Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1989
11/21/1989US4882654 Method and apparatus for adjustably mounting a heat exchanger for an electronic component
11/21/1989US4882650 Capacitors
11/21/1989US4882612 Power semiconductor device
11/21/1989US4882608 Multilayer semiconductor device having multiple paths of current flow
11/21/1989US4882455 Electronic circuit substrates
11/21/1989US4882298 Method for encapsulating microelectronic semiconductor and thin film devices
11/21/1989US4882293 Method of making an electrically programmable integrated circuit containing meltable contact bridges
11/21/1989US4882237 Aluminum-ceramic complex material
11/21/1989US4882212 Electronic packaging of components incorporating a ceramic-glass-metal composite
11/21/1989US4882200 Method for photopatterning metallization via UV-laser ablation of the activator
11/21/1989US4881974 Silver-glass paste
11/21/1989US4881639 IC carrier
11/21/1989CA1263196A1 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method
11/16/1989WO1989011210A1 Improved retention means for chip carrier sockets
11/16/1989WO1989011161A1 Bonding wire for semiconductor elements
11/15/1989EP0342141A2 Compliant thermally conductive compound
11/15/1989EP0342094A1 Planar type high frequency integrated circuit comprising at least one Mesa component, and his manufacturing process
11/15/1989EP0341950A2 Flat cooling structure of integrated circuit
11/15/1989EP0341504A2 Plastic chip carrier package and method of preparation
11/15/1989EP0341482A1 Circuit arrangement for determining the overtemperature of a semiconductor element
11/15/1989EP0341471A2 Method for encapsulating electronic components
11/14/1989US4881118 Semiconductor device
11/14/1989US4881117 Semiconductor power device formed of a multiplicity of identical parallel-connected elements
11/14/1989US4881116 Package for integrated circuit
11/14/1989US4881114 Selectively formable vertical diode circuit element
11/14/1989US4881113 Semiconductor integrated circuits with a protection device
11/14/1989US4880754 Method for providing engineering changes to LSI PLAs
11/14/1989US4880708 Metallization scheme providing adhesion and barrier properties
11/14/1989US4880684 Sealing and stress relief layers and use thereof
11/14/1989US4880386 Socketing a semiconductor device
11/14/1989US4880053 Two-phase cooling apparatus for electronic equipment and the like
11/14/1989US4879891 Method of manufacturing heat sink apparatus
11/08/1989EP0341201A2 Ultrathin layers from dibenzotetraazo-[14]-annulene derivatives
11/08/1989EP0341075A2 Symmetrical blocking high voltage breakdown semiconductor device and method of fabrication
11/08/1989EP0340997A2 Electrically insulating polymer matrix with conductive path formed in situ
11/08/1989EP0340959A2 Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
11/08/1989EP0340916A2 Electronic component insertion machine
11/08/1989EP0340727A2 Semiconductor device having organic film as interlayer insulating film for multilayer wirings
11/08/1989EP0340527A2 Improved semiconductor device packaging structures
11/08/1989EP0340521A2 Fluidic-cooling arrangement for electronic components, particularly of integrated circuits with semiconductors
11/08/1989EP0340497A1 Method of manufacturing monolithic integrated multifunctional circuits
11/08/1989EP0340492A2 Conformal sealing and interplanar encapsulation of electronic device structures
11/08/1989EP0340466A2 Semiconductor device comprising leads
11/08/1989EP0340284A1 Self-aligning liquid-cooling assembly
11/08/1989EP0340241A1 High density electronic package comprising stacked sub-modules.
11/07/1989US4879633 Direct bond circuit assembly with ground plane
11/07/1989US4879632 Cooling system for an electronic circuit device
11/07/1989US4879630 Housing for an electronic circuit
11/07/1989US4879629 Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation
11/07/1989US4879589 Hermetic leadless semiconductor device package
11/07/1989US4879588 Integrated circuit package
11/07/1989US4879587 Apparatus and method for forming fusible links
11/07/1989US4879586 High voltage transistor
11/07/1989US4879156 Multilayered ceramic substrate having solid non-porous metal conductors
11/07/1989US4879153 Integrated circuit card
11/07/1989US4878991 Simplified method for repair of high density interconnect circuits
11/07/1989US4878770 IC chips with self-aligned thin film resistors
11/02/1989WO1989010630A1 Low stress liquid cooling assembly
11/02/1989EP0339881A1 Method of making a ciccuit board
11/02/1989EP0339871A2 Corrosion tolerant bonding pad and method of fabricating same
11/02/1989EP0339763A2 IC card
11/02/1989EP0339586A2 Semiconductor device having improved gate capacitance and manufacturing method therefor
11/02/1989EP0339534A2 Customizable semiconductor devices
11/02/1989EP0339315A1 A method for fabricating semiconductor devices which are protected from pattern contamination
11/02/1989EP0339154A2 Memory card
11/02/1989EP0215947B1 Electronic module with self-activated heat pipe
11/02/1989DE3813566A1 Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production
11/02/1989DE3813565A1 Electrical connection of hybrid assemblies
11/01/1989CN2047070U Air blast radiator for electric power semi-conductor device
11/01/1989CN1005673B Component for three-phase bridge conversion circuit
10/1989
10/31/1989US4878155 High speed discrete wire pin panel assembly with embedded capacitors
10/31/1989US4878108 Heat dissipation package for integrated circuits
10/31/1989US4878106 Semiconductor circuit packages for use in high power applications and method of making the same
10/31/1989US4878105 Semiconductor device having wiring layer composed of silicon film and aluminum film with improved contact structure thereof
10/31/1989US4878098 Semiconductor integrated circuit device
10/31/1989US4877760 Compaction with group four, five, or six metal boride; sintering
10/31/1989US4877756 Method of packaging a semiconductor laser and photosensitive semiconductor device
10/31/1989US4877577 Thermal exfoliation resistance, tensile strength, wear resistance; tin, nickel, silicon, zinc, calcium, magnesium, and lead
10/31/1989US4877483 Method for contact between two conductive or semi-conductive layers deposited on a substrate
10/31/1989US4877175 Laser debridging of microelectronic solder joints
10/26/1989DE3911874A1 Copper alloy for electronic devices and process for producing a wire therefrom
10/26/1989DE3812563A1 Copper-chromium-titanium-silicon alloy, process for preparing it, and use thereof
10/25/1989EP0338817A2 Semiconductor integrated circuit device and method of producing the same using master slice approach
10/25/1989EP0338728A2 Integrated circuit package using plastic encapsulant
10/25/1989EP0338706A2 A carrier assembly and a process for producing a carrier assembly for a semi-conductor package
10/25/1989EP0338636A1 Process for providing small dimension electrical contacts to a semiconductor device
10/25/1989EP0338631A1 Device and method of manufacturing a device
10/25/1989EP0338467A1 Diffusion barrier structure for a semiconductor device
10/25/1989EP0338298A2 Semiconductor device having a lead frame and manufacturing method therefor
10/25/1989EP0338249A2 Electronic package
10/25/1989EP0338232A2 Method for mounting a flexible film electronic device carrier on or for separating it from a substrate
10/25/1989EP0338213A2 Semiconductor device with a metal package
10/25/1989EP0338206A1 Process for depositing conformal layers of tungsten onto semi-conductor substrates, for the production of integrated circuits
10/25/1989EP0338190A2 Process for manufacturing an airgap isolated crossing and device
10/25/1989EP0338122A1 Integrated circuit comprising a semiconductor magnetic field sensor
10/25/1989EP0338084A1 Structure of superconductor wiring and process for its formation
10/24/1989US4876588 Bonding to resin film and metal plate
10/24/1989US4876587 One-piece interconnection package and process
10/24/1989US4876584 Electrostatic discharge protection circuit
10/24/1989US4876322 Irradiation cross-linkable thermostable polymer system, for microelectronic applications
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