H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1989
12/20/1989	EP0346494A1 Superconducting wire structure
12/19/1989	US4888637 Multiple semiconductor heat sink/mounting assembly
12/19/1989	US4888634 Dispersion of particles in a cured binder between chip and substrate provide uniform thermal insulation
12/19/1989	US4888623 Semiconductor device with PN junction isolation for TTL or ECL circuits
12/19/1989	US4888449 Metal(or alloy)frame, copper base and cap with polymer coating
12/19/1989	US4888390 Rubbery compounds as modifiers for poly(arylene sulfide)
12/19/1989	US4888314 For dielectrics
12/19/1989	US4888307 Method for manufacturing plastic encapsulated semiconductor devices
12/19/1989	US4888306 Method of manufacturing a bipolar transistor
12/19/1989	US4888299 Routing among field effect transistors
12/19/1989	US4888297 Depositing two layers of refractory alloy between polysilicon and interconnect metal
12/19/1989	US4888247 Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
12/19/1989	US4888226 Blend of polydimethyl(or methylphenyl)siloxane having vinyl or hydride functional components; silica and silicon hydride
12/19/1989	US4887969 IC socket
12/19/1989	US4887760 Bonding sheet for electronic component and method of bonding electronic component using the same
12/19/1989	EP0268643A4 Electrical circuit interconnection.
12/14/1989	WO1989012320A1 Wafer scale integrated circuits
12/14/1989	WO1989012319A1 Semiconductor packaging module and heat-conducting block structure used therefor
12/14/1989	DE3916980A1 Mit kunststoff umhuellte, integrierte multichip-hybridschaltung With plastic sheathed, integrated multi-chip hybrid circuit
12/13/1989	EP0346166A1 Apparatus for the regulation of the temperature of a component by blowing a gas at the appropriate temperature
12/13/1989	EP0346061A2 Integrated circuit device having an improved package structure
12/13/1989	EP0346035A2 Terminal structure and process of fabricating the same
12/13/1989	EP0345809A1 Ceramic laminated circuit substrate, method for making same and use of the substrate
12/13/1989	EP0345760A2 Semiconductor device in plastic case with means of anchoring between chip-bearing slice and plastic body
12/13/1989	EP0345435A2 Semiconductor device with a high breakdown voltage and method for its manufacture
12/13/1989	EP0345342A1 Low cost, hermetic pin grid array package
12/12/1989	US4887182 Germanium, selenium, and antimony intermetallic
12/12/1989	US4887149 Semiconductor device mounted in a highly flexible, segmented package, provided with heat sink
12/12/1989	US4887148 Pin grid array package structure
12/12/1989	US4887147 Thermal package for electronic components
12/12/1989	US4887143 Semiconductor device
12/12/1989	US4887137 Semiconductor memory device
12/12/1989	US4886982 Power transistor with improved resistance to direct secondary breakdown
12/12/1989	US4886709 Aluminum nitride support, copper alloy radiation member, and stress relieving member
12/12/1989	CA1263897A1 Lead straightening of leaded packaged electronic components
12/07/1989	DE3915169A1 Dielectric ceramic composition for high frequency
12/07/1989	DE3818428A1 Cooling box for dissipating the heat loss of semiconductors
12/06/1989	EP0345162A1 Wafer scale integration device
12/06/1989	EP0344720A2 Method of producing electrical connection members
12/06/1989	EP0344719A2 Electric circuit device
12/06/1989	EP0344702A2 Electric circuit apparatus
12/06/1989	EP0344504A2 Article comprising a polyimide and a metal layer and methods of making such articles
12/06/1989	EP0344292A1 A process of fabricating self-aligned semiconductor devices
12/06/1989	EP0344290A1 Vacuum apparatus.
12/06/1989	EP0344277A1 Self-aligned interconnects for semiconductor devices
12/06/1989	EP0344259A1 Method and means of fabricating a semiconductor device package
12/05/1989	US4885662 Circuit module connection system
12/05/1989	US4885630 High power multi-layer semiconductive switching device having multiple parallel contacts with improved forward voltage drop
12/05/1989	US4885628 Semiconductor integrated circuit device
12/05/1989	US4885625 Integrated circuit chip manufacture
12/05/1989	US4885135 Fine gold alloy wire for bonding of a semi-conductor device
12/05/1989	US4885029 With metal oxide particles; yield strength without recrystallization; for lead frames for integrated circuits
12/05/1989	US4884631 Forced air heat sink apparatus
12/05/1989	US4884630 End fed liquid heat exchanger for an electronic component
12/05/1989	US4884331 Method of manufacturing heat sink apparatus
11/1989
11/30/1989	DE3916636A1 Integrierte schaltung mit verbessertem kontaktfleck Integrated circuit with improved stain contact
11/30/1989	DE3916168A1 Ultrafeine draehte aus einer kupferlegierung und halbleitervorrichtungen unter verwendung derselben Ultrafine wires made of a copper alloy and semiconductor devices using the same
11/30/1989	DE3836002A1 Unterlagschicht mit weicher oberflaeche fuer halbleiterbauteile Backing with a soft surface 'for semiconductor components
11/29/1989	EP0344084A2 High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology
11/29/1989	EP0343936A2 Module sealing structure
11/29/1989	EP0343722A1 Screen-printed superconductor device
11/29/1989	EP0343698A1 Process for producing interconnect structures on a semiconductor device, especially on an LSI circuit
11/29/1989	EP0343667A2 Contact structure for connecting electrode to a semiconductor device and a method of forming the same
11/29/1989	EP0343633A2 Semiconductor integrated circuit
11/29/1989	EP0343563A2 Bipolar transistor with a reduced base resistance, and method for the production of a base connection region for a bipolar transistor structure
11/29/1989	EP0343400A2 Electronic package assembly with flexible carrier and method of making it
11/29/1989	EP0343379A2 Thin film package for mixed bonding of a chip
11/29/1989	EP0343269A1 High performance interconnect system for an integrated circuit
11/29/1989	EP0238651B1 Magnetically sealed multichip integrated circuit package
11/29/1989	EP0192646B1 Diffusion barrier layer for integrated-circuit devices
11/29/1989	CN1037549A Semiconductor device metallization process
11/29/1989	CN1005945B Heat-resistant plastic semiconductor device
11/28/1989	US4884237 Stacked double density memory module using industry standard memory chips
11/28/1989	US4884169 Bubble generation in condensation wells for cooling high density integrated circuit chips
11/28/1989	US4884167 Cooling system for three-dimensional IC package
11/28/1989	US4884125 Hybrid integrated circuit device capable of being inserted into socket
11/28/1989	US4884124 Resin-encapsulated semiconductor device
11/28/1989	US4884122 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer
11/28/1989	US4884121 Semiconductor device
11/28/1989	US4884120 Semiconductor device and method for making the same
11/28/1989	US4884115 Basic cell for a gate array arrangement in CMOS Technology
11/28/1989	US4883980 Semiconductor IC (integrated circuit) device
11/28/1989	US4883777 Sealing members in semiconductor devices
11/28/1989	US4883774 Multilayer, copper, baths, connectors
11/28/1989	US4883744 Forming a polymide pattern on a substrate
11/28/1989	US4883705 Glass powders, aluminum silicates, zinc oxide, refractory fillers
11/28/1989	US4883704 Aluminum nitrides, ceramics
11/28/1989	US4883428 Test socket incorporating circuit elements
11/28/1989	CA1263460A1 Electronic package assembly and accessory component therefor
11/27/1989	EP0319575A4 Fabrication of interlayer conductive paths in integrated circuits.
11/23/1989	EP0343030A1 Flexible printed circuit, particularly for electronic microcircuit cards, and card incorporating this circuit
11/23/1989	EP0342925A2 Active matrix panel
11/23/1989	EP0342881A1 Linewidth loss measurement
11/23/1989	EP0342681A2 Method of manufacturing an electrical device
11/23/1989	EP0342595A2 Sintered body of aluminium nitride
11/23/1989	EP0342590A2 Master slice type semiconductor integrated circuit
11/23/1989	EP0342393A2 Process for forming a polyimide pattern on a substrate
11/23/1989	EP0342390A1 Casing for electric components, packages or integrated circuits
11/21/1989	US4882657 Pin grid array assembly
11/21/1989	US4882656 Surface mounted decoupling capacitor

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