Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1989
04/05/1989EP0310039A2 Cooling system for heating body
04/05/1989EP0309982A2 Polymer-ceramic composite plies
04/05/1989EP0309942A2 Multilayer ceramic package with high frequency connections
04/05/1989EP0309920A2 Electronic circuit apparatus of automobile
04/05/1989EP0309894A2 High power semiconductor device
04/05/1989EP0309805A1 Semiconductor device with airbridge interconnection
04/05/1989EP0309543A1 Liquid immersion cooling assembly for integrated circuits.
04/05/1989CN1032268A Superconducting devices and manufacturing methods for same
04/04/1989USH629 Non-destructive semiconductor chip bonding and chip removal
04/04/1989US4819131 Integrated circuit package having coaxial pins
04/04/1989US4819042 Isolated package for multiple semiconductor power components
04/04/1989US4819041 Surface mounted integrated circuit chip package and method for making same
04/04/1989US4819038 TFT array for liquid crystal displays allowing in-process testing
04/04/1989US4818895 Direct current sense lead
04/04/1989US4818821 Brazed leaded package
04/04/1989US4818812 Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
04/04/1989US4818728 Method of making a hybrid semiconductor device
04/04/1989US4818727 Applying zinc chromate solution to contact pads
04/04/1989US4818726 Process for curing epoxy encapsulant on integrated circuit dice
04/04/1989US4817850 Repairable flip-chip bumping
04/04/1989US4817276 Sintering mullite with silicon, aluminum,and magnesium oxide binder; printing patterns with high melting metal
04/04/1989CA1252223A1 Improvements in or relating to wafer-scale- integrated assemblies
03/1989
03/30/1989DE3731787A1 Arrangement of a plurality of ICs on a tape strip consisting of insulating material
03/30/1989DE3731624A1 Compensating circular lamination for power semiconductor modules
03/29/1989EP0309190A2 Polyimide coating compositions
03/29/1989EP0309116A2 Fixture for an integrated circuit chip
03/29/1989EP0308980A2 Flat wire in silicone rubber or matrix MOE
03/29/1989EP0308726A2 Wafer scale integrated circuit
03/29/1989EP0308714A2 Wiring arrangement for connecting a plurality of electrical or electronic devices
03/29/1989EP0308588A1 Semiconductor-on-insulator fabrication method
03/29/1989EP0181975B1 Semiconductor device comprising a support body
03/29/1989CN1032091A Bonding wire
03/28/1989US4816984 Bridge arm with transistors and recovery diodes
03/28/1989US4816967 Low impedance interconnect method and structure for high frequency IC such as GaAs
03/28/1989US4816895 Integrated circuit device with an improved interconnection line
03/28/1989US4816889 Photoelectric conversion device
03/28/1989US4816616 Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
03/28/1989US4816427 Process for connecting lead frame to semiconductor device
03/28/1989US4816425 Polycide process for integrated circuits
03/28/1989US4816424 Refractory metal nitride barrier
03/28/1989US4816422 Fabrication of large power semiconductor composite by wafer interconnection of individual devices
03/28/1989US4816421 Method of making a heteroepitaxial structure by mesotaxy induced by buried implantation
03/28/1989US4816323 Ceramic substrate, electroconductive metal and fluoropolymer dielectric overcoating
03/28/1989US4816299 Encapsulating compositions containing ultra-pure, fused-silica fillers
03/28/1989US4816216 Interdiffusion resistant Fe--Ni alloys having improved glass sealing
03/28/1989US4815595 Uniform leadframe carrier
03/28/1989US4815208 Method of joining substrates for planar electrical interconnections of hybrid circuits
03/28/1989US4815204 Electronic component insertion machine
03/23/1989WO1989002653A1 Bonding of aligned conductive bumps on adjacent surfaces
03/22/1989EP0308247A2 Solid-state high power amplifier arrangement
03/22/1989EP0307946A2 Method of manufacturing a resin insulated type semiconductor device
03/22/1989EP0307844A2 Semiconductor integrated circuit having interconnection with improved design flexibility
03/22/1989EP0307773A1 Method of manufacturing electronic modules, especially for smart cards
03/22/1989EP0307722A1 Semiconductor device having improved multilayered wirings
03/22/1989EP0307671A2 Method of making an electrically programmable integrated circuit with meltable contact bridges
03/22/1989EP0307665A2 Encapsulation composition and use thereof
03/22/1989EP0307635A1 Polysiloxane modified cement
03/22/1989CN2034495U Welding equipment with rarefying and helium filling nitrogen
03/21/1989US4814943 Printed circuit devices using thermoplastic resin cover plate
03/21/1989US4814857 Circuit module with separate signal and power connectors
03/21/1989US4814855 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
03/21/1989US4814853 Semiconductor device with programmable fuse
03/21/1989US4814849 Monolithically integrated semiconductor circuit
03/21/1989US4814304 Dielectric glass, binder, inorganic peroxide
03/21/1989US4814295 Mounting of semiconductor chips on a plastic substrate
03/21/1989US4814283 Simple automated discretionary bonding of multiple parallel elements
03/21/1989US4814030 Polyvinylbutyral
03/21/1989US4813129 Interconnect structure for PC boards and integrated circuits
03/21/1989CA1251588A1 POLYMERS WITH GRAFT .alpha.-ALKYLACRYLATE FUNCTIONALITY
03/21/1989CA1251522A1 Enclosed thyristor valve
03/15/1989EP0307272A2 Aluminum alloy semiconductor interconnections having high purity titanium or niobium barrier layer
03/15/1989EP0307147A2 Semiconductor devices having superconducting interconnects
03/15/1989EP0307099A1 Formation of stacked insulation layers in a semiconductor device
03/15/1989EP0306890A1 A semiconductor module having active devices disposed in substrate cavities
03/15/1989EP0306620A1 Bus structure for integrated circuit chip
03/14/1989US4812950 Means for mounting a ROM on a printed circuit board
03/14/1989US4812949 Method of and apparatus for mounting an IC chip
03/14/1989US4812897 Silicone gels
03/14/1989US4812896 Metal electronic package sealed with thermoplastic having a grafted metal deactivator and antioxidant
03/14/1989US4812895 Hyperfrequency semiconductor device having external connections established by beam-leads
03/14/1989US4812894 Semiconductor device
03/14/1989US4812889 Semiconductor device FET with reduced energy level degeneration
03/14/1989US4812886 Multilayer contact apparatus and method
03/14/1989US4812742 Integrated circuit package having a removable test region for testing for shorts and opens
03/14/1989US4812490 Epoxy resin molding compounds
03/14/1989US4812421 Tab-type semiconductor process
03/14/1989US4812419 Lead, alloys, silicides
03/14/1989US4812191 Method of forming a multilevel interconnection device
03/14/1989CA1251286A1 Cover for semiconductor device packages
03/09/1989WO1989001873A1 Integrated circuit device and method of producing the same
03/09/1989DE3729013A1 Circuit arrangement having a varistor as overvoltage protection for a component which contains an electrical circuit
03/09/1989DE3728348A1 Multilayer wiring for VLSI semiconductor components
03/08/1989EP0306412A1 Casing for an electronic circuit
03/08/1989EP0305993A2 Power semiconductor device having electrode structures
03/08/1989EP0305589A1 Method and apparatus for the encapsulation of a semiconductor device mounted on a lead-frame
03/08/1989EP0305515A1 Devices and systems based on novel superconducting material.
03/08/1989EP0305398A1 Multiple integrated circuit interconnection arrangement.
03/07/1989US4811170 Solders, conductors, semiconductors, contactors, electrodeposition, alloying
03/07/1989US4811166 Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
03/07/1989US4811082 High performance integrated circuit packaging structure
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