H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1988
11/29/1988	US4788627 Of tungsten, copper, and nickel
11/29/1988	US4788626 Power semiconductor module
11/29/1988	US4788584 RF transistor package with capacitor
11/29/1988	US4788583 Semiconductor device and method of producing semiconductor device
11/29/1988	US4788382 Duplex glass preforms for hermetic glass-to-metal compression sealing
11/29/1988	US4788165 Copper-exuding, boroaluminosilicate glasses
11/29/1988	CA1245776A1 Bonding-activating operation to manufacture semiconductor devices
11/24/1988	EP0266368A4 Corrosion resistant pins for metal packaged microcircuits.
11/23/1988	EP0292388A1 Duplex glass preforms for hermetic glass-to-metal compression sealing
11/23/1988	EP0292387A2 Method for producing a superconducting circuit
11/23/1988	EP0292174A2 Encapsulating compositions ultra-pure, fused-silica fillers
11/23/1988	EP0292125A1 Multi-layer superconducting circuit substrate and process for manufacturing same
11/23/1988	EP0292059A2 Modular resin-encapsulated multi-chip circuit package and its manufacturing method
11/23/1988	EP0292015A1 Semiconductor power element
11/23/1988	EP0291659A1 Molecular electronic element
11/23/1988	CN88102545A Multi-layer superconducting circuit substrate and process for manufacturing same
11/22/1988	US4786962 Tungsten suppresses formation of hillocks in underlying aluminum layer; also acts as etch stop
11/22/1988	US4786881 Amplifier with integrated feedback network
11/22/1988	US4786545 For mechanical and electrical attachment to conductive pads
11/22/1988	US4786523 Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
11/22/1988	US4785637 Thermoelectric cooling design
11/22/1988	CA1245371A1 Heat sink formed of interlocking stacked fins
11/22/1988	CA1245369A1 Signal ground planes for tape bonded devices
11/17/1988	WO1988009057A1 Two-terminal semiconductor diode arrangement
11/17/1988	WO1988009056A1 Wire bonds and electrical contacts of an integrated circuit device
11/17/1988	WO1988009055A1 Carbon connectors to liquid-immersion cooled integrated circuit
11/17/1988	EP0291014A2 Semiconductor device in which wiring layer is formed below bonding pad
11/17/1988	EP0290579A1 Alumina materials for low temperature co-sintering with refractory metallization ii
11/17/1988	EP0290578A1 Tungsten paste for co-sintering with pure alumina and method for producing same.
11/17/1988	EP0290501A1 Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer.
11/17/1988	EP0290497A1 Liquid cooling system for integrated circuits.
11/17/1988	DE3814469A1 Semiconductor arrangement and method for producing it
11/15/1988	US4785345 Integrated transformer structure with primary winding in substrate
11/15/1988	US4785341 Using metal silicide
11/15/1988	US4785202 Semiconductor integrated circuit device having an integrally formed bypass capacitor
11/15/1988	US4785141 In a printed circuit board
11/15/1988	US4784974 Bonding, soldering alloy lead frame to glass or ceramic base
11/15/1988	US4784972 Method of joining beam leads with projections to device electrodes
11/15/1988	US4784872 Multilayer semiconductor, hermetic sealing
11/15/1988	CA1244940A1 Photo sensor device and optical pickup device
11/15/1988	CA1244683A2 Heat sink mounting
11/09/1988	EP0290271A2 Superconducting circuit board and process of manufacturing it
11/09/1988	EP0290222A2 A multilayer interconnection system for multichip high performance semiconductor packaging
11/09/1988	EP0290212A2 Cooling arrangement and method of monitoring its operation
11/09/1988	EP0290089A1 Method and means for wave soldering of leads of an integrated circuit package
11/09/1988	EP0289903A1 Ceramic coated metal subtrates for electronic applications
11/08/1988	US4783749 Basic cell realized in the CMOS technique and a method for the automatic generation of such a basic cell
11/08/1988	US4783722 Interboard connection terminal and method of manufacturing the same
11/08/1988	US4783721 Cooling system for an electronic circuit device
11/08/1988	US4783697 Leadless chip carrier for RF power transistors or the like
11/08/1988	US4783695 Multichip integrated circuit packaging configuration and method
11/08/1988	US4783428 Depositing epoxy layers and lead frame on heat sink and curing
11/08/1988	US4783424 Radiating electromagnetic energy to fuse polycrystalline silicon layer; etching, dopes
11/08/1988	US4783368 High heat conductive insulated substrate and method of manufacturing the same
11/08/1988	US4783358 Ceramic wiring substrate
11/08/1988	US4783248 Method for the production of a titanium/titanium nitride double layer
11/08/1988	US4783225 Wafer and method of working the same
11/08/1988	US4782893 Electrically insulating thermally conductive pad for mounting electronic components
11/03/1988	WO1988008615A1 Cavity-up-cavity-down multichip integrated circuit package
11/03/1988	DE3813701A1 Method for producing a lead frame for semiconductor devices
11/03/1988	DE3713298A1 Plastic packaging for semiconductor components with spacing projections
11/02/1988	EP0289274A2 Via connections in integrated circuits
11/02/1988	EP0289222A1 Glass-ceramics for electronic packaging
11/02/1988	EP0289166A2 Lead straightening for leaded packaged electronic components
11/02/1988	EP0289089A1 Method of manufacturing a semiconductor device having interconnections located both above a semiconductor region and above an isolation region adjoining it
11/02/1988	EP0288803A2 Personalizable semiconductor chips for analog and analog/digital circuits
11/02/1988	EP0288802A1 A multi-level integrated circuit wiring structure from a single metal deposit
11/02/1988	EP0288776A2 Gold alloy wire connection to copper doped aluminum semiconductor circuit interconnection bonding pad
11/02/1988	EP0288767A2 Method for forming a shielded transmission line
11/02/1988	EP0288688A2 Porous circuit macro for semiconductor integrated circuits
11/02/1988	EP0190308B1 Electrical connector device
11/01/1988	US4782465 Semiconductor integrated circuit device with memory cells connected to a divided sub-word line
11/01/1988	US4782381 Chip carrier
11/01/1988	US4782380 Nondiffusing
11/01/1988	US4782195 Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
11/01/1988	US4782193 Polygonal wiring for improved package performance
11/01/1988	US4782037 Nonpeeling
11/01/1988	US4781970 Strengthening a ceramic by post sinter coating with a compressive surface layer
11/01/1988	US4781968 Micro-electronics devices and methods of manufacturing same
11/01/1988	US4781244 Liquid cooling system for integrated circuit chips
11/01/1988	CA1244173A1 Encapsulated electronic components and encapsulation compositions
11/01/1988	CA1244148A1 Hermetically sealed semiconductor casing
11/01/1988	CA1244147A1 Die bonding process
11/01/1988	CA1244146A1 Lead frame deflashing
10/1988
10/27/1988	DE3812662A1 Semiconductor component with superconducting connections
10/27/1988	DE3810494A1 Integrated semiconductor circuit arrangement having a superconducting layer, and method for producing it
10/26/1988	EP0288277A2 Cassette storing a plurality of electronic components
10/26/1988	EP0288186A2 Packaging of semiconductor integrated circuits
10/26/1988	EP0288183A2 Cooling apparatus and semiconductor device employing the same
10/26/1988	EP0288052A2 Semiconductor device comprising a substrate, and production method thereof
10/26/1988	EP0287931A2 Semiconductor device comprising an electrode having a composite structure
10/26/1988	EP0287870A2 Package for integrated devices
10/26/1988	EP0287770A1 Semiconductor component having a control electrode
10/25/1988	US4780846 Master slice type semiconductor circuit device
10/25/1988	US4780795 Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture
10/25/1988	US4780791 Card-shaped memory having an IC module
10/25/1988	US4780754 Alumina, h2o, and silanol endcapped siloxane; integrated circuits
10/25/1988	US4780572 Device for mounting semiconductors
10/25/1988	US4780427 Doping, etching, diffusing
10/25/1988	US4780177 Excimer laser patterning of a novel resist

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