| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/05/2015 | US20150037964 Method for Manufacturing a Marked Single-Crystalline Substrate and Semiconductor Device with Marking |
| 02/05/2015 | US20150037938 Packaging a semiconductor device having wires with polymerized insulator skin |
| 02/05/2015 | US20150037937 Semiconductor devices including electromagnetic interference shield |
| 02/05/2015 | US20150037936 Strength of Micro-Bump Joints |
| 02/05/2015 | US20150037603 Articles including metal structures having maximized bond adhesion and bond reliability, and methods of forming the same |
| 02/05/2015 | US20150035589 Through-substrate via shielding |
| 02/05/2015 | US20150035175 Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device |
| 02/05/2015 | US20150035174 Semiconductor device |
| 02/05/2015 | US20150035173 Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release |
| 02/05/2015 | US20150035172 Semiconductor device and method of manufacturing the same |
| 02/05/2015 | US20150035171 Segmented Bond Pads and Methods of Fabrication Thereof |
| 02/05/2015 | US20150035170 Multichip device including a substrate |
| 02/05/2015 | US20150035169 Via structure for three-dimensional circuit integration |
| 02/05/2015 | US20150035168 Semiconductor device having through-substrate vias |
| 02/05/2015 | US20150035167 Tft array substrate and manufacturing method thereof, and display device |
| 02/05/2015 | US20150035166 Method for manufacturing a semiconductor component and structure |
| 02/05/2015 | US20150035165 Interconnection structure of semiconductor device |
| 02/05/2015 | US20150035164 Semiconductor package and method of fabricating the same |
| 02/05/2015 | US20150035163 Semiconductor package and method of fabricating the same |
| 02/05/2015 | US20150035162 Inductive device that includes conductive via and metal layer |
| 02/05/2015 | US20150035161 Semiconductor device and manufacturing method thereof |
| 02/05/2015 | US20150035160 Pad configurations for an electronic package assembly |
| 02/05/2015 | US20150035159 Semiconductor device having backside interconnect structure on through substrate via and method of forming the same |
| 02/05/2015 | US20150035158 Semiconductor devices with enhanced electromigration performance |
| 02/05/2015 | US20150035157 Spacer for enhancing via pattern overlay tolerence |
| 02/05/2015 | US20150035156 Semiconductor device and manufacturing method thereof, and mounting method of semiconductor device |
| 02/05/2015 | US20150035155 Dual damascene structure with liner |
| 02/05/2015 | US20150035154 Profile control in interconnect structures |
| 02/05/2015 | US20150035153 Removing metal fills in a wiring layer |
| 02/05/2015 | US20150035152 Interconnection structures for semiconductor devices and fabrication methods of forming interconnection structures for semiconductor devices utilizing to-be-etched layer made of porous low-K dielectric material and a first hard mask layer made of nitrogen-doped silicon oxycarbide (SiOC(N)) |
| 02/05/2015 | US20150035151 Capping Layer Interface Interruption for Stress Migration Mitigation |
| 02/05/2015 | US20150035150 Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods |
| 02/05/2015 | US20150035149 Semiconductor device and manufacturing method thereof |
| 02/05/2015 | US20150035148 Semiconductor packages and methods of fabricating the same |
| 02/05/2015 | US20150035147 Fine Pitch stud POP Structure and Method |
| 02/05/2015 | US20150035146 Through Package Via (TPV) |
| 02/05/2015 | US20150035145 Millimeter wave wafer level chip scale packaging (wlcsp) device |
| 02/05/2015 | US20150035144 High density interconnect device and method |
| 02/05/2015 | US20150035142 Multi-chip package |
| 02/05/2015 | US20150035141 Semiconductor package structure for improving die warpage and manufacturing method thereof |
| 02/05/2015 | US20150035140 Wafer support system for 3d packaging |
| 02/05/2015 | US20150035139 Copper Post Structure for Wafer Level Chip Scale Package |
| 02/05/2015 | US20150035138 Semiconductor device |
| 02/05/2015 | US20150035137 Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer |
| 02/05/2015 | US20150035136 Semiconductor device to be attached to heat radiation member |
| 02/05/2015 | US20150035135 3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings |
| 02/05/2015 | US20150035134 3dic packages with heat dissipation structures |
| 02/05/2015 | US20150035133 Electronic modules and methods of making electronic modules |
| 02/05/2015 | US20150035132 Method for manufacturing semiconductor device and semiconductor device |
| 02/05/2015 | US20150035131 Chip package |
| 02/05/2015 | US20150035130 Integrated Circuit with Stress Isolation |
| 02/05/2015 | US20150035129 Stacked multi - chip packaging structure and manufacturing method thereof |
| 02/05/2015 | US20150035128 Semiconductor device and method of manufacturing semiconductor device |
| 02/05/2015 | US20150035127 Semiconductor package and method of fabricating the same |
| 02/05/2015 | US20150035125 Semiconductor device, semiconductor wafer and manufacturing method of semiconductor device |
| 02/05/2015 | US20150035120 Wafer Scale Package for High Power Devices |
| 02/05/2015 | US20150035116 Semiconductor device with circuits connected to each other in contactless manner |
| 02/05/2015 | US20150035115 Modified via bottom for beol via efuse |
| 02/05/2015 | US20150035080 Semiconductor Device |
| 02/05/2015 | US20150035066 Fet chip |
| 02/05/2015 | US20150035065 Semiconductor device and method for fabricating the same |
| 02/05/2015 | US20150035056 Semiconductor device |
| 02/05/2015 | US20150035052 Contact power rail |
| 02/05/2015 | US20150035050 Semiconductor device with air gap and method for fabricating the same |
| 02/05/2015 | US20150035049 Vertical Semiconductor MOSFET Device with Double Substrate-Side Multiple Electrode Connections and Encapsulation |
| 02/05/2015 | US20150035017 Contact Structure of Semiconductor Device |
| 02/05/2015 | US20150034998 Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
| 02/05/2015 | US20150034953 Semiconductor fuse with enhanced post-programming resistance |
| 02/05/2015 | US20150034946 Display panel |
| 02/05/2015 | US20150034702 Apparatus & method for treating substrate |
| 02/05/2015 | US20150034374 Printed wiring board and method for manufacturing printed wiring board |
| 02/05/2015 | US20150033554 Organic module emi shielding structures and methods |
| 02/05/2015 | DE112006003451B4 Halbleiterleistungsvorrichtungen mit Grabenfeldplattenabschluss und Verfahren zu deren Ausbildung Semiconductor power devices with grave field plate Statements and methods of training |
| 02/05/2015 | DE102014110873A1 Halbleiterbauelement mit kombiniertem passiven Bauelement auf der Chiprückseite A semiconductor device combined with passive component at the chip rear side |
| 02/05/2015 | DE102014110845A1 Mehrchipbauelement mit einem Substrat A multi-chip component having a substrate |
| 02/05/2015 | DE102014110655A1 Segmentierte Bondkontaktierungsinseln und Verfahren zu ihrer Fertigung Segmented Bondkontaktierungsinseln and process for their production |
| 02/05/2015 | DE102014110301A1 Elektronisches Verpackungsmodul und sein Herstellungsverfahren Electronic packaging module and its manufacturing method |
| 02/05/2015 | DE102014109515A1 An ein Wärmeabstrahlelement anzubringende Halbleitervorrichtung A heat radiating element to be mounted semiconductor device |
| 02/05/2015 | DE102013219688B3 Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung A thermally conductive compound means, connecting assembly and method of making a thermally conductive compound |
| 02/05/2015 | DE102013215367A1 Elektronisches Schaltungsmodul Electronic circuit module |
| 02/05/2015 | DE102013215364A1 Elektronisches Schaltungsmodul mit fixiertem Kühlkörper und Herstellungsverfahren An electronic circuit module with fixed heat sink and manufacturing processes |
| 02/05/2015 | DE102013215255A1 Elektronisches oder elektrisches Bauteil mit PCM-haltiger Kühlung An electronic or electrical component with PCM-containing cooling |
| 02/05/2015 | DE102013215105A1 Polyorganosiloxanzubereitung für optische Halbleiter Polyorganosiloxanzubereitung optical semiconductor |
| 02/05/2015 | DE102013215102A1 Siliconharzzusammensetzung für optische Halbleiter Silicone resin composition for optical semiconductor |
| 02/05/2015 | DE102013215066A1 Verfahren zur herstellung einer stoffschlüssigen verbindung und eines leistungshalbleitermoduls A process for preparing a cohesive connection and a power semiconductor module |
| 02/05/2015 | DE102013110537A1 Elektronisches Verpackungsmodul und sein Herstellungsverfahren Electronic packaging module and its manufacturing method |
| 02/05/2015 | DE102013108213A1 Optoelektronisches Bauelement Optoelectronic component |
| 02/05/2015 | DE102013108185A1 Verfahren zur Herstellung einer leistungselektronischen Schalteinrichtung und leistungselektronische Schalteinrichtung A process for producing a power electronic switch device and power electronic switching device |
| 02/05/2015 | DE102009045063B4 Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls Power semiconductor module with molded heat sink, power semiconductor module system and method for producing a power semiconductor module |
| 02/05/2015 | DE102008045615B4 Leistungshalbleitermodul, Verfahren zur Herstellung eines Leistungshalbleitermoduls und System mit einem Leistungshalbleitermodul Power semiconductor module, method for producing a power semiconductor module and system having a power semiconductor module |
| 02/04/2015 | EP2833403A2 Header for electronic cooler |
| 02/04/2015 | EP2833402A1 Flow path member, and heat exchanger and semiconductor device using same |
| 02/04/2015 | EP2833401A1 Power module substrate with heat sink, power module substrate with cooler, and power module |
| 02/04/2015 | EP2833400A1 Power module substrate with heat sink, and method for producing power module substrate with heat sink |
| 02/04/2015 | EP2833399A1 Power module substrate, power module substrate with heat sink, and power module |
| 02/04/2015 | EP2833398A1 Substrate for power module, substrate for power module with heat sink, power module, and method for manufacturing substrate for power module |
| 02/04/2015 | EP2833397A1 Substrate for power module and manufacturing method therefor |
| 02/04/2015 | EP2832792A1 Curable resin composition, method for producing same, highly thermally conductive resin composition, and highly thermally conductive multilayer substrate |
| 02/04/2015 | EP2832760A1 Curable epoxy resin composition |
| 02/04/2015 | EP2831930A1 Sealed semiconductor light emitting device. |