| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/20/1988 | US4772935 Die bonding process |
| 09/20/1988 | US4772930 Complementary metal oxide semiconductor integrated circuit with unequal reference voltages |
| 09/20/1988 | US4772644 Method for resin encapsulation of a semiconductor device and a resin composition therefor |
| 09/20/1988 | US4772571 Annealing, metallization, nondiffusion of silicon |
| 09/14/1988 | EP0282396A1 Complex hybrid circuit structure, and its production method |
| 09/14/1988 | EP0282307A1 Resilient electrically and thermally conductive flexible composite |
| 09/14/1988 | EP0282226A2 High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism |
| 09/14/1988 | EP0282124A2 Method for manufacturing a modular semiconductor power device and device obtained thereby |
| 09/14/1988 | EP0282082A2 Basic cell of gate array device |
| 09/14/1988 | EP0282025A2 Semiconductor device with fuse function |
| 09/14/1988 | EP0282012A2 Superconducting semiconductor device |
| 09/14/1988 | EP0281900A2 Removable holder and method for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 09/14/1988 | EP0281899A2 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 09/14/1988 | EP0281553A1 Method of manufacturing integrated circuits |
| 09/14/1988 | EP0281552A1 Integrated circuits |
| 09/13/1988 | US4771366 Ceramic card assembly having enhanced power distribution and cooling |
| 09/13/1988 | US4771330 Wire bonds and electrical contacts of an integrated circuit device |
| 09/13/1988 | US4771329 Wirings in semiconductor integrated circuit and method thereof |
| 09/13/1988 | US4771322 Semiconductor memory device with low-noise structure |
| 09/13/1988 | US4770953 Circuit substrates |
| 09/13/1988 | US4770923 Protection film structure for functional devices |
| 09/13/1988 | US4770897 Multilayer interconnection system for multichip high performance semiconductor packaging |
| 09/13/1988 | US4770640 Electrical interconnection device for integrated circuits |
| 09/13/1988 | US4770242 Cooling device of semiconductor chips |
| 09/13/1988 | US4770119 Support device for plating an item having fine parts |
| 09/13/1988 | US4769905 Apparatus and method for loading semiconductor chip carriers into sockets |
| 09/13/1988 | US4769883 Method for tuning a microwave integrated circuit |
| 09/13/1988 | CA1242036A1 Rapid solidified soldering filler metals |
| 09/08/1988 | DE3805490A1 Semiconductor device |
| 09/07/1988 | WO1988006818A1 Press-fit type piezoelectric vibrator and piezoelectric oscillator |
| 09/07/1988 | EP0281324A2 Improved passivation for integrated circuit structures |
| 09/07/1988 | EP0281220A1 Composite substrate for integrated circuits |
| 09/07/1988 | EP0281140A2 Semiconductor memory device and method for manufacturing the same |
| 09/07/1988 | EP0281038A2 Film carrier and method of manufacturing same |
| 09/07/1988 | EP0280700A1 Circuit package attachment apparatus and method. |
| 09/07/1988 | EP0144866B1 Semiconductor device comprising a substrate |
| 09/06/1988 | US4769744 Semiconductor chip packages having solder layers of enhanced durability |
| 09/06/1988 | US4769690 Metallizing paste for silicon carbide sintered body and a semiconductor device including the same |
| 09/06/1988 | US4769525 Circuit package attachment apparatus and method |
| 09/06/1988 | US4769523 Laser processing apparatus |
| 09/06/1988 | US4769345 Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor |
| 09/06/1988 | US4769344 Method of resin encapsulating a semiconductor device |
| 09/06/1988 | US4769294 Alumina materials for low temperature co-sintering with refractory metallization |
| 09/06/1988 | US4769272 Ceramic lid hermetic seal package structure |
| 09/06/1988 | US4768581 Cooling system for semiconductor modules |
| 09/06/1988 | US4768352 Cooling structure for integrated circuits |
| 08/31/1988 | EP0280587A1 Spacer masked VLSI process |
| 08/31/1988 | EP0280565A2 Test socket incorporating circuit elements |
| 08/31/1988 | EP0280292A2 Method of manufacturing a layer of oxide superconductive material |
| 08/31/1988 | EP0280235A2 3-phase bridge converting circuit module |
| 08/31/1988 | EP0280176A1 Basic cell for a gate array |
| 08/31/1988 | EP0280089A1 Process for the manufacture of a titanium/titanium nitride double layer for use as a contact and barrier layer in very large scale integrated circuits |
| 08/31/1988 | EP0279996A1 Multiple chip interconnection system and package |
| 08/31/1988 | EP0279814A1 Thermally insulative and electrically conductive interconnect and process for making same. |
| 08/31/1988 | CN88100934A Circuit comprising conductive line for transfer of high-speed signals |
| 08/30/1988 | US4768199 Mechanism for self-adjusting positioning of a semiconductor laser relative to an optical fiber to be coupled thereto |
| 08/30/1988 | US4768081 Fine powder mixture of zirconium and zirconium hydride in gas permeable silicone rubber |
| 08/30/1988 | US4768079 Field effect transistor device |
| 08/30/1988 | US4768078 Plastic-molded semiconductor device |
| 08/30/1988 | US4768077 Lead frame having non-conductive tie-bar for use in integrated circuit packages |
| 08/30/1988 | US4768075 Power semiconductor module |
| 08/30/1988 | US4767674 Metal cored board and method for manufacturing same |
| 08/30/1988 | US4767049 Annealing metal substrate to give oxide, then reduction to produce irregular surface |
| 08/30/1988 | US4766842 Method and means for wave soldering of leads of an integrated circuit package |
| 08/30/1988 | US4766670 Full panel electronic packaging structure and method of making same |
| 08/30/1988 | US4766653 Method and tool for assembling power semiconductor and heat sink |
| 08/30/1988 | CA1241458A1 Side-etching method of making bipolar transistor |
| 08/30/1988 | CA1241457A1 Integrated devices having titanium carbonitride diffusion barrier layer |
| 08/30/1988 | CA1241402A1 Electrical contact pin for printed circuit board |
| 08/30/1988 | CA1241401A1 Leaded chip carrier connector |
| 08/25/1988 | WO1988006395A1 Process for manufacturing plastic pin grid arrays and the product produced thereby |
| 08/25/1988 | WO1988006348A1 Integrated circuit package assembly |
| 08/24/1988 | EP0279769A2 Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material |
| 08/24/1988 | EP0279751A2 Minimum insertion force self-cleaning anti-overstress PLCC receiving socket |
| 08/24/1988 | EP0279683A2 Semiconductor device and method of its manufacture |
| 08/24/1988 | EP0279497A1 Circuit with conducting lines for the transfer of fast signals |
| 08/23/1988 | US4766518 Box for the thermal stabilization of equipment, such as electronic components contained therein |
| 08/23/1988 | US4766516 Method and apparatus for securing integrated circuits from unauthorized copying and use |
| 08/23/1988 | US4766481 Power semiconductor module |
| 08/23/1988 | US4766479 Low resistance electrical interconnection for synchronous rectifiers |
| 08/23/1988 | US4766478 Lead frame for semi-conductor device and process of connecting same |
| 08/23/1988 | US4766476 C-MOS technology base cell |
| 08/23/1988 | US4766475 Semiconductor integrated circuit device having an improved buffer arrangement |
| 08/23/1988 | US4766426 Display panel assembly having a plurality of film carrier tapes on each of which a semiconductor divice is mounted |
| 08/23/1988 | US4766089 Covering electrodes with dielectric layers to maintain separation when using overlapping contact window masks |
| 08/23/1988 | US4766010 Improver decarbonization |
| 08/23/1988 | US4766006 Low temperature |
| 08/23/1988 | US4765528 Plating process for an electronic part |
| 08/23/1988 | US4765400 Circuit module with pins conducting heat from floating plate contacting heat producing device |
| 08/23/1988 | US4765397 Immersion cooled circuit module with improved fins |
| 08/23/1988 | US4765376 Lead straightening for leaded packaged electronic components |
| 08/23/1988 | CA1241127A1 Electric circuits having repairable circuit lines and method of making the same |
| 08/23/1988 | CA1241115A1 Automatic layout for cascode voltage switch logic |
| 08/23/1988 | CA1241079A1 Laminar electrical component with magnesium orthoborate |
| 08/18/1988 | DE3803088A1 Polyimid-siloxane, verfahren zu deren herstellung und ihre verwendung Polyimide siloxanes, processes for their preparation and their use |
| 08/18/1988 | DE3703280A1 Circuit arrangement containing one or more integrated circuits |
| 08/17/1988 | EP0278857A2 Master slice type integrated circuit |
| 08/17/1988 | EP0278741A2 Electronic component parts and method for manufacturing the same |
| 08/17/1988 | EP0278585A1 Packaged solid state surge protector |
| 08/17/1988 | EP0278463A2 Gate array having transistor buried in interconnection region |