Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/1989
01/03/1989US4796075 Fusible link structure for integrated circuits
01/03/1989US4795870 Conductive member having integrated self-regulating heaters
01/03/1989US4795720 Method for producing semiconductor devices and cutting fuses
01/03/1989US4795694 Integrated circuits
01/03/1989US4795680 Polyimide-siloxanes, method of making and use
01/03/1989US4795670 Multilayer ceramic substrate with circuit patterns
01/03/1989US4794981 For electronic component
01/03/1989CA1247943A1 Electrically and thermally conductive adhesive transfer tape
12/1988
12/29/1988WO1988010511A1 Cryogenic vessel for cooling electronic circuit means
12/29/1988WO1988010509A1 Method for fabricating a tape for electronic module circuits, and tape obtained according to such method
12/29/1988WO1988010472A1 Moat router for integrated circuits
12/29/1988WO1988009599A3 Gold compression bonding
12/29/1988DE3815569A1 Method for the selective deposition of a conductive material in the fabrication of integrated circuits
12/29/1988DE3720298A1 Metal layer arrangement for thin-film hybrid circuits
12/29/1988DE3719637A1 Boiling-cooling device for semiconductor elements
12/28/1988EP0296997A1 Power mos transistors structure
12/28/1988EP0296910A2 Method of improving the corrosion resistance of aluminium contacts on semiconductors
12/28/1988EP0296747A1 Integrated circuit with tub tie
12/28/1988EP0296707A1 Incorporation of dielectric layers in a semiconductor
12/28/1988EP0296596A1 Fine copper wire for electronic instruments and method of manufacturing the same
12/28/1988EP0296511A1 Method of fabricating a tape intended to provide circuits for electronic modules, and tape obtained by this method
12/28/1988EP0296246A1 Semiconductor device and method of fabricating the same
12/27/1988US4794561 Static ram cell with trench pull-down transistors and buried-layer ground plate
12/27/1988US4794446 Electrode device and a method for making the same
12/27/1988US4794437 ARC gap for integrated circuits
12/27/1988US4794355 Heat sink for magnetically tuned filter
12/27/1988US4794093 Selective backside plating of gaas monolithic microwave integrated circuits
12/27/1988US4794048 Ceramic coated metal substrates for electronic applications
12/27/1988US4793854 Highly pure titanium and process for producing the same
12/22/1988EP0218685A4 Electrostatic discharge input protection network.
12/22/1988DE3818509A1 Verfahren und einrichtung zum herstellen eines niederohmigen kontaktes mit aluminium und dessen legierungen durch selektives niederschlagen von wolfram Method and device for the manufacture of a low contact with aluminum and its alloys by selectively reflected by tungsten
12/21/1988EP0295948A2 Improved VLSI package having multiple power planes
12/21/1988EP0295914A2 An interconnect structure for PC boards and integrated circuits
12/21/1988EP0295708A2 Semiconductor device having a superconductive wiring
12/21/1988EP0295707A2 Semiconductor integrated circuit device having multilayer power supply lines
12/21/1988EP0295459A2 Electronic assembly and method of making it
12/21/1988EP0295387A2 Package for heat dissipation of electronic components
12/21/1988EP0295367A1 Gate structure in semiconductor devices
12/20/1988US4792878 Heat dissipating housing for a circuit component
12/20/1988US4792844 Pressure contact semiconductor device
12/20/1988US4792843 Data carrier having an integrated circuit and method for producing same
12/20/1988US4792842 Semiconductor device with wiring layer using bias sputtering
12/20/1988US4792841 Semiconductor devices and a process for producing the same
12/20/1988US4792835 MOS programmable memories using a metal fuse link and process for making the same
12/20/1988US4792773 Ultra high frequency circuit with low parasite capacities
12/20/1988US4792537 Dielectric ceramic composition for high frequencies
12/20/1988US4792532 Semiconductor device and process for producing the same, and tape carrier used in said process
12/20/1988US4792476 Aromatic polyimides
12/20/1988US4791983 Self-aligning liquid-cooling assembly
12/15/1988WO1988010008A1 Fabrication of interlayer conductive paths in integrated circuits
12/15/1988DE3817114A1 Mit laser arbeitendes verfahren zur verbesserung von halbleiterschaltungen With laser-working process for improvement of semiconductor circuits
12/14/1988EP0295135A1 Forming tungsten structures
12/14/1988EP0295065A2 Semiconductor integrated circuit device, method of making same or cutting method for same, and cutting system using energy beam for same
12/14/1988EP0295046A1 Test socket with improved contact engagement
12/14/1988EP0295007A2 Film carrier, method for manufacturing a semiconductor device utilizing the same and an associated tester
12/14/1988EP0294833A2 Contact photoelectric conversion device
12/14/1988CN87103732A Tin-cerium-cobalt electroplating solution and method of thereof preparation
12/13/1988US4791524 Electrostatic discharge protection for electronic packages
12/13/1988US4791474 Semiconductor integrated circuit device
12/13/1988US4791473 Plastic package for high frequency semiconductor devices
12/13/1988US4791472 Lead frame and semiconductor device using the same
12/13/1988US4791302 Semiconductor wafer for providing a plurality of semiconductor chips through electron-beam lithography
12/13/1988US4791075 Process for making a hermetic low cost pin grid array package
12/13/1988US4791031 Lead frame for IC having a wire bonding part composed of multi-layer structure of iron containing alloy, refractory metal and aluminum
12/13/1988US4790920 Method for depositing an al2 O3 cap layer on an integrated circuit substrate
12/13/1988US4790894 Semicircular solder filled apertures at walls for electrical connections
12/13/1988US4790374 Airflow directional vane for a heatsink
12/13/1988US4790373 Cooling system for electrical components
12/13/1988US4790370 Heat exchanger apparatus for electrical components
12/13/1988CA1246757A1 Magnetically sealed multichip integrated circuit package
12/13/1988CA1246756A1 Stress relieved intermediate insulating layer for multilayer metalization
12/13/1988CA1246755A1 Semiconductor device
12/13/1988CA1246754A1 Low-stress-inducing omnidirectional heat sink
12/13/1988CA1246750A1 Heat sink for solid state devices connected to a circuit board
12/08/1988DE3817600A1 Semiconductor device
12/07/1988EP0294259A2 Screening of gate oxides on semiconductors
12/07/1988EP0294190A2 A resin sealed semiconductor device and a method for making the same
12/07/1988EP0294111A2 Socket connector for leaded modules
12/07/1988EP0294015A1 A device having a circuit board for connecting a plurality of IC-chips
12/07/1988EP0293970A2 Pad for supporting a chip of an integrated-circuit electronic component
12/07/1988EP0293838A2 IC package for high-speed semiconductor integrated circuit device
12/07/1988EP0293630A1 Semiconductor body with heatsink
12/07/1988EP0293435A1 Infrared detector with improved heat dissipation.
12/07/1988EP0176555B1 Multilayer hybrid integrated circuit
12/07/1988CN88102627A Superconducting circuit board and paste adopted therefor
12/06/1988US4790027 Method for automatic separating useful and noise information in microscopic images particularly microscopic images of wafer surfaces
12/06/1988US4789647 Method of manufacturing a semiconductor device, in which a metallization with a thick connection electrode is provided on a semiconductor body
12/06/1988US4789345 Socket device for fine pitch lead and leadless integrated circuit package
12/06/1988US4788767 Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
12/06/1988US4788765 Having lead frames eutectically bonded to dielectric substrate
12/06/1988CA1246170A1 Integrated circuit device having strip line structure therein
12/01/1988WO1988009599A2 Gold compression bonding
12/01/1988WO1988009220A1 Improved thermoelectric cooling design
11/1988
11/30/1988EP0293297A2 A system for cooling solid circuit components and a method for providing thermally conductive compound means therefor
11/30/1988EP0293247A1 Ultra low alpha-particle-emitting aluminum hydroxide and alumina
11/30/1988EP0292848A2 Semiconductor power module and method of manufacturing it
11/30/1988EP0292725A2 Chip packaging construction
11/30/1988EP0292641A2 Output buffer of MOS semiconductor integrated circuit
11/30/1988CN88103212A Method of manufacturing semiconductor device having interconnections located both above semiconductor region and above isolation region adjoining it
11/30/1988CN88101587A 半导体器件 Semiconductor devices