Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1989
08/08/1989US4855257 Forming contacts to semiconductor device
08/08/1989US4855253 Test method for random defects in electronic microstructures
08/08/1989US4855251 Method of manufacturing electronic parts including transfer of bumps of larger particle sizes
08/08/1989US4855248 Method of making a semiconductor ROM device
08/08/1989US4855245 Method of manufacturing integrated circuit containing bipolar and complementary MOS transistors on a common substrate
08/08/1989US4854731 Temperature sensing apparatus
08/08/1989US4854377 Liquid cooling system for integrated circuit chips
08/03/1989DE3835454A1 Rectifier unit
08/02/1989EP0326218A1 Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body
08/02/1989EP0326217A1 Method of manufacturing a semiconductor device
08/02/1989EP0326204A2 Method for realizing an electrical contact to an electronic device
08/02/1989EP0326187A2 Power MOSFET structure
08/02/1989EP0326092A2 Dielectric composition
08/02/1989EP0326077A2 Circuit board
08/02/1989EP0326018A2 Semiconductor device comprising conductor films
08/02/1989EP0325704A2 Process for the simultaneous manufacture of a plurality of semiconductor devices from a single wafer
08/02/1989EP0202279B1 Process for encapsulating micro-electronic semi-conductor and layer-type circuits
08/02/1989EP0183724B1 Integrated circuit package
08/01/1989USH665 Resistive field shields for high voltage devices
08/01/1989US4853894 Static random-access memory having multilevel conductive layer
08/01/1989US4853826 Low inductance decoupling capacitor
08/01/1989US4853763 Mounting base pad means for semiconductor devices and method of preparing same
08/01/1989US4853761 Semiconductor device
08/01/1989US4853760 Semiconductor device having insulating layer including polyimide film
08/01/1989US4853758 Laser-blown links
08/01/1989US4853491 Chip carrier
08/01/1989US4853343 Method for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refill
08/01/1989US4853271 Ceramic substrate for semiconductor package
07/1989
07/27/1989DE3901114A1 Method for fabricating a semiconductor device
07/27/1989DE3838968A1 Composite based on carbon fibres as reinforcing skeleton and a metallic matrix as filler, and process for producing it
07/26/1989EP0325545A2 Laminate for the formation of beam leads for ic chip bonding featuring improved positive-working resist
07/26/1989EP0325408A2 Semiconductor device having an interconnection layer
07/26/1989EP0325328A1 A method of manufacturing a semiconductor device using sputter etching
07/26/1989EP0325269A1 Conductive pattern for electric test of semiconductor chips
07/26/1989EP0325234A2 Trimming element for microelectronic circuit
07/26/1989EP0325068A1 Modular hybrid microelectronic structure with high integration density
07/26/1989EP0324929A2 Pressure connection type semiconductor device
07/26/1989EP0324743A1 High-frequency power transistor with bipolar epitaxial technology.
07/25/1989US4852016 Moat router for integrated circuits
07/25/1989US4851956 Packaged solid-state surge protector
07/25/1989US4851895 Semiconductor with ruthenium dioxide diffusion barrier between metal element; good electrical resistance
07/25/1989US4851894 Device for neutralizing the access to an integrated-circuit zone to be protected
07/25/1989US4851891 Gate array having transistor buried in interconnection region
07/25/1989US4851295 Low resistivity tungsten silicon composite film
07/25/1989US4850105 Method of taking out lead of semiconductor tip part
07/20/1989DE3841047A1 Plastic-cased, light-sensitive semiconductor assembly
07/19/1989EP0324615A2 Metal oxide superconducting polymer composites
07/19/1989EP0324555A2 Substrate for hybrid IC, hybrid IC using the substrate and its application
07/19/1989EP0324459A2 Semiconductor integrated circuit having CMOS inverter
07/19/1989EP0324244A2 Tape automated bonding package for a semiconductor chip with decoupling
07/19/1989EP0324030A1 Cryogenic fluid transfer means
07/18/1989US4849932 Master slice integrated circuit having a memory region
07/18/1989US4849857 Heat dissipating interconnect tape for use in tape automated bonding
07/18/1989US4849856 Electronic package with improved heat sink
07/18/1989US4849805 Radiation hardened integrated circuit and method of making the same
07/18/1989US4849803 Molded resin semiconductor device
07/18/1989US4849379 Dielectric composition
07/18/1989US4849363 Two layer laminate of electroconductive material and refractory
07/18/1989US4849292 Using bonding agent; heating
07/18/1989US4849284 Electrical substrate material
07/18/1989US4849048 Using ultraviolet curing resins
07/18/1989US4847986 Method of making square toroid transformer for hybrid integrated circuit
07/18/1989CA1257711A1 Mounting of semiconductor chips on a molded plastic substrate
07/13/1989WO1989006442A1 Semiconductor package
07/13/1989WO1989006441A1 Method of forming superconducting wires
07/13/1989WO1989006440A1 Superconducting wire structure
07/12/1989EP0323644A1 Polyimide resin and insulating film for electric and electronic devices
07/12/1989CN1033909A Molded-in lead frames
07/11/1989US4847732 Wafer and method of making same
07/11/1989US4847731 Liquid cooled high density packaging for high speed circuits
07/11/1989US4847674 High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism
07/11/1989US4847673 Semiconductor device
07/11/1989US4847449 Alignment apparatus for use in mounting electronic components and heat sinks on circuit boards
07/11/1989US4847445 Zirconium thin-film metal conductor systems
07/11/1989US4847183 Etching, relief patterns
07/11/1989US4847162 Passivation
07/11/1989US4847138 Thermal writing on glass and glass-ceramic substrates
07/11/1989US4847111 Plasma-nitridated self-aligned tungsten system for VLSI interconnections
07/11/1989US4847003 Silver-palladium films, multilayer, aluminum oxide, silicon oxide
07/11/1989US4846704 Test socket with improved contact engagement
07/11/1989US4846703 IC socket
07/11/1989CA1257433A1 Molded electrical device and composition therefore
07/11/1989CA1257402A1 Multiple chip interconnection system and package
07/05/1989EP0323342A2 A semiconductor substrate having a superconducting thin film
07/05/1989EP0323295A1 Method for fixing an electronic component and its contacts on a carrier
07/05/1989EP0323107A2 Bonding paste for electronic components
07/05/1989EP0323103A2 Multilayer ceramics coatings from the ceramification of hydrogen silsesquioxane resin in the presence of ammonia
07/05/1989EP0323078A2 Electrically-programmable low-impedance anti-fuse element
07/05/1989EP0322696A1 Contact pad for connecting a clip-on terminal to a hybrid circuit substrate wafer
07/05/1989EP0322434A1 Flat bodies, in particular for use as heat sinks for electronic power components
07/05/1989CN1004733B Semiconductor apparatus
07/04/1989US4845590 Heat sink for electrical components
07/04/1989US4845545 Low profile semiconductor package
07/04/1989US4845543 Semiconductor device and method of manufacturing the same
07/04/1989US4845542 Interconnect for layered integrated circuit assembly
07/04/1989US4843695 Method of assembling tab bonded semiconductor chip package
07/04/1989US4843693 Method of making a crimped wire mesh heat exchanger/sink
07/04/1989CA1257010A1 Heat dissipation for electronic components on a ceramic substrate
06/1989
06/29/1989WO1989006086A1 Thin-film conductive circuit and process for its production
06/29/1989WO1989005689A1 Vacuum apparatus
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