Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1989
08/29/1989US4862239 Power semiconductor component
08/29/1989US4862231 Non-contact I/O signal transmission in integrated circuit packaging
08/29/1989US4861944 Low cost, hermetic pin grid array package
08/29/1989US4861646 Co-fired metal-ceramic package
08/29/1989US4861426 Method of making a millimeter wave monolithic integrated circuit
08/29/1989US4861425 Lift-off process for terminal metals
08/29/1989US4860444 Method of assembling a fluid-cooled integrated circuit package
08/24/1989WO1989007835A1 Semiconductor component, manufacturing process, device and assembly station
08/24/1989WO1989007834A1 Module for electrically interconnecting integrated circuit chips
08/24/1989WO1989007665A1 Cvd process for depositing a layer on an electrically conductive thin-layer structure
08/24/1989WO1989007627A1 Epoxy resin compositions for sealing semiconductor devices
08/23/1989EP0329569A2 Semiconductor device with a thin insulating film
08/23/1989EP0329459A2 Moulded chip carrier
08/23/1989EP0329317A2 Semiconductor device having an insulating sheet
08/23/1989EP0329314A1 Uses of uniaxially electrically conductive articles
08/23/1989EP0329313A2 Laser patterning using a novel resist
08/23/1989EP0329227A1 Method of manufacturing a semiconductor device
08/23/1989EP0329133A2 Flip substrate for chip mount
08/23/1989EP0329100A2 Semiconductor device comprising a logic circuit and a memory
08/23/1989EP0329033A2 Semiconductor device having two conductive layers and method of manufacturing the same
08/23/1989EP0328905A1 Circuit arrangement for the protection of an integrated circuit
08/23/1989EP0328815A2 Method for packaging a microwave tube modulator
08/23/1989EP0328778A1 High power switch
08/23/1989EP0328561A1 Specification heat exchanger apparatus for electrical components
08/23/1989CN2043427U Burr-removing machine for diode lead
08/23/1989CN1035028A 大功率开关 Power switch
08/23/1989CN1035023A Manufacturing process for common-grounded packaging semiconductor devices
08/22/1989US4860351 Tamper-resistant packaging for protection of information stored in electronic circuitry
08/22/1989US4860255 Semiconductor memory
08/22/1989US4860165 Semiconductor chip carrier package
08/22/1989US4860164 Heat sink apparatus with electrically insulative intermediate conduit portion for coolant flow
08/22/1989US4860087 Semiconductor device and process for producing the same
08/22/1989US4860086 Semiconductor device
08/22/1989US4860084 Semiconductor device MOSFET with V-shaped drain contact
08/22/1989US4860083 Semiconductor integrated circuit
08/22/1989US4860080 Isolation for transistor devices having a pilot structure
08/22/1989US4860079 Screening of gate oxides on semiconductors
08/22/1989US4860065 Semiconductor integrated circuit device
08/22/1989US4859808 Electrical conductor having unique solder dam configuration
08/22/1989US4859722 Semiconductor seals
08/22/1989US4859632 Method for manufacturing the same
08/22/1989US4859631 Fitting process for packaging a semiconductor component in a plastic box
08/22/1989US4859629 Filling cavity with silicon gives high-strength, durability, workability
08/22/1989US4859614 Method for manufacturing semiconductor device with leads adhered to supporting insulator sheet
08/22/1989US4859520 Monolithic substrate for an electronic power component and process for the production thereof
08/22/1989US4859417 Variable mechanical and electrical properties from same composition
08/22/1989US4859241 Metal flake and use thereof
08/22/1989US4859189 Multipurpose socket
08/22/1989US4858554 Solder coating apparatus
08/17/1989DE3803469A1 Electronic device having a heat sink and having components fastened to the latter
08/16/1989EP0328464A2 Barrier layer arrangement for conductive layers on silicon substrates
08/16/1989EP0328325A1 Laminar polymeric sheet
08/16/1989EP0328262A2 Programmable bonding pad with sandwiched silicon oxide and silicon nitride layers
08/16/1989EP0327996A2 Tape automated bonding of bumped tape on bumped die
08/16/1989EP0327816A2 Non-oxidizable copper thick film conductor
08/16/1989EP0159797B1 Thyristor device and process for producing it
08/16/1989CN1034826A Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body
08/15/1989US4858077 Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board
08/15/1989US4858073 Metal substrated printed circuit
08/15/1989US4858072 Interconnection system for integrated circuit chips
08/15/1989US4858064 Thick-film high frequency signal circuit apparatus with feedthrough capacitor
08/15/1989US4857989 Semiconductor device
08/15/1989US4857988 Leadless ceramic chip carrier
08/15/1989US4857987 Semiconductor device
08/15/1989US4857974 Circuit comprising conductive lines for the transfer of high-speed signals
08/15/1989US4857671 Film carrier and bonding method using the film carrier
08/15/1989US4857484 Method of making an ion-implanted bonding connection of a semiconductor integrated circuit device
08/15/1989US4857482 Method of forming bump electrode and electronic circuit device
08/15/1989US4857387 Compensating element for stresses of thermal or mechanical orgin, especially for printed circuits, and process for making such an element employed in a printed circuit
08/15/1989US4857375 Shielding of semiconductor module
08/15/1989US4856185 Method for fastening electronic components to a substrate using a film
08/10/1989WO1989007382A1 Three-dimensional circuit component assembly and method corresponding thereto
08/10/1989WO1989007339A1 Uses of uniaxially electrically conductive articles
08/10/1989WO1989007338A1 Uses of uniaxially electrically conductive articles
08/10/1989WO1989007337A1 Laser-machining polymers
08/10/1989WO1989007336A1 Laminar polymeric sheet
08/10/1989WO1989007334A1 Ic with means for reducing esd damage
08/10/1989WO1989007333A1 Vertical transistor device fabricated with semiconductor regrowth
08/09/1989EP0327412A1 Passivation process of a integrated circuit
08/09/1989EP0327399A1 Method of manufacturing an uniaxially electrically conductive article
08/09/1989EP0327398A1 Laser-machining polymers
08/09/1989EP0327336A2 Electronic devices incorporating carbon films
08/09/1989EP0327311A2 A coating fluid for forming an oxide coating
08/09/1989EP0327248A2 Flexible membrane heat sink
08/09/1989EP0327244A1 Improvements in or relating to drinking straws
08/09/1989EP0327210A1 Method of preventing silicide peel-off
08/09/1989EP0327068A2 Substrate used for fabrication of thick film circuit
08/09/1989EP0326828A2 Power transistor
08/09/1989EP0326780A2 Power transistor
08/09/1989EP0326777A1 Access protection structure for integrated circuit
08/09/1989EP0271533A4 Electrical device transport medium.
08/08/1989US4855872 Leadless ceramic chip carrier printed wiring board adapter
08/08/1989US4855871 Thin film semiconductor interconnect module
08/08/1989US4855869 Chip carrier
08/08/1989US4855868 Preformed packaging arrangement for energy dissipating devices
08/08/1989US4855867 Full panel electronic packaging structure
08/08/1989US4855809 Orthogonal chip mount system module and method
08/08/1989US4855808 Hermetic glass chip carrier
08/08/1989US4855807 Semiconductor device
08/08/1989US4855796 Beam lead mixer diode
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