| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/13/1990 | US4901138 Semiconductor converter |
| 02/13/1990 | US4901137 Electronic apparatus having semiconductor device |
| 02/13/1990 | US4901136 Multi-chip interconnection package |
| 02/13/1990 | US4901135 Hermetically sealed housing with welding seal |
| 02/13/1990 | US4901133 Multilayer semi-insulating film for hermetic wafer passivation and method for making same |
| 02/13/1990 | US4901041 High-performance package for monolithic microwave integrated circuits |
| 02/13/1990 | US4901029 Solid-state high power amplifier arrangement |
| 02/13/1990 | US4900709 Applying a copper oxide-based material to a substrate pattern of two different materials to effect superconductivity when overlaying one and to be nonconductive on the other |
| 02/13/1990 | US4900695 Semiconductor integrated circuit device and process for producing the same |
| 02/13/1990 | US4900690 MOS semiconductor process with double-layer gate electrode structure |
| 02/13/1990 | US4900582 Method for improving film quality of silica-based films |
| 02/08/1990 | WO1990001215A1 Semiconductor device |
| 02/08/1990 | WO1990000966A1 Thick film dielectric compositions |
| 02/08/1990 | WO1990000314A3 Method of activation of superconductors and devices produced thereby |
| 02/08/1990 | DE3831086C1 Method for determining the alignment of two regions formed in an integrated monolithic (semiconductor) circuit |
| 02/08/1990 | DE3823348A1 High-performance semiconductor component |
| 02/07/1990 | EP0354181A2 Curing combination for cationically polymerisable materials |
| 02/07/1990 | EP0354114A1 Method of building solder bumps and resulting structure |
| 02/07/1990 | EP0354056A2 Coated electric devices and methods of manufacturing the same |
| 02/07/1990 | EP0354033A2 Resin compositions for sealing semiconductors |
| 02/07/1990 | EP0353693A2 Compound semiconductor mesfet device |
| 02/07/1990 | EP0353671A2 Cooling apparatus |
| 02/07/1990 | EP0353518A1 Process for preserving the surface of silicon wafers |
| 02/07/1990 | EP0353437A1 An end fed liquid heat exchanger for an electronic component |
| 02/07/1990 | EP0353426A2 Semiconductor integrated circuit device comprising conductive layers |
| 02/07/1990 | EP0353414A2 Semiconductor device comprising conductive layers |
| 02/07/1990 | EP0353243A1 Improved density semicustom integrated circuit chip |
| 02/07/1990 | CN2052204U Electronic cool cap with sobering function |
| 02/07/1990 | CN1039504A Electric device and manufacturing method of same |
| 02/06/1990 | US4899259 Encased electric component |
| 02/06/1990 | US4899257 Electric device with an operation indicating lamp |
| 02/06/1990 | US4899255 Heat sink clip and assembly and method of manufacture |
| 02/06/1990 | US4899211 Semiconductor cooling mechanisms |
| 02/06/1990 | US4899210 For an element to be cooled |
| 02/06/1990 | US4899209 Resin sealed semiconductor device |
| 02/06/1990 | US4899208 Power distribution for full wafer package |
| 02/06/1990 | US4899207 Outer lead tape automated bonding |
| 02/06/1990 | US4899206 Whisker formation suppression |
| 02/06/1990 | US4899205 Electrically-programmable low-impedance anti-fuse element |
| 02/06/1990 | US4899199 Schottky diode with titanium or like layer contacting the dielectric layer |
| 02/06/1990 | US4899185 High density tape-automated bonding (TAB) of electronic components |
| 02/06/1990 | US4899118 Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
| 02/06/1990 | US4898907 Compositions of platinum and rhodium catalyst in combination with hydrogen silsesquioxane resin |
| 02/06/1990 | US4898838 Method for fabricating a poly emitter logic array |
| 02/06/1990 | US4898767 Copper-exuding boroaluminosilicate glasses |
| 02/06/1990 | US4898320 Method of manufacturing a high-yield solder bumped semiconductor wafer |
| 02/06/1990 | US4897918 Method of manufacturing an interboard connection terminal |
| 02/01/1990 | DE3825979A1 Arrangement for cooling components which dissipate lost heat |
| 01/31/1990 | EP0353120A1 A method of forming a barrier layer between a silicon substrate and an aluminium electrode of a semiconductor device |
| 01/31/1990 | EP0353114A1 Interconnection device between an integrated circuit and an electrical circuit and method of manufacturing the device |
| 01/31/1990 | EP0352973A2 Process for producing a composite article comprising a copper element |
| 01/31/1990 | EP0352943A2 Method for producing a sheet member containing at least one enclosed channel |
| 01/31/1990 | EP0352940A2 Method of measuring specific contact resistivity of self-aligned contacts in integrated circuits |
| 01/31/1990 | EP0352736A2 Process for producing a resist structure on semiconductor material with reducing width in direction of the semiconductor material |
| 01/31/1990 | EP0352664A1 Semiconductor memory device having bit lines less liable to have influences of the adjacent bit lines |
| 01/31/1990 | EP0352429A2 High power, pluggable tape automated bonding package |
| 01/31/1990 | CN1039328A Protective structure of integrated circuit |
| 01/30/1990 | US4897764 Conductive cooling cup module |
| 01/30/1990 | US4897763 Circuit arrangement having a plurality of electrical elements to be cooled |
| 01/30/1990 | US4897762 Cooling system and method for electronic circuit devices |
| 01/30/1990 | US4897757 Protection structure for an integrated circuit |
| 01/30/1990 | US4897712 Heat sink, particulary for the cooling of electronic elements |
| 01/30/1990 | US4897711 Subassembly for optoelectronic devices |
| 01/30/1990 | US4897710 Semiconductor device |
| 01/30/1990 | US4897709 Titanium nitride film in contact hole with large aspect ratio |
| 01/30/1990 | US4897708 Semiconductor wafer array |
| 01/30/1990 | US4897509 Glass-ceramics for electronic packaging |
| 01/30/1990 | US4897508 Metal electronic package |
| 01/30/1990 | US4897287 Metallization process for an integrated circuit |
| 01/30/1990 | US4897153 Method of processing siloxane-polyimides for electronic packaging applications |
| 01/30/1990 | US4896464 Method of forming upstanding conductive terminals of a ceramic structure |
| 01/30/1990 | CA1265260A1 Method of sealing electric and electronic parts |
| 01/30/1990 | CA1265258A1 High temperature interconnect system for an integrated circuit |
| 01/25/1990 | WO1990000817A1 Electrical device |
| 01/25/1990 | WO1990000814A1 Semiconductor device sealed with resin and a method of producing the same |
| 01/25/1990 | WO1990000813A1 Semiconductor device |
| 01/24/1990 | EP0352183A1 Process for mounting electronic micro components on a support, and intermediate product |
| 01/24/1990 | EP0352020A2 Semiconductor integrated circuit chip-to-chip interconnection scheme |
| 01/24/1990 | EP0351819A2 Standard cells with flip-flops |
| 01/24/1990 | EP0351749A2 Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor |
| 01/24/1990 | EP0351602A2 Ceramic semiconductor package having crack arrestor patterns |
| 01/24/1990 | EP0351581A1 High-density integrated circuit and method for its production |
| 01/24/1990 | EP0351533A1 Process for coating a substrate with metallic layer |
| 01/24/1990 | EP0351531A2 Electronic module |
| 01/24/1990 | CN1039151A Method of manufacturing semiconductor device |
| 01/24/1990 | CN1006585B Circuit teaching device with cards and socket connecting units |
| 01/23/1990 | US4896204 Multilayer film for interconnection, aluminum, aluminum alloy, aluminum oxide |
| 01/23/1990 | US4896199 Semiconductor device with protective means against overheating |
| 01/23/1990 | US4896194 Semiconductor device having an integrated circuit formed on a compound semiconductor layer |
| 01/23/1990 | US4896108 Test circuit for measuring specific contact resistivity of self-aligned contacts in integrated circuits |
| 01/23/1990 | US4896034 Method of identifying a semiconductor wafer utilizing a light source and a detector |
| 01/23/1990 | US4895291 Coating housing and cover with tin or indium, alloying |
| 01/23/1990 | CA1264872A1 Mounting of an integrated circuit on a support |
| 01/23/1990 | CA1264865A1 Semiconductor interconnection structure |
| 01/17/1990 | EP0351184A2 Pin grid array packaging structure |
| 01/17/1990 | EP0350833A2 Integrated circuit package structure |
| 01/17/1990 | EP0350593A2 Electronic package with heat spreader member |
| 01/17/1990 | EP0350588A2 Electronic package with improved heat sink |
| 01/16/1990 | US4894752 Lead frame for a semiconductor device |
| 01/16/1990 | US4894751 Printed circuit board for electronics |