Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2013
08/15/2013WO2013119514A1 Method for three-dimensional packaging of electronic devices
08/15/2013WO2013119471A1 Three dimensional passive multi-component structures
08/15/2013WO2013119338A1 FLIP-CHIP MOUNTED MICROSTRIP MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICs)
08/15/2013WO2013119309A1 Stacked die assembly with multiple interposers
08/15/2013WO2013117220A1 Casing for electronic equipment with an integrated heat sink
08/15/2013WO2013117213A1 Heat sink with laminated fins and method for production of such a heat sink
08/15/2013WO2013116999A1 Method and apparatus for reducing the mechanical stress when mounting assemblies with thermal pads
08/15/2013WO2013074484A3 Semiconductor die assemblies with enhanced thermal management, semiconductor devices including same and related methods
08/15/2013WO2013052466A3 Stub minimization for multi-die wirebond assemblies with orthogonal windows
08/15/2013WO2013052441A3 Stub minimization for wirebond stacked assemblies without windows
08/15/2013US20130210222 Semiconductor devices having conductive via structures and methods for fabricating the same
08/15/2013US20130210196 Semiconductor package with integrated substrate thermal slug
08/15/2013US20130210194 Method of transferring and bonding an array of micro devices
08/15/2013US20130207280 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
08/15/2013US20130207279 Method for manufacturing an integrated circuit comprising vias crossing the substrate
08/15/2013US20130207278 Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof
08/15/2013US20130207277 Electronic device and fabrication method thereof
08/15/2013US20130207276 Novel process for forming a big via
08/15/2013US20130207275 Methods of Forming Device Level Conductive Contacts to Improve Device Performance and Semiconductor Devices Comprising Such Contacts
08/15/2013US20130207274 Wafer-scale package structures with integrated antennas
08/15/2013US20130207273 Metal Line and Via Formation Using Hard Masks
08/15/2013US20130207272 Airgap-containing interconnect structure with patternable low-k material and method of fabricating
08/15/2013US20130207271 Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus
08/15/2013US20130207270 Dual-metal self-aligned wires and vias
08/15/2013US20130207269 Semiconductor device and method of manufacturing the same
08/15/2013US20130207268 Chip assembly system
08/15/2013US20130207267 Interconnection structures in a semiconductor device and methods of manufacturing the same
08/15/2013US20130207266 Copper Interconnect for III-V Compound Semiconductor Devices
08/15/2013US20130207265 Structure and method of making the same
08/15/2013US20130207264 Stress Reduction Apparatus
08/15/2013US20130207263 Semiconductor chips including passivation layer trench structure
08/15/2013US20130207262 Integrated antennas in wafer level package
08/15/2013US20130207261 Maintaining alignment in a multi-chip module using a compressible structure
08/15/2013US20130207260 Semiconductor device and method for manufacturing the same
08/15/2013US20130207259 Method of manufacturing a semiconductor device and wafer
08/15/2013US20130207258 Post-passivation interconnect structure amd method of forming same
08/15/2013US20130207257 Semiconductor device and method for manufacturing the semiconductor device
08/15/2013US20130207256 Semiconductor device and manufacturing method thereof
08/15/2013US20130207255 Semiconductor device package having backside contact and method for manufacturing
08/15/2013US20130207254 Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
08/15/2013US20130207253 Complex Semiconductor Packages and Methods of Fabricating the Same
08/15/2013US20130207252 Semiconductor Device
08/15/2013US20130207251 Semiconductor device with lead terminals having portions thereof extending obliquely
08/15/2013US20130207250 Chip attach frame
08/15/2013US20130207249 Assembly having stacked die mounted on substrate
08/15/2013US20130207248 Device including electrical, electronic, electromechanical or electrooptical components having reduced sensitivity at a low dose rate
08/15/2013US20130207247 Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-up Interconnect Structure
08/15/2013US20130207246 Packaging an Integrated Circuit Die
08/15/2013US20130207245 Methods for making porous insulating films and semiconductor devices including the same
08/15/2013US20130207242 Semiconductor Devices Having Through-Vias and Methods for Fabricating the Same
08/15/2013US20130207241 Semiconductor Devices Having Through-Vias and Methods for Fabricating the Same
08/15/2013US20130207240 Chip package structure and manufacturing method thereof
08/15/2013US20130207205 Noise shielding techniques for ultra low current measurements in biochemical applications
08/15/2013US20130207131 Organic light-emitting display device and method of manufacturing the same
08/15/2013US20130207121 Power conversion device
08/15/2013US20130207108 Critical Dimension and Pattern Recognition Structures for Devices Manufactured Using Double Patterning Techniques
08/15/2013US20130207107 Methods of of improving bump allocation for semiconductor devices and semiconductor devices with improved bump allocation
08/15/2013US20130206466 Multilayer printed wiring board
08/14/2013EP2626919A1 Method of manufacturing heat sink structure for high-power led
08/14/2013EP2626899A2 Heat dissipating module
08/14/2013EP2626898A2 Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
08/14/2013EP2626897A1 Transmission line transition having vertical structure and single chip package using land grid array joining
08/14/2013EP2626896A1 Semiconductor device and method of producing semiconductor device
08/14/2013EP2626205A1 Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor device
08/14/2013EP2625714A2 Interposers, electronic modules, and methods for forming the same
08/14/2013EP2625713A1 Electronic module and method for producing same
08/14/2013EP2625712A2 Radiant heat circuit board, heat generating device package having the same, and backlight unit
08/14/2013EP2625711A1 Method for manufacturing a circuit
08/14/2013EP2625710A1 Heat-sink device intended for at least one electronic component and corresponding method
08/14/2013EP2625708A1 Discrete component backward traceability and semiconductor device forward traceability
08/14/2013EP2624951A1 Dispensable polymeric precursor composition for transparent composite sorber materials
08/14/2013EP2359395B1 Methods for protecting a die surface with photocurable materials
08/14/2013DE112010005985T5 Gehäuse Housing
08/14/2013DE112010005855T5 Warmweisslicht-LED-Chip mit großer Helligkeit und hoher Farbwiedergabe Warm White Light LED chip with high brightness and high color rendering
08/14/2013DE112004002466B4 Vorrichtung und Verfahren zur verbesserten Energieführung Apparatus and method for improved energy management
08/14/2013DE10229038B4 Verkapptes Mikrostrukturbauelement mit Hochfrequenzdurchführung Capped microstructure device with radio frequency feedthrough
08/14/2013DE102013202355A1 Halbleiterchip, verfahren zur herstellung eines halbleiterchips, bauelement und verfahren zur herstellung eines bauelements Semiconductor chip process for producing a semiconductor chip, device and method for manufacturing a device
08/14/2013DE102013202212A1 Zweistufig gemoldeter Sensor Two-stage gemoldeter sensor
08/14/2013DE102013101326A1 Schutzsysteme für integrierte Schaltungen und Verfahren zum Ausbilden derselben Protection systems for integrated circuits and methods of forming the same
08/14/2013DE102012201935A1 Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements Connecting arrangement of an electric and / or electronic component
08/14/2013DE102012201885A1 Electrical power module, has control device and cooling body firmly coupled with each other in heat conductive manner by coupling layer, where coupling layer electrically insulates control device from cooling body
08/14/2013DE102012104730A1 Nachpassivierung-Zusammenschaltungsstruktur und Verfahren zu ihrer Bildung Post-passivation interconnection structure and process for their education
08/14/2013DE102008061068B4 Elektronikbauelement und Verfahren zur Herstellung eines Elektronikbauelements An electronics device and method for producing an electronic device
08/14/2013DE102005009163B4 Halbleiterbauteil mit einem Halbleiterchip, der Signalkontaktflächen und Versorgungskontaktflächen aufweist, sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor component comprising a semiconductor chip, the signal pads and supply pads, and methods for producing the semiconductor device
08/14/2013CN203134806U Layout of electrical connection between active area metal and terminal area
08/14/2013CN203134804U Triode
08/14/2013CN203134803U Triode with heat radiation structure
08/14/2013CN203134791U Stack packaging structure of semiconductor
08/14/2013CN203134790U 半导体结构和芯片 Semiconductor structure and chip
08/14/2013CN203134789U Novel silicon substrate low-resistance inductance structure
08/14/2013CN203134788U COB packaging structure of photosensitive IC
08/14/2013CN203134787U Chip packaging structure
08/14/2013CN203134786U Lead frame bar for semiconductor packaging and mold therefor
08/14/2013CN203134785U A lead frame strip and packaging bodies
08/14/2013CN203134784U Lead frame strip for semiconductor packaging
08/14/2013CN203134783U No-lead semiconductor package structure and lead frame strip
08/14/2013CN203134782U Circuit component
08/14/2013CN203134781U Wafer heat dissipation device
08/14/2013CN203134780U Semiconductor device package metal sheet connecting piece
08/14/2013CN203134779U Advanced quad flat no-lead packing structure
1 ... 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214 215 216 217 218 219 ... 2262