Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1989
06/29/1989DE3742669A1 Integrated circuit and process for its production
06/28/1989EP0322165A1 Thermally conductive ceramic/polymer composites
06/28/1989EP0321899A1 Method and cooling device for an integrated-circuit housing
06/28/1989EP0321763A2 Complementary metal oxide silicon (CMOS) device structure
06/28/1989EP0321550A1 Cryogenic vessel for cooling electronic circuit means.
06/28/1989CN1004678B Electric component part having lead terminals
06/27/1989US4843453 Metal contacts and interconnections for VLSI devices
06/27/1989US4843452 Thyrister housing gate lead and method of manufacturing same
06/27/1989US4843445 Integrated semiconductor circuit and method for producing it, and use of such a circuit for providing a flow meter
06/27/1989US4843225 Identification card with an integrated circuit
06/27/1989US4843191 Interconnection technique using dielectric layers
06/27/1989US4843188 Integrated circuit chip mounting and packaging assembly
06/27/1989US4843036 Method for encapsulating electronic devices
06/27/1989US4843035 Method for connecting elements of a circuit device
06/27/1989US4843034 Depositing dielectric, doping, forming conductor, and sintering
06/27/1989US4842911 Interfacing for heat sinks
06/27/1989US4842892 Vapor deposition
06/27/1989US4842891 Method of forming a copper film by chemical vapor deposition
06/27/1989US4842800 Curing epoxy resins with monomeric or polymeric diaryliodonium hexafluoroantimonate salt catalyst, a filler and copper cocatalyst
06/27/1989US4842699 Method of selective via-hole and heat sink plating using a metal mask
06/27/1989US4842677 Excimer laser patterning of a novel resist using masked and maskless process steps
06/27/1989CA1256589A1 Hermetic high frequency surface mount microelectronic package
06/27/1989CA1256586A1 Integrated circuit package and seal therefor
06/27/1989CA1256459A1 Electric insulating polycrystalline silicon carbide and process for the preparation thereof by isostatic hot pressing
06/21/1989EP0321340A1 Electronic-component support, especially for a memory card, and product so obtained
06/21/1989EP0321327A1 Method of mounting an electronic component and its electronic connections on a support
06/21/1989EP0321326A1 Method for positioning an electronic component on a substrate
06/21/1989EP0321083A2 Composite polymer/desiccant coatings for IC encapsulation
06/21/1989EP0321065A2 Method of manufacture of Schottky compound semiconductor devices
06/21/1989EP0320997A2 Semiconductor device having a lead frame
06/21/1989EP0320660A2 Integrated circuit package
06/21/1989EP0320618A1 Housing for a GTO power thyristor
06/21/1989CN1004592B Chip holder for semiconductor silicon element
06/20/1989US4841354 Electronic device with peripheral protective electrode
06/20/1989US4841353 Transistor devices for microwave oscillator elements
06/20/1989US4841352 Semi-custom integrated circuit provided with standardized capacitor cells
06/20/1989US4841258 Method for packaging a microwave tube modulator
06/20/1989US4841170 Temperature controlled hybrid assembly
06/20/1989US4841099 Electrically insulating polymer matrix with conductive path formed in situ
06/20/1989US4840924 Method of fabricating a multichip package
06/20/1989US4840302 Barrier layer; semiconductor chips
06/15/1989WO1989005571A1 Low cost, hermetic pin grid array package
06/15/1989WO1989005519A1 Self-aligned interconnects for semiconductor devices
06/15/1989WO1989005517A1 Self-aligned, planarized contacts for semiconductor devices
06/15/1989WO1989005516A1 Self-aligned semiconductor devices
06/15/1989DE3840560A1 Semiconductor device and method for fabricating it
06/14/1989EP0320321A1 Integrated circuit fuse-blowing means
06/14/1989EP0320244A2 Electrical contact bump and a package provided with the same
06/14/1989EP0320198A2 Cooling system for IC package
06/14/1989EP0319575A1 Fabrication of interlayer conductive paths in integrated circuits.
06/14/1989EP0174986A4 Process for forming and locating buried layers.
06/13/1989US4839859 High density associative memory
06/13/1989US4839820 Monolithic semi-custom LSI
06/13/1989US4839774 Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board
06/13/1989US4839717 Ceramic package for high frequency semiconductor devices
06/13/1989US4839716 Semiconductor packaging
06/13/1989US4839715 Chip contacts without oxide discontinuities
06/13/1989US4839713 Package structure for semiconductor device
06/13/1989US4839712 Compact combiner for semiconductor devices operating in the ultra-high frequency range
06/13/1989US4839304 Multilayer-dielectric substrate, electrode, protective film, fillers, and electroconductive layer
06/13/1989US4839227 Polymeric overcoating
06/13/1989US4838347 Thermal conductor assembly
06/13/1989US4838041 Expansion/evaporation cooling system for microelectronic devices
06/13/1989US4837928 Method of producing a jumper chip for semiconductor devices
06/13/1989CA1255813A1 Antistatic and antitack coating for circuit devices
06/13/1989CA1255812A1 Semiconductor chip package with semiconducting lead alignment bars
06/13/1989CA1255811A1 Spiral wound heat sink and method
06/08/1989DE3740236A1 Hydraulic feed line and discharge line for cooling liquid for cooling boxes for semiconductor elements
06/08/1989DE3740233A1 Cooling box for conducting away the waste heat from semiconductors
06/07/1989EP0319425A1 Chip card having an electronic integrated circuit and subject to mechanical and electrical constraints
06/07/1989EP0319175A2 Method of forming a solid article
06/07/1989EP0319146A2 Glass-ceramic substrates for electronic packaging and thermally crystallizable glass compositions of use in the production thereof
06/07/1989EP0318954A2 Semiconductor device having a composite insulating interlayer
06/07/1989EP0318824A2 Curable compositons and electrical or electronic components or devices encapsulated therewith
06/06/1989USRE32942 Printed circuits, semiconductors
06/06/1989US4837609 Semiconductor devices having superconducting interconnects
06/06/1989US4837536 Monolithic microwave integrated circuit device using high temperature superconductive material
06/06/1989US4837407 Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof
06/06/1989US4837295 Epoxy-amine compositions employing unsaturated imides
06/06/1989US4837184 Process of making an electronic device package with peripheral carrier structure of low-cost plastic
06/06/1989US4837183 Controlling temperature
06/06/1989US4837175 Making a buried channel FET with lateral growth over amorphous region
06/06/1989US4837174 Implanting metal into silicon substrate; heat treatment
06/06/1989US4836434 Method and apparatus for airtightly packaging semiconductor package
06/06/1989US4836131 Solder coating apparatus
06/06/1989US4835847 Method and apparatus for mounting a flexible film electronic device carrier on a substrate
06/06/1989US4835846 Method of manufacture of electronic modules for cards with microcircuits
06/06/1989CA1255396A1 Plastic integrated circuit package having reduced moisture absorption
06/06/1989CA1255388A1 Method of manufacturing cards having an electronic memory, and cards obtained by performing said method
06/06/1989CA1255124A1 Copper alloys having an improved combination of strength and conductivity
06/01/1989DE3833717A1 Semiconductor component
05/1989
05/31/1989EP0318209A2 Interconnection technique using dielectric layers
05/31/1989EP0318020A1 Radiation-protective coating for electronic components
05/31/1989EP0178512B1 Mos circuit including an eeprom
05/30/1989US4835705 Interconnection area decision processor
05/30/1989US4835704 Adaptive lithography system to provide high density interconnect
05/30/1989US4835658 Device for ventilating components arranged in rows on a substrate
05/30/1989US4835598 Wiring board
05/30/1989US4835597 Semiconductor device having improved multi-layer structure of insulating film and conductive film
05/30/1989US4835593 Multilayer thin film metallurgy for pin brazing
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