| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/13/1988 | CN87108334A Method of fabricating semiconductor device with reduced packaging stress |
| 07/12/1988 | US4757370 Circuit package cooling technique with liquid film spreading downward across package surface without separation |
| 07/12/1988 | US4757361 Amorphous thin film transistor device |
| 07/12/1988 | US4757359 Thin oxide fuse |
| 07/12/1988 | US4757033 Forming two layer insulating film on surface of substrate, patterning, etching, depositing electrode metal |
| 07/12/1988 | US4756976 Ceramic with anisotropic heat conduction |
| 07/12/1988 | US4756927 Introducing gas mixture of tungsten, molybdenum, or titanium compound and silicon or germanium compound into chamber, subjecting to laser irradiation to form refractory metal pattern on semiconductor substrate |
| 07/12/1988 | US4756414 Antistatic sheet material and package |
| 07/12/1988 | CA1239229A1 Method of forming a pressure-contact type semiconductor device |
| 07/06/1988 | EP0273725A2 Encapsulated semiconductor device |
| 07/06/1988 | EP0273704A2 In situ low temperature siloxane gel |
| 07/06/1988 | EP0273703A2 An adaptive lithography method and system |
| 07/06/1988 | EP0273629A2 Transition metal clad interconnect for integrated circuits |
| 07/06/1988 | EP0273556A1 Integrated-circuit chip packaging construction |
| 07/06/1988 | EP0273261A2 A method of routing connections among blocks on a carrier |
| 07/06/1988 | EP0273207A2 Polyimides reaction products and use in electrophoretic deposition |
| 07/05/1988 | US4755910 Housing for encapsulating an electronic circuit |
| 07/05/1988 | US4755866 Electronic circuit module |
| 07/05/1988 | US4755676 Low temperature assembly |
| 07/05/1988 | US4755482 Making semiconductor device on insulating substrate by forming conductive layers on both major surfaces |
| 07/05/1988 | US4755478 Method of forming metal-strapped polysilicon gate electrode for FET device |
| 07/05/1988 | US4755417 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method |
| 07/05/1988 | US4755249 Mounting base pad means for semiconductor devices and method of preparing same |
| 07/05/1988 | US4755146 Heat-dissipating socket connector for leaded modules |
| 07/05/1988 | US4754912 Controlled collapse thermocompression gang bonding |
| 07/05/1988 | CA1238986A1 Integrated circuit chip manufacture |
| 07/05/1988 | CA1238959A1 Area-bonding tape |
| 06/30/1988 | WO1988004833A1 Infrared detector with improved heat dissipation |
| 06/30/1988 | WO1988004831A1 Conductive plug for contacts and vias on integrated circuits |
| 06/30/1988 | DE3643288A1 Semiconductor assembly |
| 06/29/1988 | EP0273003A1 Potentially adhesive electrically conductive composition |
| 06/29/1988 | EP0272990A1 Ceramic combined cover for a semiconductor package |
| 06/29/1988 | EP0272839A2 Polyarylene thioether composition for use in packaging, as well as molded product prepared therefrom |
| 06/29/1988 | EP0272743A2 Improved device for clamping together a semiconductor and its related heat sink |
| 06/29/1988 | EP0272506A2 Thin film transistor array for liquid crystal displays allowing in-process testing, testing method, and information entry system comprising such an array |
| 06/29/1988 | EP0272433A2 Integrated semiconductor circuit having load resistors arranged as thin-film bars in the field oxide regions separating the active transistor regions, and process for their manufacture |
| 06/29/1988 | EP0272390A2 Packages for a semiconductor device |
| 06/29/1988 | CN87108030A Mullite ceramic multi-layered substrate and process for producing same |
| 06/29/1988 | CN86107440A Protecting device of the semiconductor detector |
| 06/28/1988 | US4754371 Large scale integrated circuit package |
| 06/28/1988 | US4754319 IC card and method for manufacturing the same |
| 06/28/1988 | US4754318 Semiconductor device |
| 06/28/1988 | US4754317 Integrated circuit die-to-lead frame interconnection assembly and method |
| 06/28/1988 | US4754311 Semiconductor device with contacts to parallel electrode strips |
| 06/28/1988 | US4754243 Microwave component mounting |
| 06/28/1988 | US4754003 Phenol ethers containing epoxide groups |
| 06/28/1988 | US4753863 Chromium oxide, titanium dioxide, carbon black, encapsulation of electronic parts |
| 06/28/1988 | US4753856 Multilayer ceramic coatings from silicate esters and metal oxides |
| 06/28/1988 | US4753855 Multilayer ceramic coatings from metal oxides for protection of electronic devices |
| 06/28/1988 | US4753820 Alignment to ensure registration of bond pads with leads |
| 06/28/1988 | US4753709 Method for etching contact vias in a semiconductor device |
| 06/28/1988 | US4753694 Process for forming multilayered ceramic substrate having solid metal conductors |
| 06/28/1988 | US4753290 Reduced-stress heat sink device |
| 06/28/1988 | US4753287 Circuit board installation |
| 06/28/1988 | CA1238720A1 Transistor devices for microwave oscillator elements |
| 06/22/1988 | EP0272188A2 Ceramic package for high frequency semiconductor devices |
| 06/22/1988 | EP0272187A2 Plastic package for high frequency semiconductor devices |
| 06/22/1988 | EP0272051A2 Reduced area butting contact structure |
| 06/22/1988 | EP0272046A2 Circuit arrangement including a composite ceramic substrate |
| 06/22/1988 | EP0271772A2 Epoxy resin molding compounds |
| 06/22/1988 | EP0271533A1 Electrical device transport medium. |
| 06/22/1988 | EP0271509A1 Staggered radial-fin heat sink device for integrated circuit package. |
| 06/22/1988 | CN87201554U Miniature glass-enveloped temp. compensation biode |
| 06/22/1988 | CN87107402A 半导体器件 Semiconductor devices |
| 06/22/1988 | CN87107389A Temperature controlled hybrid assembly |
| 06/21/1988 | US4752816 Electronic component |
| 06/21/1988 | US4752555 Conductor, resistor and insulating resin layers; second conductor formed by plating insulator, etching |
| 06/21/1988 | US4752442 Bonding wire |
| 06/21/1988 | US4752333 Alloys having high electrical and mechanical characteristics, the production thereof and the uses thereof in particular in the electrical, electronic and connection arts |
| 06/21/1988 | US4752118 Electric circuits having repairable circuit lines and method of making the same |
| 06/21/1988 | CA1238428A1 Thermally enhanced integrated circuit carrier package |
| 06/16/1988 | WO1988004473A1 Enhanced density modified isoplanar process |
| 06/15/1988 | EP0271232A1 Method of making an article comprising a heteroepitaxial structure |
| 06/15/1988 | EP0271110A2 Semiconductor device comprising an electrode pad |
| 06/15/1988 | EP0271070A1 Semiconductor device with silicide conductive layers and process of fabrication thereof |
| 06/15/1988 | EP0271018A2 Thin film solid state device |
| 06/15/1988 | EP0270820A2 Preparing the leads of a surface-mountable component |
| 06/15/1988 | EP0270752A1 Substrates for integrated circuit packages |
| 06/15/1988 | CN87208107U Solid power device with temp. protective switch |
| 06/14/1988 | US4751611 Semiconductor package structure |
| 06/14/1988 | US4751564 Multiple wafer scale assembly apparatus and fixture for use during the fabrication thereof |
| 06/14/1988 | US4751563 Microminiaturized electrical interconnection device and its method of fabrication |
| 06/14/1988 | US4751562 Field-effect semiconductor device |
| 06/14/1988 | US4751482 Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection |
| 06/14/1988 | US4751349 Thin film integrated circuit |
| 06/14/1988 | US4751197 Make-link programming of semiconductor devices using laser enhanced thermal breakdown of insulator |
| 06/14/1988 | US4751193 Remelting recrystallized areas |
| 06/14/1988 | US4750666 Method of fabricating gold bumps on IC's and power chips |
| 06/14/1988 | US4750665 Method of producing a combination cover |
| 06/14/1988 | CA1238123A1 Hermetically sealed enclosure for thin film devices |
| 06/14/1988 | CA1238120A1 Packaged integrated circuit chip |
| 06/14/1988 | CA1238119A1 Packaged semiconductor chip |
| 06/14/1988 | CA1238114A1 Chip carrier mounting apparatus |
| 06/14/1988 | CA1238106A1 Casing for electrical components, component assemblies or integrated circuits |
| 06/09/1988 | DE3739489A1 Compression-moulding resin compound, and compression-moulded electronic component |
| 06/08/1988 | EP0270461A2 Universal leadframe carrier and insert for holding and bonding semiconductor chip to leadframe leads |
| 06/08/1988 | EP0270263A2 Multilayer ceramic coatings from metal oxides for protection of electronic devices |
| 06/08/1988 | EP0270241A2 Multilayer ceramics from silicate esters |
| 06/08/1988 | EP0270229A2 Platinum and rhodium catalysis of low temperature formation multilayer ceramics |
| 06/08/1988 | EP0270184A2 Integrated semiconductor circuit having a multilayer metallization |