| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/17/1988 | EP0278432A1 Bridge arm with free-wheel diodes |
| 08/17/1988 | EP0278413A2 Method for making a connection between a bonding wire and a contact pad in hybrid thick-film circuits |
| 08/17/1988 | EP0278240A2 Heat sink, particularly for cooling electronic components |
| 08/17/1988 | EP0278093A2 Semiconductor structure with a multilayer contact |
| 08/17/1988 | EP0278077A2 Assembly with temperature sensitive devices |
| 08/17/1988 | EP0278065A2 Semiconductor integrated circuit latch-up preventing apparatus |
| 08/17/1988 | CN87107417A Multilayer ceramic coatings from silicate esters and metal oxides |
| 08/16/1988 | US4764846 High density electronic package comprising stacked sub-modules |
| 08/16/1988 | US4764845 Cooled component assembly |
| 08/16/1988 | US4764804 Semiconductor device and process for producing the same |
| 08/16/1988 | US4764802 Semiconductor devices |
| 08/16/1988 | US4764800 Semiconductor region extends under impermeable enclosure |
| 08/16/1988 | US4764644 Microelectronics apparatus |
| 08/16/1988 | US4764571 Epoxy resins from dicyclopentadiene-phenol adducts and a method of preparing the same |
| 08/16/1988 | US4764486 Sintered glass-powder product |
| 08/16/1988 | US4764485 Method for producing via holes in polymer dielectrics |
| 08/16/1988 | US4764416 Electric element circuit using oxidation-reduction substances |
| 08/16/1988 | US4764413 Dielectric of thin polymer film; electroconductive metal wiring; display panels |
| 08/16/1988 | US4764396 Method for preventing aluminum corrosion in electronic parts |
| 08/16/1988 | US4764235 Process and apparatus for sealing semiconductor packages |
| 08/16/1988 | US4764233 Sheets from mixtures of silica of different crystal forms scurried with binder; lamination, firing |
| 08/16/1988 | US4763409 Method of manufacturing semiconductor device |
| 08/16/1988 | US4763407 Method of manufacturing a semiconductor device |
| 08/11/1988 | WO1988005962A1 Support assembly for integrated circuits |
| 08/11/1988 | WO1988005961A1 Semiconductor device and method of fabricating the same |
| 08/11/1988 | WO1988005957A1 Electronic component processing apparatus |
| 08/11/1988 | WO1988005706A1 Low stress heat sinking for semiconductors |
| 08/11/1988 | DE3702837A1 Coating-glass composition |
| 08/10/1988 | EP0277606A2 Full panel electronic packaging structure |
| 08/10/1988 | EP0277546A1 Semiconductor device having at least one semiconductor body |
| 08/10/1988 | CN87203423U Full hard-closing structure for silicon elements |
| 08/10/1988 | CN85103578B Method of manufacturing a semiconductor device |
| 08/09/1988 | US4763298 Memory assembly with cooling insert |
| 08/09/1988 | US4763223 Display apparatus |
| 08/09/1988 | US4763188 Packaging system for multiple semiconductor devices |
| 08/09/1988 | US4763183 Semiconductor-on-insulator (SOI) devices and SOI IC fabrication method |
| 08/09/1988 | US4762606 Mini chip carrier slotted array |
| 08/09/1988 | US4762174 Diamonds, boron nitride, sapphire, silicon carbide |
| 08/09/1988 | US4761880 Method of obtaining surface mount component planarity |
| 08/09/1988 | CA1240410A1 Bonding method of semiconductor device |
| 08/09/1988 | CA1240409A1 Ceramic microcircuit package |
| 08/09/1988 | CA1240373A1 Surface mountable microwave ic package |
| 08/09/1988 | CA1240371A1 Coplanar microstrap waveguide |
| 08/04/1988 | DE3703728C1 Arrangement for mounting heat-generating electrical circuit elements on a circuit board |
| 08/03/1988 | EP0276940A2 Semiconductor chip having external terminals connected to corresponding leads by wires |
| 08/03/1988 | EP0276928A2 Wire Bonding |
| 08/03/1988 | EP0276788A2 Aluminium nitride sintered body formed with metallized layer and method of manufacturing the same |
| 08/03/1988 | EP0276607A1 Ventilation device for components arranged in rows on a plate |
| 08/03/1988 | EP0276345A1 Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity |
| 08/03/1988 | EP0276321A1 Spherical corundum particles, process for their production, and highly heat-conductive rubber or plastic composition containing them |
| 08/02/1988 | US4761788 Stripline mount for semiconductor lasers |
| 08/02/1988 | US4761678 Integrated circuit semiconductor device |
| 08/02/1988 | US4761677 Doped polyacetylene layers |
| 08/02/1988 | US4761518 Semiconductor casing |
| 08/02/1988 | US4761386 Monolithic silicon integrated circuit |
| 08/02/1988 | US4761335 Alpha-particle protection of semiconductor devices |
| 08/02/1988 | US4761325 Copper conductors separated by glass-ceramic insulating layers |
| 08/02/1988 | US4761140 Minimum insertion force self-cleaning anti-overstress PLCC receiving socket |
| 08/02/1988 | US4760673 Lead frame finishing apparatus |
| 08/02/1988 | CA1240071A1 Housing for an electronic device |
| 07/28/1988 | DE3701310A1 Contact-making device for making contact with surface-mounted integrated circuits |
| 07/27/1988 | EP0276087A2 Improved multilayer interconnection for integrated circuit structure having two or more conductive metal layers and method of making same |
| 07/27/1988 | EP0276052A2 Memory system assembly |
| 07/27/1988 | EP0276004A2 Multilayer ceramic substrate and method for making the same |
| 07/27/1988 | EP0275973A2 Integrated circuit package |
| 07/27/1988 | EP0275595A1 Process for producing interconnecting lines and interlevels via crossings in an integrated circuit |
| 07/27/1988 | EP0275588A1 Method of fabricating a semiconductor device with reduced packaging stress |
| 07/27/1988 | EP0275433A1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |
| 07/27/1988 | EP0275299A1 Semiconductor devices having improved metallization |
| 07/27/1988 | EP0275261A1 Semi-conductor component |
| 07/26/1988 | US4760440 Package for solid state image sensors |
| 07/26/1988 | US4760434 Semiconductor device with protective means against overheating |
| 07/26/1988 | US4760289 Two-level differential cascode current switch masterslice |
| 07/26/1988 | US4760037 Pressure contact type semiconductor device |
| 07/26/1988 | US4760032 Screening of gate oxides on semiconductors |
| 07/26/1988 | US4759970 Electronic carrier devices and methods of manufacture |
| 07/26/1988 | US4759403 Hydraulic manifold for water cooling of multi-chip electric modules |
| 07/20/1988 | EP0275122A2 Chip package transmissive to ultraviolet light |
| 07/20/1988 | EP0274941A1 Low noise hyperfrequency semiconductor device mounted in a housing |
| 07/20/1988 | EP0274614A2 Circuit package cooling system |
| 07/20/1988 | CN87108326A Semiconductor apparatus |
| 07/19/1988 | US4758984 Semiconductor memory device including read only memory element for storing fixed information |
| 07/19/1988 | US4758926 Fluid-cooled integrated circuit package |
| 07/19/1988 | US4758876 Thermal protective device with bimetal for semiconductor devices and the like |
| 07/19/1988 | US4758875 Resin encapsulated semiconductor device |
| 07/19/1988 | US4758874 Diode and metal stud therefor |
| 07/19/1988 | US4758848 Method and apparatus for marking a pattern on an article with a laser including partial feedback of the laser output for generating the marking beam |
| 07/19/1988 | US4758814 Structure and method for wire lead attachment to a high temperature ceramic sensor |
| 07/19/1988 | US4758306 Masking; tapering sidewalls; forming electroconductive layer on dielectric |
| 07/19/1988 | US4758176 IC socket |
| 07/19/1988 | US4757934 Low stress heat sinking for semiconductors |
| 07/19/1988 | CA1239483A1 Bond wire transmission line |
| 07/14/1988 | WO1988005254A1 Process for producing formable and high strength leadframes in semiconductor packages |
| 07/14/1988 | WO1988005251A1 High density electronic package comprising stacked sub-modules |
| 07/13/1988 | EP0274421A2 Device and systems based on novel superconducting material |
| 07/13/1988 | EP0274407A2 Devices and systems based on novel superconducting material |
| 07/13/1988 | EP0274355A2 7,7',8,8'-Tetracyanoquinonedimethane salts of quaternised addition polymers |
| 07/13/1988 | EP0274313A1 Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging |
| 07/13/1988 | EP0274274A2 Multilayer ceramic coatings from silicate esters and metal oxides |
| 07/13/1988 | EP0274263A2 Cryostat and cryogenically cooled computer system |