| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/08/1988 | EP0270069A2 Module with power semiconductor circuits elements |
| 06/08/1988 | EP0270067A2 Method of making a semiconductor device comprising at least two semiconductor chips |
| 06/08/1988 | EP0269775A1 Protection device against lightning by means of a fusible resistance made by screening, production method and use in board calculators in aircraft |
| 06/08/1988 | EP0269679A1 Electrical circuit interconnection |
| 06/08/1988 | EP0168456B1 Mounting and connection device for power semi-conductors |
| 06/08/1988 | CN87106380A Outer lead tape automated bonding system |
| 06/07/1988 | US4750092 Interconnection package suitable for electronic devices and methods for producing same |
| 06/07/1988 | US4750089 Circuit board with a chip carrier and mounting structure connected to the chip carrier |
| 06/07/1988 | US4750086 Apparatus for cooling integrated circuit chips with forced coolant jet |
| 06/07/1988 | US4750081 Phantom ESD protection circuit employing E-field crowding |
| 06/07/1988 | US4750031 Moulded ring frame of polyamideimide adhered along edge to metal base plate; lightweight |
| 06/07/1988 | US4750030 Resin-molded semiconductor device having heat radiating plate embedded in the resin |
| 06/07/1988 | US4750029 Copper base lead material for leads of semiconductor devices |
| 06/07/1988 | US4750027 Master slice semiconductor device |
| 06/07/1988 | US4750026 C MOS IC and method of making the same |
| 06/07/1988 | US4749631 Protective coatings for electronic devices |
| 06/07/1988 | US4749621 Electronic components comprising polyimide-filled isolation structures |
| 06/07/1988 | US4749548 Copper alloy lead material for use in semiconductor device |
| 06/07/1988 | US4749442 Layers of metal combined with semiconductor in contact windows |
| 06/07/1988 | CA1237828A1 Semiconductor-on-insulator (soi) device having electrical short to avoid charge accumulation |
| 06/07/1988 | CA1237825A1 Plastic resin and fibre encapsulation of electronic circuit device and method and apparatus for making same |
| 06/07/1988 | CA1237823A1 Laminated semiconducter assembly |
| 06/02/1988 | WO1988003919A1 Tungsten paste for co-sintering with pure alumina and method for producing same |
| 06/02/1988 | WO1988003917A1 Alumina materials for low temperature co-sintering with refractory metallization ii |
| 06/01/1988 | EP0269567A2 Potentially adhesive electrically conductive composition |
| 06/01/1988 | EP0269466A1 Duplex glass preforms for hermetic glass-to-metal sealing |
| 06/01/1988 | EP0269410A2 Packaging of semiconductor elements |
| 06/01/1988 | EP0269336A2 Semiconductor integrated circuit packages |
| 06/01/1988 | EP0269211A2 Semiconductor device having a metallic layer |
| 06/01/1988 | EP0269095A2 Integrated semiconductor circuit with at least two planes made of aluminium or aluminium compound and method of manufacturing the same |
| 06/01/1988 | EP0269065A2 Immersion cooled circuit module with improved fins |
| 06/01/1988 | EP0269063A2 Mullite ceramic multi-layered substrate and process for producing the same |
| 06/01/1988 | EP0269019A2 Method for producing a semiconductor device |
| 06/01/1988 | EP0269008A2 Semiconductor device with improved passivation film and process of fabrication thereof |
| 06/01/1988 | EP0268971A2 Electrical interconnect support system with low dielectric constant |
| 06/01/1988 | EP0268935A1 Vertically pluggable single-in-line circuit module |
| 06/01/1988 | EP0268671A1 Transformer structure |
| 06/01/1988 | EP0268643A1 Electrical circuit interconnection |
| 06/01/1988 | EP0268599A1 Semi-conductor component |
| 06/01/1988 | EP0186667B1 Mounting semi-conductor chips |
| 05/31/1988 | US4748538 Semiconductor module |
| 05/31/1988 | US4748495 High density multi-chip interconnection and cooling package |
| 05/31/1988 | US4748494 Lead arrangement for reducing voltage variation |
| 05/31/1988 | US4748493 Diode and metal stud therefor |
| 05/31/1988 | US4748491 Redundant circuit of semiconductor device and method of producing same |
| 05/31/1988 | US4748490 Deep polysilicon emitter antifuse memory cell |
| 05/31/1988 | US4748488 Master-slice-type semiconductor integrated circuit device |
| 05/31/1988 | US4748483 Mechanical pressure Schottky contact array |
| 05/31/1988 | US4748086 Formation of copper electrode on ceramic oxide |
| 05/31/1988 | US4748085 Multilayer ceramic circuit board fired at a low temperature |
| 05/31/1988 | US4747889 Interconnecting wire for semiconductor devices |
| 05/31/1988 | US4747450 Method for producing heat sink and heat sink thus produced |
| 05/31/1988 | CA1237533A1 Deformable integrated circuit chip carrier |
| 05/26/1988 | DE3639595A1 Device and method for making contact to the terminal pins of a semiconductor package |
| 05/25/1988 | EP0268260A1 Flexible film chip carrier with decoupling capacitors |
| 05/25/1988 | EP0268181A1 Plastic molded pin grid chip carrier package |
| 05/25/1988 | EP0268142A2 Tamper-resistant packaging for protection of information stored in electronic circuitry |
| 05/25/1988 | EP0268111A2 Interposer chip technique for making engineering changes between interconnected semiconductor chips |
| 05/25/1988 | EP0268081A1 Cooling device for semiconductor components |
| 05/25/1988 | EP0268027A1 Silicide to silicon bond |
| 05/25/1988 | CN87107692A Method of fabricating semiconductor devices |
| 05/25/1988 | CN87102044A Chip holder for semiconductor silicon element |
| 05/25/1988 | CN85107549B Diffusion isolation layer for maskless cladding process |
| 05/24/1988 | US4747078 Semiconductor memory device |
| 05/24/1988 | US4747076 Method of writing information into a fuse-type ROM |
| 05/24/1988 | US4747017 Surface mountable integrated circuit package equipped with sockets |
| 05/24/1988 | US4746966 Logic-circuit layout for large-scale integrated circuits |
| 05/24/1988 | US4746965 Integrated semiconductor circuit device |
| 05/24/1988 | US4746963 Semiconductor devcice |
| 05/24/1988 | US4746815 Electronic EC for minimizing EC pads |
| 05/24/1988 | US4746623 Method of making bipolar semiconductor device with wall spacer |
| 05/24/1988 | US4746583 Ceramic combined cover |
| 05/24/1988 | US4746392 Lamination, multilayer, silicone rubber |
| 05/24/1988 | US4746389 Method for producing a clean, highly conductive surface for mating composite articles |
| 05/24/1988 | US4746219 Local interconnect |
| 05/24/1988 | US4746055 Method and connecting material for the metallic joining of parts |
| 05/24/1988 | US4745760 Cryogenic fluid transfer conduit |
| 05/19/1988 | WO1988003707A1 Apparatus and method for forming fusible links |
| 05/19/1988 | WO1988003705A1 Semiconductor die attach system |
| 05/19/1988 | WO1988003704A1 Attachment of semiconductor die to lead frame by means of an adhesive resin |
| 05/18/1988 | EP0267862A1 Compensating element for thermal or mechanical strain, especially for a printed circuit, and process for making such an element for use in a printed circuit |
| 05/18/1988 | EP0267772A2 Heat exchanger and method of making same |
| 05/18/1988 | EP0267730A2 Tungsten metallization |
| 05/18/1988 | EP0267360A2 High performance integrated circuit packaging structure |
| 05/18/1988 | EP0267216A1 Improvements in or relating to integrated circuits. |
| 05/18/1988 | EP0066835B1 Method of marking semiconductor chips, and marked semiconductor chip |
| 05/17/1988 | US4745470 Endoscope using a chip carrier type solid state imaging device |
| 05/17/1988 | US4745457 Electronic substrate article and method of preparation |
| 05/17/1988 | US4745456 Heat sink clip assembly |
| 05/17/1988 | US4745455 Silicon packages for power semiconductor devices |
| 05/17/1988 | US4745258 Apparatus for laser-cutting metal interconnections in a semiconductor device |
| 05/17/1988 | US4745084 Method of making a customized semiconductor integrated device |
| 05/17/1988 | US4745036 Jumper chip for semiconductor devices |
| 05/17/1988 | US4744858 Integrated circuit metallization with reduced electromigration |
| 05/17/1988 | US4744850 Method for bonding an LSI chip on a wiring base |
| 05/17/1988 | US4744672 Semiconductor arrangement |
| 05/17/1988 | CA1236930A1 Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric |
| 05/17/1988 | CA1236926A1 Method and structure for effecting engineering changes in a multiple device module package |
| 05/17/1988 | CA1236918A1 Wafer level integration technique |
| 05/11/1988 | EP0266877A2 Metallized substrates and process for their production |