H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1988
10/25/1988	US4779981 Reject chip marking device and method of discriminating reject mark
10/25/1988	US4779340 Programmable electronic interconnect system and method of making
10/20/1988	WO1988008204A1 Liquid immersion cooling assembly for integrated circuits
10/20/1988	WO1988008203A1 Packaging system for stacking integrated circuits
10/19/1988	EP0287451A1 Test and mounting connection method for an electronic component
10/19/1988	EP0287031A2 High breakdown voltage insulating film provided between polysilicon layers
10/19/1988	EP0286876A2 Circuit module with improved cooling
10/19/1988	EP0286854A1 Method for making a multilayer thin-film circuit
10/19/1988	EP0286829A2 Electronic device comprising a polyimide layer, and method for its production
10/19/1988	EP0286690A1 Aluminum nitride and semiconductor substrate formed therefrom
10/19/1988	EP0286660A1 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer.
10/19/1988	EP0181355B1 Monolithic integrated planar semi-conductor device
10/19/1988	CN88102047A Electric circuit having superconducting multilayered structure and manufacturing method for same
10/18/1988	US4779164 Printed circuit board
10/18/1988	US4778775 Integrated circuit formed in recrystallized silicon layer over dielectric
10/18/1988	US4778771 Preliminary testing and selection for completion
10/18/1988	US4778641 Printed circuit boards surround semiconductor; pressing; liquid encapsulant
10/18/1988	US4778564 Process for producing an assembly tape for bonding metal fingers to electronic devices
10/18/1988	US4778146 Leadframe for flash-free insert molding and method therefor
10/18/1988	CA1243424A1 Logic-circuit layout for large-scale integrated circuits
10/18/1988	CA1243423A1 Logic-circuit layout for large-scale integrated circuits
10/18/1988	CA1243422A1 Contact vias in semiconductor devices
10/18/1988	CA1243415A1 Vent hole assembly
10/12/1988	EP0285820A2 Method and structure for identifying non-functional chip connect pads
10/12/1988	EP0285779A2 Improved cooling system for semiconductor modules
10/12/1988	EP0285718A2 Method of forming protective cover of pin grid array
10/12/1988	EP0285620A1 Low resistance electrical interconnection for synchronous rectifiers
10/12/1988	EP0148820B1 Electronic circuit chip connection assembly and method
10/12/1988	CN85104913B Semiconductor module for a high-speed switching arrangement
10/11/1988	US4777564 Leadform for use with surface mounted components
10/11/1988	US4777561 Electronic module with self-activated heat pipe
10/11/1988	US4777560 Gas heat exchanger
10/11/1988	US4777520 Easy escape of vaporized moisture; improved humidity resistance
10/11/1988	US4777465 Square toroid transformer for hybrid integrated circuit
10/11/1988	US4777150 Process for the formation of a refractory metal silicide layer on a substrate for producing interconnection
10/11/1988	US4777092 Composition for ceramic substrate and substrate
10/11/1988	US4777060 Multilayer-metal core, dielectric, and conductor
10/11/1988	US4776810 Socket for an electronic component
10/11/1988	US4776087 For forming a shielded transmission line
10/11/1988	CA1243132A1 Semiconductor device electrode and contact structure
10/11/1988	CA1243131A1 Self-registration method of manufacturing a semiconductor device
10/11/1988	CA1242861A1 Method for embedding electrical and electronic circuitry
10/06/1988	WO1988007763A1 Improved density semicustom integrated circuit chip
10/06/1988	WO1988007762A1 Two-level metal interconnection
10/06/1988	WO1988007761A1 Metal packages having improved thermal dissipation
10/06/1988	WO1988007422A1 Low expansion copper alloys with high thermal conductivity
10/06/1988	DE3809237A1 Entkopplungskondensator fuer schaltungspackungen mit oberflaechenmontierten kontaktstiftlosen chiptraegern, oberflaechenmontierten chiptraegern mit kontaktstiften und fuer schaltungspackungen mit kontaktstiftraster Decoupling capacitor for circuit packs with oberflaechenmontierten contact pinless chiptraegern, chiptraegern oberflaechenmontierten with contactless donate and for circuit packs with per-pin grid
10/05/1988	EP0285450A2 Epoxy resin composition and a resin-sealed semiconductor device
10/05/1988	EP0285445A2 Electric circuit having superconducting multilayered structure and manufacturing method for same
10/05/1988	EP0285277A1 Chip carrier with energy storage means
10/05/1988	EP0285127A2 Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
10/05/1988	EP0285074A2 Pressure-contact type semiconductor device
10/05/1988	EP0285064A2 Multi-chip module structure
10/05/1988	EP0285051A2 Method for bonding integrated circuit chips
10/05/1988	EP0284820A2 Electrically connecting member, and electric circuit member and electric circuit device with the connecting member
10/05/1988	EP0284794A1 Refractory metal - titanium nitride conductive structures and processes for forming the same
10/05/1988	EP0284624A1 Method of forming a multichip integrated circuit package.
10/05/1988	EP0171838B1 Encapsulated electric component
10/05/1988	CN88101396A 环氧树脂组合物 The epoxy resin composition
10/04/1988	US4775916 Pressure contact semiconductor device
10/04/1988	US4775878 Semiconductor device formed in semi-insulative substrate
10/04/1988	US4775596 For packaging electronic components; borosilicate glass and ceramic bonding, lamination
10/04/1988	US4775503 Process for the manufacture of an interconnecting substrate for electronic components
10/04/1988	CA1242772A1 Compact combiner for semiconductor devices operating in the ultra-high frequency range
10/04/1988	CA1242600A1 Plastic insert-mold element containing a metal-piece insert
09/1988
09/29/1988	DE3807816A1 Highly integrated master-slice IC having a memory area, and method for producing it
09/29/1988	DE3709200A1 Electronic component
09/29/1988	DE3708474A1 Majority-carrier semiconductor component and method of fabricating it
09/28/1988	EP0284218A1 Passivation material for electrically conductive elements
09/28/1988	EP0284150A1 Method of making a diamond heat sink
09/28/1988	EP0283953A1 Method of forming aluminum wiring layer in semiconductor device
09/28/1988	EP0283587A1 Bonding wire
09/28/1988	EP0283515A1 Integrated circuit packaging configuration for rapid customized design and unique test capability
09/28/1988	EP0283510A1 Low-temperature monolithic chip
09/28/1988	EP0283498A1 Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging
09/28/1988	CN88101268A Superconductive semiconductor device
09/27/1988	US4774635 Semiconductor package with high density I/O lead connection
09/27/1988	US4774633 Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electronic microcircuit card incorporating said device
09/27/1988	US4774632 Hybrid integrated circuit chip package
09/27/1988	US4774630 Apparatus for mounting a semiconductor chip and making electrical connections thereto
09/27/1988	US4774561 Semiconductor device
09/27/1988	US4774559 Integrated circuit chip structure wiring and circuitry for driving highly capacitive on chip wiring nets
09/27/1988	US4774208 Low temperature sealing composition with synthetic zircon
09/27/1988	US4774207 With molybdenum
09/27/1988	US4774202 Memory device with interconnected polysilicon layers and method for making
09/27/1988	US4773955 Printed wiring board for mounting electronic parts and process for producing the same
09/27/1988	CA1242532A1 Input protection arrangement for vlsi intergrated circuit devices
09/27/1988	CA1242531A1 Device header and method of making same
09/27/1988	CA1242520A1 Package for optical element
09/22/1988	WO1988007264A2 Devices and systems based on novel superconducting material
09/22/1988	DE3708235A1 Method of fabricating conductor tracks on substrate material composed of aluminium nitride, AlN
09/21/1988	EP0283319A2 Encapsulating electronic components
09/21/1988	EP0283046A2 Complementary integrated circuit device equipped with latch-up preventing means
09/21/1988	EP0283033A2 Ceramic substrate and preparation of the same
09/21/1988	EP0282977A2 Epoxy resin composition
09/21/1988	EP0282693A1 Pluggable integrated circuit package
09/21/1988	EP0282617A1 Integrated circuit having an electroconductive mounting
09/21/1988	EP0102988B1 Integrated circuit lead frame
09/21/1988	CN88101051A Component for three-phase bridge conversion circuit
09/20/1988	US4772936 Electronic system for inserting in a package

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