| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/31/1989 | US4801997 High packing density lead frame and integrated circuit |
| 01/31/1989 | US4801996 Gigahertz rate integrated circuit package incorporating semiconductive MIS power-line substrate |
| 01/31/1989 | US4801992 Three dimensional interconnected integrated circuit |
| 01/31/1989 | US4801916 Vertical plug-in single-in-line circuit module |
| 01/31/1989 | US4801867 Monolithic microwave integrated circuit with probing pads |
| 01/31/1989 | US4801838 Method and device for improving the sensitivity and the signal to noise ratio of piezo-electric transducers having a plurality of sensors combined in parallel |
| 01/31/1989 | US4801765 Electronic component package using multi-level lead frames |
| 01/31/1989 | US4801561 Method for making a pre-testable semiconductor die package |
| 01/31/1989 | US4801559 Process for forming planar wiring using polysilicon to fill gaps |
| 01/31/1989 | US4801558 Short circuiting when charges build-up during manufacture; then removal |
| 01/31/1989 | US4800956 Apparatus and method for removal of heat from packaged element |
| 01/31/1989 | CA1249669A1 Semiconductor die attach system |
| 01/26/1989 | WO1989000751A1 Cooling system for a sealed enclosure |
| 01/26/1989 | WO1989000656A2 Cryogenic fluid transfer means |
| 01/26/1989 | DE3823336A1 Package connecting a large number of chips to one another |
| 01/25/1989 | EP0300864A2 Apparatus for the detection of integrated-circuit de-passivation |
| 01/25/1989 | EP0300720A1 Multilevel interconnect transfer process |
| 01/25/1989 | EP0300658A2 Apparatus for and method of providing alignment to a workpiece integrated circuit package |
| 01/25/1989 | EP0300647A1 Duct testing |
| 01/25/1989 | EP0300632A2 Plastic encapsulated integrated circuit package with electrostatic shield |
| 01/25/1989 | EP0300590A2 Semiconductor device package structure |
| 01/25/1989 | EP0300567A2 Method of applying thin layers of oxidic superconductive material |
| 01/25/1989 | EP0300434A2 Overcurrent protection circuit for semiconductor device |
| 01/25/1989 | EP0300059A1 Electronic component processing apparatus |
| 01/25/1989 | CN2031313U Improved cooling device for electric heating |
| 01/24/1989 | US4800459 Capacitors |
| 01/24/1989 | US4800422 Frostless interface supercooled VLSI system |
| 01/24/1989 | US4800421 Glass bonding means and method |
| 01/24/1989 | US4800420 Two-terminal semiconductor diode arrangement |
| 01/24/1989 | US4800419 Support assembly for integrated circuits |
| 01/24/1989 | US4800418 Integrated circuit with improved monitoring function by use of built-in elements |
| 01/24/1989 | US4800179 Contact hole, multilayer films, wires, lasers |
| 01/24/1989 | US4800178 Electrodeposition, tapes, passivation |
| 01/24/1989 | US4800137 Carbides or borides of molybdenum and tungsten |
| 01/24/1989 | US4800002 Method of making a diamond heat sink |
| 01/24/1989 | US4799543 Means for temperature control of heated surfaces |
| 01/24/1989 | CA1249379A1 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough |
| 01/18/1989 | EP0299894A1 Process for making a connection to an integrated circuit contact stud, and contact structure |
| 01/18/1989 | EP0299822A1 Method of manufacturing a high-power electronic device, and device thus obtained |
| 01/18/1989 | EP0299775A2 Method of assembling a tab bonded semiconductor chip package |
| 01/18/1989 | EP0299768A2 Tape carrier for semiconductor chips |
| 01/18/1989 | EP0299605A2 Iron-copper-chromium alloy for high-strength lead frame or pin grid array and process for preparation thereof |
| 01/18/1989 | EP0299300A2 Article strengthened by a compressive layer and method |
| 01/18/1989 | EP0299252A2 Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers |
| 01/18/1989 | EP0299163A2 Interconnection method for semiconductor device |
| 01/18/1989 | EP0299087A1 Semiconductor device and method of fabricating the same |
| 01/18/1989 | EP0180906B1 Wave resistance-adapted chip support for a microwave semiconductor |
| 01/18/1989 | EP0167538B1 Flat package for integrated circuit memory chips |
| 01/17/1989 | US4799101 Substrate bias through polysilicon line |
| 01/17/1989 | US4799096 Monolithic integrated circuit comprising circuit branches parallel to one another |
| 01/17/1989 | US4798794 Method for manufacturing dynamic memory cell |
| 01/17/1989 | US4798643 Self-aligning bonding technique |
| 01/17/1989 | CA1249073A1 Integrated semiconductor circuit including a tantalum silicide diffusion barrier |
| 01/17/1989 | CA1249070A1 Thick bus metallization interconnect structure to reduce bus area |
| 01/17/1989 | CA1249067A1 Integrated circuit sockets |
| 01/17/1989 | CA1249063A1 Evaporation cooling module for semiconductor devices |
| 01/12/1989 | WO1989000346A1 Plated plastic castellated interconnect for electrical components |
| 01/12/1989 | WO1989000340A1 Electronic microcircuit card and process for manufacturing same |
| 01/12/1989 | WO1989000339A1 Flat bodies, in particular for use as heat sinks for electronic power components |
| 01/12/1989 | WO1989000338A1 Semiconductor casing |
| 01/12/1989 | WO1989000337A1 Encapsulation barrier for thick-film hybrid circuits |
| 01/12/1989 | WO1989000283A1 Duct testing |
| 01/12/1989 | DE3728096C1 Flat body, especially for use as a heat sink for electronic power components |
| 01/11/1989 | EP0298851A1 Contacting process between two conducting layers deposited on a substrate |
| 01/11/1989 | EP0298829A1 Process to control the conduction state of a MOS transistor |
| 01/11/1989 | EP0298607A2 Outer tape automated bonding semiconductor package |
| 01/11/1989 | EP0298372A2 Semiconductor cooling apparatus |
| 01/11/1989 | EP0298344A2 A method for providing engineering changes to LSI PLAs |
| 01/11/1989 | EP0298211A2 Ceramic card assembly having enhanced power distribution and cooling |
| 01/11/1989 | EP0298110A1 Conductive plug for contacts and vias on integrated circuits |
| 01/11/1989 | CN1003065B Conductor material of semiconductor apparatus |
| 01/10/1989 | USRE32829 Rectifier with slug construction and mold for fabricating same |
| 01/10/1989 | US4797787 Lead frame and electronic device |
| 01/10/1989 | US4797727 Thyristor with aligned trigger guide |
| 01/10/1989 | US4797726 Lead frame including deformable plates |
| 01/10/1989 | US4797530 Irradiation a dielectric to form electroconductive segment |
| 01/10/1989 | US4797448 Additive for arylene sulfide polymers of improved impact strength |
| 01/10/1989 | US4797118 Test adapter for integrated circuit carrier |
| 01/04/1989 | EP0297991A1 Method of fabricating an electronic microcircuit card |
| 01/04/1989 | EP0297963A1 Method of connecting a lead to a doped region of an integrated circuit substrate by laser,and integrated circuit made by this method |
| 01/04/1989 | EP0297921A2 Photoelectric conversion device |
| 01/04/1989 | EP0297894A2 Thermal package for electronic components |
| 01/04/1989 | EP0297793A2 Thermal conductor assembly |
| 01/04/1989 | EP0297569A2 Member for semiconductor apparatus |
| 01/04/1989 | EP0297512A2 Member for semiconductor apparatus |
| 01/04/1989 | EP0297511A2 Connection structure between components for semiconductor apparatus |
| 01/04/1989 | EP0297350A2 Static ram cell with trench pull-down transistors and buried-layer ground plate |
| 01/04/1989 | EP0162057B1 Method of fabricating algaas semiconductor devices having high and low resistivity regions |
| 01/04/1989 | CN1030158A Method of manufacturing superconductor and superconductive circuit |
| 01/03/1989 | US4796239 Circuit unit for timepiece and process for fabricating the same |
| 01/03/1989 | US4796157 Substrate mounting assembly |
| 01/03/1989 | US4796156 Self packaging chip mount |
| 01/03/1989 | US4796155 Liquid cooling type high frequency solid state device |
| 01/03/1989 | US4796084 Semiconductor device having high resistance to electrostatic and electromagnetic induction using a complementary shield pattern |
| 01/03/1989 | US4796083 Multilayer-metal, or alloy, frame bonded to refractory |
| 01/03/1989 | US4796081 Low resistance metal contact for silicon devices |
| 01/03/1989 | US4796080 Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate |
| 01/03/1989 | US4796078 Electronic assembly |
| 01/03/1989 | US4796077 Blend with silicon carbide |
| 01/03/1989 | US4796076 Semiconductor device |