| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/07/1989 | US4811081 Semiconductor die bonding with conductive adhesive |
| 03/07/1989 | US4810672 Method of securing electronic components to a substrate |
| 03/07/1989 | US4810468 Copper-chromium-titanium-silicon-alloy |
| 03/07/1989 | US4810332 Method of making an electrical multilayer copper interconnect |
| 03/07/1989 | CA1250963A1 Nickel/indium plated cover for hermetically sealed container for electronic device |
| 03/01/1989 | EP0305296A1 Semiconductor layer structure having an aluminum-silicon alloy layer |
| 03/01/1989 | EP0305295A2 Metallization layer structure formed on aluminum nitride ceramics and method of producing the metallization layer structure |
| 03/01/1989 | EP0305001A1 Integrated semiconductor circuit with decoupled D.C. wiring |
| 03/01/1989 | EP0304930A2 Semiconductor integrated circuit device having signal lines |
| 03/01/1989 | EP0304929A2 Semiconductor device having an electrode covered with a protective film |
| 03/01/1989 | EP0304728A2 Process for manufacturing a low resistivity aluminium or aluminium alloy planar metalization |
| 03/01/1989 | CN1031446A Tab bonded semiconductor chip package |
| 02/28/1989 | US4809134 Low stress liquid cooling assembly |
| 02/28/1989 | US4809133 Low temperature monolithic chip |
| 02/28/1989 | US4809058 Integrated circuit device |
| 02/28/1989 | US4809057 Electrical component assembly and method of manufacture thereof |
| 02/28/1989 | US4809055 Semiconductor device having an electrode and a method of manufacturing the same |
| 02/28/1989 | US4809054 Semiconductor lead frame |
| 02/28/1989 | US4809053 Semiconductor device and lead frame used therefor |
| 02/28/1989 | US4809046 Semiconductor memory device |
| 02/28/1989 | US4809014 Apparatus for and method of positioning and synchronizing a writing laser beam |
| 02/28/1989 | US4808844 Semiconductor device |
| 02/28/1989 | US4808769 Film carrier and bonding method using the film carrier |
| 02/28/1989 | US4808653 Coating composition containing hydrogen silsesquioxane resin and other metal oxide precursors |
| 02/28/1989 | US4808548 Forming emitters with raised contacts, collectors and gate |
| 02/28/1989 | US4808274 Metallized substrates and process for producing |
| 02/28/1989 | US4807441 Cooling system for a sealed enclosure |
| 02/28/1989 | US4807357 Method and apparatus for bending and inserting pin in one sequential operation |
| 02/28/1989 | CA1250602A1 Sealing glass composite |
| 02/23/1989 | WO1989001703A1 Specification heat exchanger apparatus for electrical components |
| 02/23/1989 | WO1989001461A1 Co-sinterable metal-ceramic packages and materials therefor |
| 02/23/1989 | WO1989000656A3 Cryogenic fluid transfer means |
| 02/23/1989 | WO1988007264A3 Devices and systems based on novel superconducting material |
| 02/22/1989 | EP0304142A2 Package for semiconductor element |
| 02/22/1989 | EP0304061A2 Superconducting ceramics elongated body and method of manufacturing the same |
| 02/22/1989 | EP0304058A1 Mounting of a transistor device on a lead frame with a ceramic plate |
| 02/22/1989 | EP0303823A1 Method of forming a conductive structure on a substrate |
| 02/22/1989 | EP0303812A1 Chip contacts without oxide discontinuities |
| 02/21/1989 | US4807087 Single-in-line type semiconductor device |
| 02/21/1989 | US4807022 Simultaneous formation of via hole and tub structures for GaAs monolithic microwave integrated circuits |
| 02/21/1989 | US4807021 Semiconductor device having stacking structure |
| 02/21/1989 | US4807019 Cavity-up-cavity-down multichip integrated circuit package |
| 02/21/1989 | US4807018 Method and package for dissipating heat generated by an integrated circuit chip |
| 02/21/1989 | US4807017 Semiconductor memory device with wirings having ensured cross-sections |
| 02/21/1989 | US4807015 Adhesion with dielectric film |
| 02/21/1989 | US4807013 Polysilicon fillet |
| 02/21/1989 | US4807002 Mesfet transistor with gate spaced above source electrode by layer of air or the like method of fabricating same |
| 02/21/1989 | US4806704 Aluminum and beta eucryptite |
| 02/21/1989 | US4806457 Forming check pattern with resist stripes in intervals |
| 02/21/1989 | US4805691 Cooling technique for compact electronics inverter |
| 02/21/1989 | US4805683 Method for producing a plurality of layers of metallurgy |
| 02/21/1989 | US4805420 Cryogenic vessel for cooling electronic components |
| 02/21/1989 | CA1250373A1 Apparatus for mounting a semiconductor chip and making electrical connections thereto |
| 02/21/1989 | CA1250372A1 Microelectronics apparatus and a method of interconnecting wiring planes |
| 02/16/1989 | DE3725813A1 Evaporative cooler with evaporation vessel - has vessel coupled to top condenser by side, front and rear sheet metal plates |
| 02/15/1989 | EP0303521A2 Superconducting device and methods of manufacturing the same |
| 02/15/1989 | EP0303396A1 Improved laser-blown links |
| 02/15/1989 | EP0303390A1 Manufacture of diodes |
| 02/15/1989 | EP0303272A2 Printed circuits for electronics |
| 02/15/1989 | EP0303061A2 Process for forming a planarized, metal-strapped polysilicon gate FET |
| 02/15/1989 | EP0303049A2 Optoelectronic image sensor device |
| 02/15/1989 | CN1031167A Circuit arrangement having plurality of electrical elements to be cooled |
| 02/14/1989 | US4805147 Stacked static random access memory cell having capacitor |
| 02/14/1989 | US4805141 Bipolar PROM having transistors with reduced base widths |
| 02/14/1989 | US4805009 Hermetically sealed semiconductor package |
| 02/14/1989 | US4805007 Flip chip module |
| 02/14/1989 | US4804828 Card-type processing device |
| 02/14/1989 | CA1250055A1 Coating of iii-v and ii-vi compound semiconductors |
| 02/08/1989 | EP0302811A1 A method for producing a clean, highly conductive surface for mating composite articles |
| 02/08/1989 | EP0302641A1 Cooling structure for heat generating electronic components mounted on a substrate |
| 02/08/1989 | EP0302354A2 Method for preparing a laminated structure from an oxide-ceramic supraconducting material |
| 02/08/1989 | EP0302262A2 High speed partioned reduced instruction set computer |
| 02/08/1989 | EP0302237A1 Circuit arrangement with several cooled electrical elements |
| 02/08/1989 | EP0302165A1 Process for the encapsulation of both microelectronic semiconductor and thick or thin film circuits |
| 02/08/1989 | EP0069762B1 Universal interconnection substrate |
| 02/07/1989 | US4803595 Interposer chip technique for making engineering changes between interconnected semiconductor chips |
| 02/07/1989 | US4803590 Electric switching device |
| 02/07/1989 | US4803546 Heatsink package for flip-chip IC |
| 02/07/1989 | US4803545 Self-fixturing heat sink |
| 02/07/1989 | US4803544 Prefabricated strip conductor network assembly unit and process for making same |
| 02/07/1989 | US4803543 Semiconductor device and process for producing the same |
| 02/07/1989 | US4803542 Carrier element for an IC-module |
| 02/07/1989 | US4803541 Semiconductor device |
| 02/07/1989 | US4803540 Semiconductor integrated circuit packages |
| 02/07/1989 | US4803534 Semiconductor device sram to prevent out-diffusion |
| 02/07/1989 | US4803180 Method for manufacturing pressure contact semiconductor devices |
| 02/07/1989 | US4803178 Method of making silicon-on-sapphire gate array |
| 02/07/1989 | US4803177 Method of forming interconnections and crossings between metallization levels of an integrated circuit |
| 02/07/1989 | US4803100 Suspension and use thereof |
| 02/07/1989 | US4802532 Heat sink |
| 02/07/1989 | US4802277 Method of making a chip carrier slotted array |
| 02/02/1989 | DE3724144A1 Arrangement for testing circuits which are integrated on a chip |
| 02/01/1989 | EP0301892A1 Semiconductor device on a substrate |
| 02/01/1989 | EP0301691A1 Magazine for storing electronic components of the soic type |
| 02/01/1989 | EP0301565A2 Semiconductor device comprising a wiring layer |
| 02/01/1989 | EP0110997B1 Semiconductor device package |
| 01/31/1989 | US4802062 Integrated wiring system for VLSI |
| 01/31/1989 | US4802061 Microelectronic components and thick-film hybrid circuits |
| 01/31/1989 | US4801999 Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers |
| 01/31/1989 | US4801998 EPROM device |