| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/16/1990 | US4894709 Forced-convection, liquid-cooled, microchannel heat sinks |
| 01/16/1990 | US4894708 LSI package having a multilayer ceramic substrate |
| 01/16/1990 | US4894707 Semiconductor device having a light transparent window and a method of producing same |
| 01/16/1990 | US4894705 Semiconductor device |
| 01/16/1990 | US4894704 Lead frame having projections for resin molding |
| 01/16/1990 | US4894293 Circuit system, a composite metal material for use therein, and a method for making the material |
| 01/16/1990 | US4894115 Laser beam scanning method for forming via holes in polymer materials |
| 01/11/1990 | WO1990000314A2 Method of activation of superconductors and devices produced thereby |
| 01/11/1990 | WO1990000311A1 Plasma-nitridated self-aligned tungsten system for vlsi interconnections |
| 01/11/1990 | DE3823347A1 Power semiconductor element |
| 01/11/1990 | DE3822923A1 Method for producing an electric sensor |
| 01/10/1990 | EP0350326A2 Resin compositions for sealing semiconductors |
| 01/10/1990 | EP0350015A2 Power MOSFET with a temperature sensor |
| 01/10/1990 | EP0350011A2 Hermetic hybrid film circuit assembly with unpackaged active components and process for its fabrication |
| 01/10/1990 | EP0349703A2 Multilayer field-effect transistor |
| 01/10/1990 | EP0349605A1 Semiconductor devices with programmable passive-component layer and process for producing the same |
| 01/10/1990 | EP0349549A1 Support assembly for integrated circuits |
| 01/10/1990 | EP0191057B1 Electrical contact in semiconductor devices |
| 01/10/1990 | CN1038721A Electronic parts, encapsulant for electronic parts, and encapsulating method |
| 01/10/1990 | CN1006440B Hybrid and multi-layer circuit |
| 01/09/1990 | US4893215 Electronic circuit apparatus of automobile |
| 01/09/1990 | US4893174 High density integration of semiconductor circuit |
| 01/09/1990 | US4893173 Low-inductance semiconductor apparatus |
| 01/09/1990 | US4893172 Connecting structure for electronic part and method of manufacturing the same |
| 01/09/1990 | US4893170 Semiconductor device with multi-level wiring in a gate array |
| 01/09/1990 | US4893169 Lead frame and a process for the production of a lead with this lead frame |
| 01/09/1990 | US4893167 Method for programmable laser connection of two superimposed conductors of the interconnect system of an integrated circuit |
| 01/09/1990 | US4893163 Semiconductor wafer |
| 01/09/1990 | US4892845 Phosphosilicate glass |
| 01/09/1990 | US4892844 Making a low resistance three layered contact for silicon devices |
| 01/09/1990 | US4892843 Reduction of tungsten hexafluoride to form two tungsten layer, reduction with silane and hydrogen |
| 01/09/1990 | US4892842 Method of treating an integrated circuit |
| 01/09/1990 | US4892841 Aluminum wire |
| 01/09/1990 | US4892837 Method for manufacturing semiconductor integrated circuit device |
| 01/09/1990 | US4892613 Process for etching light-shielding thin film |
| 01/09/1990 | CA1264381A1 Fabrication of a bipolar transistor with a polysilicon ribbon |
| 01/09/1990 | CA1264380A1 Semiconductor device package with integral earth lead and side wall |
| 01/09/1990 | CA1264379A1 Process for fabricating multilevel metal integrated circuits and structures produced thereby |
| 01/09/1990 | CA1264360A1 Self-heating, self-soldering bus bar |
| 01/08/1990 | EP0336944A4 Copper-tungsten metal mixture and process. |
| 01/08/1990 | EP0269679A4 Electrical circuit interconnection. |
| 01/03/1990 | EP0349318A2 Methods of making integrated circuit packages |
| 01/03/1990 | EP0349255A2 A thin-film transistor array |
| 01/03/1990 | EP0349107A2 Semiconductor devices |
| 01/03/1990 | EP0349095A2 Method of making a metal wire for use in integrated circuits. |
| 01/03/1990 | EP0349070A2 A method of manufacturing a semiconductor device |
| 01/03/1990 | EP0349022A2 Semiconductor device |
| 01/03/1990 | EP0349021A2 Semiconductor device and method of manufacturing the same |
| 01/03/1990 | EP0349001A2 Semiconductor device having a stress relief film protected against cracking |
| 01/03/1990 | EP0349000A2 A TAB film tape carrier |
| 01/03/1990 | EP0348972A2 A semiconductor device and a process for manufacturing thereof |
| 01/03/1990 | EP0348838A2 Bellows heat pipe for thermal control of electronic components |
| 01/03/1990 | EP0348815A2 Method and apparatus for coating semiconductor components on a dielectric film |
| 01/03/1990 | EP0348640A2 Semiconductor device including a protective film |
| 01/03/1990 | CN1006356B Millite ceramic multi-layered substrate and process for producing same |
| 01/02/1990 | US4891735 Heat sink for electrical components |
| 01/02/1990 | US4891730 Monolithic microwave integrated circuit terminal protection device |
| 01/02/1990 | US4891687 Multi-layer molded plastic IC package |
| 01/02/1990 | US4891686 Semiconductor packaging with ground plane conductor arrangement |
| 01/02/1990 | US4891344 Mullite and sintering promoter |
| 01/02/1990 | US4891333 Semiconductor device and manufacturing method thereof |
| 01/02/1990 | US4891332 Method of manufacturing a semiconductor device comprising a circuit element formed of carbon doped polycrystalline silicon |
| 01/02/1990 | US4891329 Forming multilayer dielectric; bonding |
| 01/02/1990 | US4891259 Multilayer systems and their method of production |
| 01/02/1990 | US4891112 Stress relieving by concurrent resputtering from deposited layer |
| 01/02/1990 | US4891066 Highly pure titanium |
| 12/28/1989 | WO1989012911A1 Protected lead frame and method for fabricating lead frames |
| 12/28/1989 | DE3820736A1 Arrangement for temperature stabilisation |
| 12/27/1989 | EP0348361A2 Hollow plastic package for semiconductor devices |
| 12/27/1989 | EP0348046A2 Method of producing a semiconductor device |
| 12/27/1989 | EP0348018A2 Resin encapsulated semiconductor device and method of manufacture thereof |
| 12/27/1989 | EP0347991A2 Use of venting slots to improve hermetic seal for semiconductor dice housed in ceramic packages |
| 12/27/1989 | EP0347792A2 Multi-layer wirings on a semiconductor device and fabrication method |
| 12/27/1989 | EP0347613A2 Semiconductor device with pressure connection means |
| 12/27/1989 | EP0347597A2 Insulating electromagnetic shielding resin composition |
| 12/27/1989 | EP0347518A1 Passivation of a semiconductor device |
| 12/27/1989 | EP0347470A1 Method of forming superconducting wires |
| 12/27/1989 | EP0233916B1 Heat sink formed of stacked fin elements |
| 12/26/1989 | US4890196 Solderable heat sink fastener |
| 12/26/1989 | US4890195 Replaceable MMIC chip carrier captured by differential thermal expansion between carrier and support housing |
| 12/26/1989 | US4890191 Integrated circuits |
| 12/26/1989 | US4890187 Integrated circuit protected against electrostatic discharges, with variable protection threshold |
| 12/26/1989 | US4890157 Integrated circuit product having a polyimide film interconnection structure |
| 12/26/1989 | US4890155 Package for mounting a semiconductor chip of ultra-high frequency |
| 12/26/1989 | US4890154 Semiconductor package profile |
| 12/26/1989 | US4890153 Single bonding shelf, multi-row wire-bond finger layout for integrated circuit package |
| 12/26/1989 | US4890152 Plastic molded chip carrier package and method of fabricating the same |
| 12/26/1989 | US4890150 Dielectric passivation |
| 12/26/1989 | US4890148 Flip-flop circuit |
| 12/26/1989 | US4890142 Power MOS transistor structure |
| 12/26/1989 | US4889960 Stress resistance; tin-phosphorus-oxy-fluoride glass matrix |
| 12/26/1989 | US4889832 Forming etch barrier |
| 12/26/1989 | US4889229 Cassette for storing a plurality of electronic component chips |
| 12/20/1989 | EP0347321A1 Chip card with a protection layer |
| 12/20/1989 | EP0347239A2 Recording head having spaced-apart electrodes |
| 12/20/1989 | EP0347238A2 Minutely patterned structure, and method of producing the same |
| 12/20/1989 | EP0347111A2 Metal-semiconductor field effect transistor device |
| 12/20/1989 | EP0346888A1 Tin whisker-free tin or tin alloy plated article and coating technique thereof |
| 12/20/1989 | EP0346719A2 Device for cooling regions with limited thermal exchange surface, in particular for electronic components |
| 12/20/1989 | EP0346617A2 Formation of metallic interconnects by grit blasting |