Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1989
10/24/1989US4876220 Applying voltage to multilayer structure consisting of semiconductor, dielectric and semiconductor
10/24/1989US4876215 Method of making a static ram cell with trench pull-down transistors and buried-layer ground plate
10/24/1989US4875971 Etching top metal layer
10/24/1989US4875618 Wire stacked bonding method
10/24/1989US4875617 Integrated circuits
10/24/1989US4875581 Static dissipative elastomeric coating for electronic packaging components
10/24/1989US4875284 Connecting metal layers separated by dielectric ceramic; heating to diffuse metal through ceramic
10/24/1989US4875279 Die attach pickup tools
10/19/1989WO1989010005A1 Pre-formed chip carrier cavity package
10/19/1989WO1989009958A1 Semiconductor module, its cooling system and computer using the cooling system
10/19/1989DE3811313A1 Housing for hybrid circuits
10/18/1989EP0337686A2 Semiconductor chip module
10/18/1989EP0337485A2 Film carrier for RF IC
10/18/1989EP0337482A2 Semiconducteur protection device
10/18/1989EP0337448A2 Semiconductor device having a metal stem
10/18/1989EP0337445A2 Laminar structure comprising organic material and inorganic material, methods for producing it and its use
10/18/1989EP0337412A2 Encapsulant composition
10/18/1989EP0337064A2 Alloy layer and metallurgy structure for establishing electrical contact
10/18/1989EP0336951A1 Integrated circuit contact fabrication process
10/18/1989EP0336944A1 Copper-tungsten metal mixture and process
10/17/1989US4875139 Building block LSI
10/17/1989US4875138 Variable pitch IC bond pad arrangement
10/17/1989US4875131 Circuit configuration for monitoring a semiconductor structural element and providing a signal when the temperature exceeds a predetermined level
10/17/1989US4875088 Semiconductor device having a backplate electrode
10/17/1989US4875087 Integrated circuit device having strip line structure therein
10/17/1989US4875086 Containing buffer and glass bonding layers
10/17/1989US4875047 Semiconductor integrated circuit device having a wiring layout to avoid intersecting between analog signal wiring layers and digital signal wiring layers
10/17/1989US4874722 Process of packaging a semiconductor device with reduced stress forces
10/17/1989US4874721 Forming, curing dielectric polyimide on ceramic
10/17/1989US4874720 Applying tungsten layer over silicon dioxide
10/17/1989US4874719 Method for manufacturing an electrical connection between conductor levels
10/17/1989US4874646 Ultrafine tube and method for its production
10/17/1989US4874086 Film carrier and a method for manufacturing a semiconductor device utilizing the same
10/17/1989US4873761 Insertion/extraction tool
10/12/1989DE3909375A1 Kermisches material mit niedriger dielektrizitaetskonstante Kermisches low dielectric constant material
10/12/1989DE3906690A1 Ceramic plate for power semiconductor modules
10/12/1989DE3810594A1 Arrangement for the protection of integrated components against damage by uncontrolled electrostatic discharge in handling systems
10/11/1989EP0336869A2 A multilayered metallurgical structure for an electronic component
10/11/1989EP0336660A1 Semiconductor devices having multi-level metal interconnects
10/11/1989EP0336528A2 Automated discretionary bonding of multiple parallel elements
10/11/1989EP0336514A1 Method of providing a semiconductor body on a support
10/11/1989EP0336359A2 Semiconductor package
10/11/1989EP0336173A2 Molded component package isolating interior substrate by recesses containing exposed breakoffs
10/11/1989EP0336061A2 Container
10/11/1989EP0336026A1 Fabrication of customized integrated circuits
10/11/1989EP0335965A1 Phantom esd protection circuit employing e-field crowding
10/11/1989EP0335919A1 System and method for securing integrated circuits from unauthorized copying
10/11/1989CN2045897U Welding multihole electric conduction copper tube
10/10/1989US4873615 Semiconductor chip carrier system
10/10/1989US4873613 Compact high power modular RF semi-conductor systems packaging
10/10/1989US4873565 Stud with corrosion resistant cladding extends through insulator
10/10/1989US4873151 Aluminum nitride circuit substrate
10/10/1989US4872843 Interconnection systems for electrical circuits
10/10/1989US4872825 Method and apparatus for making encapsulated electronic circuit devices
10/10/1989US4872505 Heat sink for an electronic device
10/10/1989CA1262288A1 Cryogenic packaging scheme
10/05/1989WO1989009493A1 Burn-in pads for tab interconnect structures
10/05/1989WO1989009492A1 Gate array structure and process to allow optioning at second metal mask only
10/05/1989WO1989009491A1 Device mounting
10/04/1989EP0335783A1 Casing for an electronic circuit
10/04/1989EP0335744A1 Semiconducting device mounting
10/04/1989EP0335740A2 IC packing device with impedance adjusting insulative layer
10/04/1989EP0335697A2 Integrated circuit device comprising interconnection wiring
10/04/1989EP0335695A2 Integrated circuit device comprising interconnection wiring
10/04/1989EP0335679A2 Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
10/04/1989EP0335663A2 A protected electronic component
10/04/1989EP0335660A2 Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus
10/04/1989EP0335608A2 Lead frame with reduced corrosion
10/04/1989EP0335589A2 Device for cooling electrical and electronic equipment
10/04/1989EP0335420A2 Electrical and mechanical joint construction between a printed wiring board and a lead pin
10/04/1989EP0335383A2 Semiconductor device having a metallization film layer
10/04/1989EP0335291A2 Method and device of plating pin grid arrays
10/04/1989EP0335281A2 Method of making user adapted printed circuit boards
10/04/1989EP0335074A2 Alignment mark system
10/03/1989US4872140 Laser programmable memory array
10/03/1989US4872089 Heat sink assembly for densely packed transistors
10/03/1989US4872088 Radial mounting for stacked wafer modules with cooling
10/03/1989US4872050 Interconnection structure in semiconductor device and manufacturing method of the same
10/03/1989US4872049 Encapsulated low-noise ultra-high frequency semiconductor device
10/03/1989US4872048 Semiconductor device having copper alloy leads
10/03/1989US4872047 Semiconductor die attach system
10/03/1989US4871896 Process and device to enhance system performance accuracy in a laser writing process
10/03/1989US4871687 Method of fabricating a MESFET transistor with gate spaced above source electrode by layer of air or the like
10/03/1989US4871583 Housing for an electronic device
10/03/1989US4871015 Cooling arrangement
10/03/1989CA1262070A1 Irradiation cross-linkable thermostable polymer system, for microelectronic applications
09/1989
09/28/1989DE3809005A1 Chip module and its production and use
09/28/1989DE3808619A1 Anordnung zum loesbaren befestigen von module auf einem modultraeger Arrangement for releasably securing of modules on a modultraeger
09/27/1989EP0334747A1 Device for interconnecting and protecting a bare chip of a high frequency component
09/27/1989EP0334733A1 Manufacturing process of an electronic memory card and card obtained by such process
09/27/1989EP0334709A1 Apparatus for selective tin-plating of the conductors of a high density integrated support and a tin-plating process utilizing such an apparatus
09/27/1989EP0334708A1 Device for joining two pieces together under pressure and integrated circuit package using said device
09/27/1989EP0334397A2 Circuit board
09/27/1989EP0334330A2 Opto-electric transducing element and method for producing the same
09/27/1989EP0333803A1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds
09/27/1989EP0333734A1 Attachment of semiconductor die to lead frame by means of an adhesive resin
09/26/1989US4870477 Curable polymer for leak detection
09/26/1989US4870474 Lead frame
09/26/1989US4870300 Standard cell system large scale integrated circuit with heavy load lines passing through the cells
09/26/1989US4870224 Integrated circuit package for surface mount technology
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