic circuit elements |
| 05/10/1988 | EP0252977A4 Ultra high density pad array chip carrier. |
| 05/05/1988 | WO1988002979A3 Liquid cooling system for integrated circuits |
| 05/05/1988 | WO1988002553A3 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 05/05/1988 | DE3636373A1 Connecting clip, method of producing a connecting clip and use of two connecting clips as connecting lugs for a varistor |
| 05/04/1988 | EP0266210A2 Electronic apparatus comprising a ceramic substrate |
| 05/04/1988 | EP0266093A2 Process of making a high power multi-layer semiconductive switching device with multiple parallel contacts |
| 05/04/1988 | EP0266029A1 Glass-ceramics suitable for dielectric substrates |
| 05/04/1988 | EP0265927A2 Wire stacked bonding method |
| 05/04/1988 | EP0265873A2 Holder for plastic leaded chip carrier |
| 05/04/1988 | EP0265833A1 Semiconductor component having at least one power MOSFET |
| 05/04/1988 | EP0265631A1 Use of tapered head pin design to improve the stress distribution in the braze joint |
| 05/04/1988 | EP0265615A2 Environmentally secure and thermally efficient heat sink assembly |
| 05/04/1988 | EP0265593A2 Field-effect transistor formed in a semi-insulating substrate |
| 05/03/1988 | US4742471 Method for improving wirability of master-image DCVS chips |
| 05/03/1988 | US4742425 Multiple-cell transistor with base and emitter fuse links |
| 05/03/1988 | US4742385 Multichip package having outer and inner power supply means |
| 05/03/1988 | US4742384 Hydrogenated amorphous silicon |
| 05/03/1988 | US4742383 Multi-function FET masterslice cell |
| 05/03/1988 | US4742325 Thin-film circuit and method of making the same |
| 05/03/1988 | US4742031 Oxides of lead, iron, niobium, tantalum |
| 05/03/1988 | US4742024 Semiconductor device and method of producing semiconductor device |
| 05/03/1988 | US4742023 Forming grooves in barrier metals, burying stoppers, etching; bumps for electrodes |
| 05/03/1988 | US4742019 Method for forming aligned interconnections between logic stages |
| 05/03/1988 | US4742014 Method of making metal contacts and interconnections for VLSI devices with copper as a primary conductor |
| 05/03/1988 | US4741787 Curable thermoplastic resin; coating, bonding, oxidation resistance |
| 05/03/1988 | US4741385 Gas jet impingement means and method |
| 05/03/1988 | CA1236130A1 Jig apparatus for arraying and supporting works to be soldered |
| 05/03/1988 | CA1235955A1 Automatic soldering apparatus |
| 04/28/1988 | DE3635708A1 Method and arrangement for connecting an electrode to a plurality of emitter/cathode regions of a semiconductor component |
| 04/28/1988 | DE3635375A1 Lead frame for electronic components |
| 04/27/1988 | EP0265367A1 Variable width ic bond pad arrangement |
| 04/27/1988 | EP0265340A2 Multilayer ceramic copper circuit board |
| 04/27/1988 | EP0265331A1 Doped semiconductor vias to contacts |
| 04/27/1988 | EP0265077A2 An anisotropic adhesive for bonding electrical components |
| 04/27/1988 | EP0264892A2 Cooling objects, for example semiconductor devices |
| 04/27/1988 | EP0264780A2 Hybrid integrated circuit device capable of being inserted into socket |
| 04/27/1988 | EP0264692A2 Method of forming a bridge contact |
| 04/27/1988 | EP0264648A1 Method of producing a film carrier |
| 04/27/1988 | EP0264635A2 Electrically conductible adhesive for a large temperature range |
| 04/27/1988 | EP0264469A1 Package density doubling device for semiconductor chips containing monolithically integrated circuits |
| 04/27/1988 | EP0264463A1 Copper-chromium-titanium-silicon alloy, process for its production and its use |
| 04/26/1988 | US4740868 Rail bonded multi-chip leadframe, method and package |
| 04/26/1988 | US4740866 Sealed-type liquid cooling device with expandable bellow for semiconductor chips |
| 04/26/1988 | US4740825 MOS semiconductor device having a low input resistance and a small drain capacitance |
| 04/26/1988 | US4740700 Thermally insulative and electrically conductive interconnect and process for making same |
| 04/26/1988 | US4740485 Titanium-tingsten fuse on semiconductor wafer; patterning, etching, masking |
| 04/26/1988 | US4740481 Method of preventing hillock formation in polysilicon layer by oxygen implanation |
| 04/26/1988 | CA1235839A1 Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions |
| 04/26/1988 | CA1235711A1 Method for producing multilayer ceramic circuit board |
| 04/21/1988 | WO1988002979A2 Liquid cooling system for integrated circuits |
| 04/21/1988 | WO1988002929A1 Low resistance electrical interconnection for synchronous rectifiers |
| 04/21/1988 | WO1988002788A1 Material for conductive parts of electronic and electric appliances |
| 04/20/1988 | EP0264134A2 Zirconium as an adhesion material in a multi-layer wiring substrate |
| 04/20/1988 | EP0264128A2 Jumper chip for semiconductor devices |
| 04/20/1988 | EP0264122A2 Method of producing a composite structure for a semiconductor device |
| 04/19/1988 | US4739449 Circuit package with thermal expansion relief chimney |
| 04/19/1988 | US4739448 Microwave multiport multilayered integrated circuit chip carrier |
| 04/19/1988 | US4739447 Mounting and connection device for power semi-conductors |
| 04/19/1988 | US4739446 Header for a wafer scale assembly |
| 04/19/1988 | US4739443 Thermally conductive module |
| 04/19/1988 | US4739389 High-frequency circuit arrangement and semiconductor device for use in such an arrangement |
| 04/19/1988 | US4739388 Integrated circuit structure for a quality check of a semiconductor substrate wafer |
| 04/19/1988 | US4739382 Package for a charge-coupled device with temperature dependent cooling |
| 04/19/1988 | US4739258 Dynamic testing of thin-film conductor |
| 04/19/1988 | US4739125 Electric component part having lead terminals |
| 04/19/1988 | US4738900 Heat resistant dielectric layer of a polymer of an aromatic dimaleimide and an aromatic dicyanamide |
| 04/19/1988 | CA1235528A1 Heat dissipation for electronic components on ceramic substrate |
| 04/14/1988 | DE3633926A1 Earth contact for a p-i-n diode |
| 04/14/1988 | DE3628556C1 Semiconductor device |
| 04/13/1988 | EP0263729A1 Connecting device for a static power switch with prewired pliant conductive leads |
| 04/13/1988 | EP0263574A1 A method of manufacturing a semiconductor device, and a semiconductor device, having at least one selectively actuable conductive line |
| 04/13/1988 | EP0263348A2 Process for defining vias through silicon nitride and polyimide |
| 04/13/1988 | EP0263322A2 Method of making sloped vias |
| 04/12/1988 | US4737884 Semiconductor device module |
| 04/12/1988 | US4737839 Semiconductor chip mounting system |
| 04/12/1988 | US4737838 Capacitor built-in semiconductor integrated circuit and process of fabrication thereof |
| 04/12/1988 | US4737836 VLSI integrated circuit having parallel bonding areas |
| 04/12/1988 | US4737835 Read only memory semiconductor device |
| 04/12/1988 | US4737830 Integrated circuit structure having compensating means for self-inductance effects |
| 04/12/1988 | US4737620 Method of manufacturing cards having an electronic memory and cards obtained by performing said method |
| 04/12/1988 | US4737474 Depositing amorphous silicon and silicide layers and sintering |
| 04/12/1988 | US4737468 Semiconductors |
| 04/12/1988 | US4737395 Printed wiring board for mounting electronic parts and process for producing the same |
| 04/12/1988 | US4737236 Multiple circuits made and tested before subdivision and separation |
| 04/12/1988 | US4737217 Method of fabricating a substrate for a semiconductor chip package |