Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1989
09/26/1989US4869926 Method of production galvanically deposited aluminum layers for use as contacts of microcircuits
09/26/1989US4869758 Integrated circuits
09/26/1989EP0242369A4 Surface mountable integrated circuit packages having solder bearing leads.
09/26/1989CA1261976A1 Elastic bladder method of fabricating an integrated circuit package having bonding pads in a stepped cavity
09/26/1989CA1261512A1 Poly(arylene sulfide) compositions
09/26/1989CA1261482A1 Self-contained thermal transfer integrated circuit carrier package
09/21/1989WO1989008926A1 Vernier structure for flip chip bonded devices
09/21/1989WO1989008893A1 Arrangement for detachable fastening modules to a module support
09/20/1989EP0333509A2 Integrated circuit having laser-alterable metallization layer
09/20/1989EP0333446A2 Connecting structure for connecting conductors in an electronic apparatus
09/20/1989EP0333374A2 Edge-mounted, surface-mount package for semiconductor integrated circuit devices
09/20/1989EP0333237A2 Integrated circuit chip carrier
09/20/1989EP0333132A2 Semiconductor device having multilayered wiring structure with a small parasitic capacitance
09/20/1989EP0332747A2 Tape automated bonding package
09/20/1989EP0332658A1 Enhanced density modified isoplanar process.
09/19/1989US4868712 Three dimensional integrated circuit package
09/19/1989US4868639 Semiconductor device having waveguide-coaxial line transformation structure
09/19/1989US4868638 Plastic molded pin grid chip carrier package
09/19/1989US4868636 Power thyristor
09/19/1989US4868635 Lead frame for integrated circuit
09/19/1989US4868634 IC-packaged device
09/19/1989US4868630 Gate array semiconductor integrated circuit
09/19/1989US4868489 Device to detect the depassivation of an integrated circuit
09/19/1989US4868426 Programmable logic array having connectable matrices
09/19/1989US4868349 Plastic molded pin-grid-array power package
09/19/1989US4868068 IC wiring connecting method and resulting article
09/19/1989US4868034 Non-oxidizing copper thick film conductors
09/19/1989US4867715 Interconnection lead with redundant bonding regions
09/19/1989US4867235 Composite heat transfer means
09/19/1989US4866841 Integrated circuit chip carrier
09/19/1989CA1259528A1 Metalized substrates and process for producing
09/13/1989EP0332561A2 Low Dielectric composite substrate
09/13/1989EP0332559A2 Method of manufacturing a substrate for carrying and electrically interconnecting electronic devices
09/13/1989EP0332547A1 Current measuring circuit
09/13/1989EP0332457A2 Multilayered ceramic substrates and method for manufacturing of the same
09/13/1989EP0332402A2 Connection construction and method of manufacturing the same
09/13/1989EP0332384A2 A circuit system, a composite metal material for use therein, and a method for making the material
09/13/1989EP0332313A2 Semiconductor heat sink assembly
09/13/1989EP0331908A1 Method for forming high density, ohmic contact multi-level metallurgy for semiconductor devices
09/13/1989EP0331814A2 Lead frame for semiconductor device
09/13/1989EP0181534B1 Vehicle arrangement
09/12/1989US4866571 Semiconductor package
09/12/1989US4866570 Apparatus and method for cooling an electronic device
09/12/1989US4866508 Integrated circuit packaging configuration for rapid customized design and unique test capability
09/12/1989US4866507 Module for packaging semiconductor integrated circuit chips on a base substrate
09/12/1989US4866506 Plastic-sealed IC device of heat-resistant construction
09/12/1989US4866504 Direct interconnection for use between a semiconductor and a pin connector or the like
09/12/1989US4866503 Semiconductor stack
09/12/1989US4866501 Wafer scale integration
09/12/1989US4866117 Blend of propylene and ethylene containing polymers, carbon black and inorganic filler; containers; differential pressure molding
09/12/1989US4866009 High temperature annealing before wiring layer contacts semiconductor; prevents formation of silicides
09/12/1989US4866008 Electro deposition using two masks to define sides
09/12/1989US4866003 Reducing number of hydrogen-bonded-silicons; stabilization
09/12/1989US4865950 Integrated circuits, polysulfonamide binder
09/12/1989US4865876 Process for selectively forming at least one metal or alloy coating strip on a substrate of another metal and integrated circuit lead frame achieved by this process
09/12/1989US4865875 Micro-electronics devices and methods of manufacturing same
09/12/1989US4865331 Differential temperature seal
09/12/1989US4865245 Etching
09/12/1989US4865193 Tape carrier for tape automated bonding process and a method of producing the same
09/12/1989US4865123 Apparatus for supplying cooling fluid
09/12/1989CA1259425A1 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
09/08/1989WO1989008327A1 Method and apparatus for packaging and cooling integrated circuit chips
09/08/1989WO1989008326A1 Hermetic package for integrated circuit chips
09/08/1989WO1989008325A1 Semiconductor component with two connections and process and device for manufacturing it
09/08/1989WO1989008324A1 Alignment of leads for ceramic integrated circuit packages
09/08/1989WO1989008122A1 Epoxy-amine compositions employing unsaturated imides
09/06/1989EP0331598A2 A method for producing a plurality of layers of metallurgy
09/06/1989EP0331338A2 Subassemblies for optoelectronic hybrid integrated circuits
09/06/1989EP0331331A2 Subassembly for optoelectronic devices
09/06/1989EP0331289A2 Semiconductor device with impedance matching means
09/06/1989EP0331245A2 Integrated circuit chip package and method
09/06/1989EP0331206A2 Semiconductor integrated circuit device of multilayer interconnection structure
09/06/1989EP0330848A1 Heat-conductive aluminium nitride sintered body and method of manufacturing the same
09/06/1989EP0330831A1 Method and device to insert electronic components in metallic support strips
09/06/1989EP0330749A1 Semiconductor device
09/05/1989US4864385 Power semiconductors connected antiparallel via heatsinks
09/05/1989US4864384 Pre-matched module for an ultra-high frequency diode and a process for forming the biasing connection for the diode
09/05/1989US4864383 Method of fabrication of a chip carrier package, a flush-contact chip carrier package and an application to cards containing components
09/05/1989US4864106 Heating resistor
09/05/1989US4863808 Undercutting resistance from gold and tin plating baths
09/05/1989US4863683 Oxidation, reduction, sintering
09/05/1989US4862827 Apparatus for coating semiconductor components on a dielectric film
09/05/1989US4862586 Lead frame for enclosing semiconductor chips with resin
08/1989
08/31/1989DE3740235A1 Cooling box for conducting away the waste heat from semiconductor elements
08/30/1989EP0330512A2 Producing electronic components with the aid of lead frames
08/30/1989EP0330372A2 Hybrid ic with heat sink
08/30/1989EP0330299A2 Semi-custom integrated circuit
08/30/1989EP0330176A2 Cover plate for semiconductor devices
08/30/1989EP0329973A1 Hot pressing dense ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates
08/30/1989EP0329823A2 Die attach pickup tools
08/29/1989US4862344 3-phase bridge converting circuit module
08/29/1989US4862323 Chip carrier
08/29/1989US4862322 Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
08/29/1989US4862321 Cooling system for heating body
08/29/1989US4862249 Packaging system for stacking integrated circuits
08/29/1989US4862248 Contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements
08/29/1989US4862247 Contact joint for semiconductor chip carriers
08/29/1989US4862246 Semiconductor device lead frame with etched through holes
08/29/1989US4862245 Package semiconductor chip
08/29/1989US4862243 Scalable fuse link element
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