| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 08/14/2013 | CN203134778U Circuit component |
| 08/14/2013 | CN203134777U Diode |
| 08/14/2013 | CN203134776U 功率半导体模块 Power semiconductor module |
| 08/14/2013 | CN203134775U Embedding type power module |
| 08/14/2013 | CN203134774U Long-strip digital display tube |
| 08/14/2013 | CN1909424B Optical transponder with active heat transfer |
| 08/14/2013 | CN103250472A Chip-integrated through-lating of multilayer substrates |
| 08/14/2013 | CN103250248A Connection structure for an integrated circuit with capacitive function |
| 08/14/2013 | CN103250247A Support for an optoelectronic semiconductor chip, and semiconductor chip |
| 08/14/2013 | CN103250246A Method and system for thin multi chip stack package with film on wire and copper wire |
| 08/14/2013 | CN103250245A Bumpless build-p layer and laminated core hybrid structures and methods of assembling same |
| 08/14/2013 | CN103250244A Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same |
| 08/14/2013 | CN103250243A Semiconductor device |
| 08/14/2013 | CN103250242A Semiconductor device and method for manufacturing semiconductor device |
| 08/14/2013 | CN103250241A Mounting structure for electronic component |
| 08/14/2013 | CN103250240A Element housing package, component for semiconductor device, and semiconductor device |
| 08/14/2013 | CN103249285A Heat pipe heat-radiation system |
| 08/14/2013 | CN103248354A 半导体集成电路 The semiconductor integrated circuit |
| 08/14/2013 | CN103247613A Enhanced Flash multi-chip packaged chip, and communication method and packaging method thereof |
| 08/14/2013 | CN103247612A Enhanced FLASH chip and method for encapsulating chip |
| 08/14/2013 | CN103247611A Enhanced FLASH chip and method for encapsulating chip |
| 08/14/2013 | CN103247606A High-inductance-value silica-based planar spiral inductor structure |
| 08/14/2013 | CN103247605A Thin film transistor baseplate and preparation method thereof |
| 08/14/2013 | CN103247604A Electronic module and method of manufacturing same |
| 08/14/2013 | CN103247603A Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus |
| 08/14/2013 | CN103247602A Semiconductor device and method of forming the same |
| 08/14/2013 | CN103247601A Copper interconnection structure and manufacture method thereof |
| 08/14/2013 | CN103247600A Via connection structure, semiconductor devices having the same, and methods of fabricating the structures and devices |
| 08/14/2013 | CN103247599A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 08/14/2013 | CN103247598A Metal line and via formation using hard masks |
| 08/14/2013 | CN103247597A Semiconductor device and method of manufacturing the same |
| 08/14/2013 | CN103247596A On-chip ferrite bead inductor |
| 08/14/2013 | CN103247595A Adjustable meander line resistor |
| 08/14/2013 | CN103247594A Stress reduction apparatus |
| 08/14/2013 | CN103247593A Post-passivation interconnect structure and method of forming same |
| 08/14/2013 | CN103247592A MOM (metal oxide metal) capacitor and manufacturing method thereof |
| 08/14/2013 | CN103247591A Semiconductor device and communication system including the same |
| 08/14/2013 | CN103247590A Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device |
| 08/14/2013 | CN103247589A Semiconductor packages and methods of manufacturing the same |
| 08/14/2013 | CN103247588A Microelectronics device including anisotropic conductive layer and method of forming thereof |
| 08/14/2013 | CN103247587A Interconnect crack arrestor structure and methods |
| 08/14/2013 | CN103247586A Chip bonding structure and bonding method |
| 08/14/2013 | CN103247585A Semiconductor packaging structure |
| 08/14/2013 | CN103247584A Microgroove group flat plate heat pipe heat radiation fin module and production method of module |
| 08/14/2013 | CN103247583A Compliant pin fin heat sink and methods |
| 08/14/2013 | CN103247582A Semiconductor surge suppressor lead package structure |
| 08/14/2013 | CN103247581A Chip package structure and device |
| 08/14/2013 | CN103247580A Electronic component module and method for producing same |
| 08/14/2013 | CN103247579A Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus |
| 08/14/2013 | CN103247578A Semiconductor bearing member, namely packaging member, and method for manufacturing same |
| 08/14/2013 | CN103247569A Preparation and structure of TSV (through silicon via) |
| 08/14/2013 | CN103247550A Test module and method for monitoring processing procedure stability |
| 08/14/2013 | CN103247547A No-flow underfill for package with interposer frame |
| 08/14/2013 | CN103247545A Semiconductor device and method thereof |
| 08/14/2013 | CN103247544A Package-on-package type semiconductor packages and methods for fabricating the same |
| 08/14/2013 | CN103247542A Manufacturing method for leading-out terminals of ceramic integrated circuit encapsulation casing and special lead framework |
| 08/14/2013 | CN103247541A Semiconductor device and method of manufacturing thereof |
| 08/14/2013 | CN103247539A Method of preventing epoxy bleed out of lead frame and lead frame manufactured by using the same |
| 08/14/2013 | CN103246553A Enhanced Flash chip and method for packaging same |
| 08/14/2013 | CN102376630B Semiconductor device and method for manufacturing local interconnect structure thereof |
| 08/14/2013 | CN102354687B Barrier medium material used for thick film circuit and preparation method thereof |
| 08/14/2013 | CN102324399B 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof |
| 08/14/2013 | CN102222676B Solid-state image pickup device and electronic apparatus |
| 08/14/2013 | CN102222658B Multi-circle arranged IC (integrated circuit) chip packaging member and producing method thereof |
| 08/14/2013 | CN102201398B Resin sealed semiconductor device and manufacturing method therefor |
| 08/14/2013 | CN102177273B Sputtering target for forming wiring film of flat panel display |
| 08/14/2013 | CN102169859B Thyristor converter valve tower for high voltage direct current transmission |
| 08/14/2013 | CN102169845B Multi-layer mixed synchronization bonding structure and method for three-dimensional packaging |
| 08/14/2013 | CN102097402B DC (Direct Current) device for equalizing pressure of converter valve waterway |
| 08/14/2013 | CN102056700B Heat exchange plate manufacturing method and heat exchange plate |
| 08/14/2013 | CN102054811B Integrated circuit structure |
| 08/14/2013 | CN102054787B Stack type package structure and manufacture method thereof |
| 08/14/2013 | CN102025135B ESD protective device |
| 08/14/2013 | CN102005398B Method for forming via in substrate and substrate with via |
| 08/14/2013 | CN101883806B Phosphorus-containing epoxy resin and phosphorus-containing epoxy resin composition, process for producing the same, and curable resin composition and cured object each containing or obtained from the resin and the resin composition |
| 08/14/2013 | CN101783329B Semiconductor component and manufacturing method thereof |
| 08/14/2013 | CN101728357B Wiring structure and method for fabricating the same |
| 08/14/2013 | CN101630663B Device with power semiconductor module and manufacture method thereof |
| 08/14/2013 | CN101459058B Etching stopping layer, semi-conductor device with through hole and forming method thereof |
| 08/14/2013 | CN101315998B Shaped integrated passive devices |
| 08/14/2013 | CN101009316B Flat panel display device and method of making the same |
| 08/13/2013 | USRE44438 Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate |
| 08/13/2013 | USRE44431 Bump-on-lead flip chip interconnection |
| 08/13/2013 | US8508968 Semiconductor apparatus |
| 08/13/2013 | US8508056 Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same |
| 08/13/2013 | US8508055 Semiconductor device and manufacturing method thereof |
| 08/13/2013 | US8508054 Enhanced bump pitch scaling |
| 08/13/2013 | US8508052 Stacked power converter structure and method |
| 08/13/2013 | US8508051 Protection film having a plurality of openings above an electrode pad |
| 08/13/2013 | US8508050 Wiring substrate, semiconductor device, and method for manufacturing wiring substrate |
| 08/13/2013 | US8508049 Deposition and selective removal of conducting helplayer for nanostructure processing |
| 08/13/2013 | US8508048 Semiconductor device utilizing a package on package structure and manufacturing method thereof |
| 08/13/2013 | US8508047 Buried word line memory integrated circuit system |
| 08/13/2013 | US8508046 Circuit substrate and method of manufacturing same |
| 08/13/2013 | US8508045 Package 3D interconnection and method of making same |
| 08/13/2013 | US8508044 Semiconductor package, semiconductor device, and semiconductor module |
| 08/13/2013 | US8508042 Electronic device and electronic apparatus |
| 08/13/2013 | US8508041 Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof |
| 08/13/2013 | US8508040 In-situ foam materials as integrated heat spreader (IHS) sealant |
| 08/13/2013 | US8508039 Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics |