Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1989
05/02/1989US4827083 Silver-palladium alloy
05/02/1989US4827082 Ceramic package
05/02/1989US4826896 Silicon carbide filler
05/02/1989US4826787 Method for adhesion of silicon or silicon dioxide plate
05/02/1989US4826786 Method for forming a multilayered metal network for bonding components of a high-density integrated circuit, and integrated circuit produced thereby
05/02/1989US4826785 Integrated circuits
05/02/1989US4826736 Clad sheets
05/02/1989US4826297 Protective coating, integrated circuits
05/02/1989CA1253628A1 Hybrid and multi-layer circuitry
05/02/1989CA1253609A1 Electronic module with self-activated heat pipe
05/02/1989CA1253606A1 High yield liquid crystal display and method of making same
04/1989
04/27/1989DE3832253A1 Latchup- und entladungsschutzeinrichtung fuer einen integrierten cmos schaltkreis Latchup- and discharge protection device for an integrated CMOS circuitry
04/26/1989EP0313473A2 Apparatus for supplying cooling fluid
04/26/1989EP0313401A2 Composition for semiconductor element protective film
04/26/1989EP0313249A1 Resistive field shields for high voltage devices
04/26/1989EP0313236A2 Chip carrier and header assembly and terminals therefor
04/26/1989EP0313082A2 Semiconductor device with bump electrode and method of manufacturing the same
04/26/1989EP0313001A2 Test adapter for integrated circuit carrier
04/26/1989EP0312975A2 Semiconductor chip package
04/26/1989EP0312832A1 Suspensions and use of such suspensions
04/26/1989EP0312824A2 Ceramic structure with copper based conductors and method for forming such a structure
04/26/1989EP0312802A2 Self-mounted chip carrier
04/26/1989EP0312528A1 Multiple-plate hybrid device.
04/25/1989US4825284 Semiconductor resin package structure
04/25/1989US4825282 Semiconductor package having side walls, earth-bonding terminal, and earth lead formed in a unitary structure
04/25/1989US4825279 Semiconductor device
04/25/1989US4825278 Radiation hardened semiconductor devices
04/25/1989US4825276 Integrated circuit semiconductor device having improved wiring structure
04/25/1989US4825107 Master slice type integrated circuit
04/25/1989US4825093 Methods for identifying semiconductor wafer with bar code pattern thereon and methods for manufacturing semiconductor device
04/25/1989US4824803 Etching multilayer structure of refractory, aluminum or alloy thereof, and refractory
04/25/1989US4824801 Phospho-silicate glass on polysilicon films; dielectric containing no phosphorus between aluminum and glass
04/25/1989US4824716 Polyimidesiloxane block copolymer undercoating and metallic overcoating
04/25/1989US4824254 Slit utilized as pattern for aligning
04/25/1989US4824009 Process for braze attachment of electronic package members
04/25/1989US4823869 Heat sink
04/25/1989US4823863 Thermal conduction device
04/25/1989CA1253261A1 Double layer dielectric passivation
04/25/1989CA1253037A1 Selective electroless plating of vias in vlsi devices
04/20/1989WO1989003634A1 An arrangement for deactivating integrated circuits electrically
04/20/1989WO1989003590A1 Self-aligning liquid-cooling assembly
04/20/1989WO1989003589A1 Integrated circuit contact fabrication process
04/20/1989DE3830131A1 Flip-chip semiconductor device
04/19/1989EP0312217A1 Integrated circuit chip assembly
04/19/1989EP0312154A1 A method of forming an interconnection between conductive levels
04/19/1989EP0312048A2 Bipolar semiconductor device
04/19/1989EP0311674A1 Cavity-up-cavity-down multichip integrated circuit package.
04/19/1989EP0172193B1 Programmable read-only memory cell and method of fabrication
04/19/1989CN1032471A Power semiconductor component
04/19/1989CN1032470A Arrangement for deactivating integrated circuits
04/19/1989CN1032454A System for cooling heat genarating body
04/18/1989US4823314 Integrated circuit dual port static memory cell
04/18/1989US4823278 Method of logic design of integrated circuit
04/18/1989US4823276 Computer-aided automatic wiring method for semiconductor integrated circuit device
04/18/1989US4823234 Semiconductor device and its manufacture
04/18/1989US4823182 Semiconductor device with a diffusion barrier contact of a refractory metal nitride and either carbon or boron
04/18/1989US4823181 Programmable low impedance anti-fuse element
04/18/1989US4822989 Semiconductor device and method of manufacturing thereof
04/18/1989US4822988 Card containing a component and a micromodule having side contacts
04/18/1989US4822697 Vapor deposition of hydrogen silsesquioxane, heating
04/18/1989US4822693 Copper-iron-nickel composite material for electrical and electronic applications
04/18/1989US4822560 For semiconductor leads
04/18/1989US4822550 Method of molding a protective cover on a pin grid array
04/18/1989US4822536 Ethoxy bisphenol a dimethacrylates
04/18/1989US4822523 Electrically conductive, potentially adhesive composition
04/18/1989CA1252912A1 Semiconductor package with high density i/o lead connection
04/18/1989CA1252909A1 Modular circuit board units mounted on printed circuit board for forming module-in-module connection and circuit arrangement
04/13/1989DE3744353C1 Cooling body for a semiconductor component
04/13/1989DE3733547A1 Electronic apparatus with a cooling system
04/12/1989EP0311513A2 Film segment having integrated circuit chip bonded thereto and fixture therefor
04/12/1989EP0311435A2 IC carrier assembly
04/12/1989EP0311434A2 Integrated circuit card
04/12/1989EP0311274A2 Thermal writing on glass or glass-ceramic substrates and copper-exuding glasses
04/12/1989EP0311245A2 Semi-conductor devices having a great radiation tolerance
04/12/1989EP0311237A2 Digital integrated circuit propagation delay regulator
04/12/1989EP0311173A1 Method of manufacturing a semiconductor device comprising a silicon oxide layer protecting a PN junction
04/12/1989EP0311087A2 Identifying semiconductor wafers
04/12/1989EP0310897A2 Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions
04/11/1989US4821151 Hermetically sealed package
04/11/1989US4821148 Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound
04/11/1989US4821142 Specific thermal expansion coefficient and softening point
04/11/1989US4821084 Insulated gate type field effect transistor
04/11/1989US4820658 Method of making a packaged IC chip
04/11/1989US4820446 Polysiloxane-polyurethane block polymers
04/11/1989US4820376 Fabrication of CPI layers
04/11/1989US4819857 Method for fabricating composite structure
04/11/1989CA1252508A1 Heat sink for power solid state elements
04/06/1989WO1989003166A1 Heat dissipating interconnect tape for use in tape automated bonding
04/06/1989WO1989003127A1 Structure of superconductor wiring and process for its formation
04/06/1989WO1989003126A1 Structure of superconductor wiring and process for its production
04/06/1989WO1989003124A1 Method and apparatus for securing integrated circuits from unauthorized copying and use
04/06/1989WO1989003122A1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds
04/06/1989WO1989003121A1 Ic chips with self-aligned thin film resistors
04/06/1989WO1989002803A1 Copper-tungsten metal mixture and process
04/06/1989DE3732601A1 Tuning diode with a series capacitor
04/05/1989EP0310463A1 Housing for a high-density integrated circuit
04/05/1989EP0310437A1 Method of manufacturing a metallised aluminium nitride circuit board
04/05/1989EP0310357A2 Customizable circuitry
04/05/1989EP0310353A2 High gain thin film sensor
04/05/1989EP0310302A2 Multipurpose socket
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