Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1989
05/30/1989US4835592 Semiconductor wafer with dice having briding metal structure and method of manufacturing same
05/30/1989US4835591 Wiring arrangement for semiconductor devices
05/30/1989US4835588 Transistor
05/30/1989US4835445 Fluorescent display device
05/30/1989US4835344 Electronic component parts and method for manufacturing the same
05/30/1989US4835120 Method of making a multilayer molded plastic IC package
05/30/1989US4835119 Semiconductor device and a process of producing same
05/30/1989US4835118 Non-destructive energy beam activated conductive links
05/30/1989US4835065 Composite alumina-aluminum nitride circuit substrate
05/30/1989US4835039 Tungsten paste for co-sintering with pure alumina and method for producing same
05/30/1989US4835017 Liquid composition for forming silica-based coating film
05/30/1989US4833766 Method of making gas heat exchanger
05/30/1989CA1255049A1 Filler for electronic element encapsulation resin and electronic element encapsulation resin composition containing the same
05/30/1989CA1254789A1 Multilayer hybrid integrated circuit
05/24/1989EP0317469A2 Electrostatic discharge protection for electronics packages
05/24/1989EP0317310A2 Molded-in lead frames
05/24/1989EP0317161A2 Semiconductor memory device having an aluminium-based metallization film and a refractory metal silicide-based metallization film
05/24/1989EP0317133A2 Semiconductor device for controlling supply voltage fluctuations
05/24/1989EP0317132A1 A manufacturing method of a semiconductor device
05/24/1989EP0317038A1 Pin-less package for ultra-fast integrated circuit
05/24/1989EP0317011A2 Multi-level circuits, methods for their fabrication, and display devices incorporating such circuits
05/24/1989EP0316950A2 Thin film for use with soft solder in a monolayer or multilayer metallization
05/24/1989EP0316912A2 A bump electrode structure of a semiconductor device and a method for forming the same
05/24/1989EP0316799A1 Semiconductor device
05/24/1989EP0316404A1 Improved thermoelectric cooling design.
05/24/1989EP0204768B1 Process for fabricating multi-level-metal integrated circuits at high yields
05/24/1989DE3738897A1 Thermally conductive connecting element for electrical components
05/24/1989CN1033140A Method for producing clean, highly conductive surface for mating composite articles
05/23/1989US4833620 Method for fabricating a 1-chip microcomputer
05/23/1989US4833568 Three-dimensional circuit component assembly and method corresponding thereto
05/23/1989US4833567 Integral heat pipe module
05/23/1989US4833522 Semiconductor module
05/23/1989US4833521 Means for reducing signal propagation losses in very large scale integrated circuits
05/23/1989US4833520 Semiconductor integrated circuit having wirings for power supply suited for computer-aided-design
05/23/1989US4833518 Semiconductor memory device having improved interconnection structure of memory cell array
05/23/1989US4833334 Protective box for electronic circuits hardened with respect to X-rays
05/23/1989US4833104 Glass-ceramic substrates for electronic packaging
05/23/1989US4833102 Process of making a ceramic lid for use in a hermetic seal package
05/23/1989US4833095 Heavily doped n layers for source and drain electrodes
05/23/1989US4832996 Semiconductor die for plastic encapsulation having an adhesion promoter
05/23/1989US4832808 Polyimides reaction products and use in electrophoretic deposition
05/23/1989US4832789 Semiconductor devices having multi-level metal interconnects
05/23/1989US4832612 Protective carrier and securing means therefor
05/23/1989US4831723 Direct bond circuit assembly with crimped lead frame
05/18/1989WO1989004593A1 Cooling body for an electric circuit card and method to arrange such a cooling body in an electronic unit
05/18/1989WO1989004553A1 Semiconductor devices with programmable passive-component layer and process for producing the same
05/18/1989WO1989004552A1 Method and means of fabricating a semiconductor device package
05/17/1989EP0316211A1 Integrated circuit protected against electrostatic discharges, with a variable protection threshold
05/17/1989EP0316129A1 Cooling system for three-dimensional IC package
05/17/1989EP0316019A2 Rubbery compounds as modifiers for poly(arylene sulfide)
05/17/1989EP0315980A2 Semiconductor device having conductive layers
05/17/1989EP0315792A2 Interconnection system for integrated circuit chips
05/17/1989EP0200773B1 Process for encapsulating microelectronic circuits with organic components
05/17/1989EP0124624B1 Semiconductor device
05/16/1989US4831495 Unitized packaging arrangement for an energy dissipating device
05/16/1989US4831490 Electronic component without leads, solid electrolytic caracitor and method of manufacturing same
05/16/1989US4831433 Semiconductor device
05/16/1989US4831425 Integrated circuit having improved contact region
05/16/1989US4831212 Package for packing semiconductor devices and process for producing the same
05/16/1989US4830979 Method of manufacturing hermetically sealed compression bonded circuit assemblies
05/16/1989US4830977 Method of making a semiconductor memory device
05/16/1989US4830820 Method for producing material for semiconductor device
05/16/1989US4830706 Method of making sloped vias
05/16/1989US4830691 Process for producing high-density wiring board
05/16/1989US4829666 Method for producing a carrier element for an IC-chip
05/16/1989CA1254342A1 Polymide prepolymer of addition reacted type, prepreg obtained therefrom, and the method of producing laminate from said prepreg
05/16/1989CA1254294A1 Stripline mount for semiconductor lasers
05/11/1989DE3739585C1 Cold plate for dissipating heat losses from large-scale-integrated electronic chips
05/10/1989EP0315422A2 Semiconductor memory device having an ohmic contact between an aluminum-silicon alloy metallization film and a silicon substrate
05/10/1989EP0315421A1 Semiconductor integrated circuit device having at least two contact holes
05/10/1989EP0315320A2 Thick-film high frequency signal circuit apparatus with feedthrough capacitor
05/10/1989EP0315314A1 Silver-glass paste
05/10/1989EP0314738A1 Carbon connectors to liquid-immersion cooled integrated circuit.
05/10/1989EP0314707A1 Wire bonds and electrical contacts of an integrated circuit device.
05/09/1989US4829405 Tape automated bonding package
05/09/1989US4829403 Packaging arrangement for energy dissipating devices
05/09/1989US4829364 Semiconductor device
05/09/1989US4829363 Silicon semiconductors
05/09/1989US4829362 Lead frame with die bond flag for ceramic packages
05/09/1989US4829018 Multilevel integrated circuits employing fused oxide layers
05/09/1989US4828597 Packaging for electronic components
05/09/1989US4827611 Compliant S-leads for chip carriers
05/05/1989WO1989004113A1 High-density electronic modules, process and product
05/05/1989WO1989004059A1 Phantom esd protection circuit employing e-field crowding
05/03/1989EP0314543A1 Device for electrostatic protection for printed electric circuits
05/03/1989EP0314481A1 A temperature control instrument for electronic components under test
05/03/1989EP0314437A1 Semiconductor wafer array
05/03/1989EP0314376A1 Master slice type integrated circuit device and method of using it
05/03/1989EP0314334A1 Isolation of a charge coupled device
05/03/1989EP0201583B1 Process for fabricating dimensionally stable interconnect boards and product produced thereby
05/03/1989DE3835987A1 Semiconductor device having a nitrogen-containing titanium film
05/03/1989CN2037110U Guide pin connector for integrated circuit
05/03/1989CN1004110B Bonding wire
05/02/1989US4827449 Semiconductor device
05/02/1989US4827377 Multi-layer circuitry
05/02/1989US4827376 Heat dissipating interconnect tape for use in tape automated bonding
05/02/1989US4827329 Semiconductor array
05/02/1989US4827328 Hybrid IC device
05/02/1989US4827327 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
05/02/1989US4827325 Protective optical coating and method for use thereof
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