Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1990
03/13/1990US4908086 Low-cost semiconductor device package process
03/13/1990US4908078 Material for conductive parts of electronic or electric devices
03/13/1990CA1266725A1 Integrated circuit chips mounting and packaging assembly
03/08/1990DE3927866A1 Halbleiterbauelement Semiconductor device
03/07/1990EP0357228A1 Insertion/extraction tool
03/07/1990EP0357221A1 Process for producing contacts in integrated circuits having shallow junctions
03/07/1990EP0357116A1 Method of manufacturing a semiconductor device
03/07/1990EP0357064A2 Metal bump type semiconductor device and method for manufacturing the same
03/07/1990EP0356465A1 Encapsulation barrier for thick-film hybrid circuits
03/07/1990EP0161282B1 Semiconductor package with internal heat exchanger
03/06/1990US4907129 Lead frame and electronic divice
03/06/1990US4907128 Chip to multilevel circuit board bonding
03/06/1990US4907125 Circuit module including a plate-shaped circuit carrier of glass or ceramic
03/06/1990US4907124 Bolted circuit assembly with isolating washer
03/06/1990US4907068 Semiconductor arrangement having at least one semiconductor body
03/06/1990US4907067 Thermally efficient power device package
03/06/1990US4907065 Integrated circuit chip sealing assembly
03/06/1990US4907064 Semiconductor device having silicon oxynitride film with improved moisture resistance
03/06/1990US4907062 Semiconductor wafer-scale integrated device composed of interconnected multiple chips each having an integration circuit chip formed thereon
03/06/1990US4907061 Electronic device
03/06/1990US4907059 Semiconductor bipolar-CMOS inverter
03/06/1990US4907057 Semiconductor device
03/06/1990US4907039 Semiconductor device
03/06/1990US4906872 Integrated circuit device
03/06/1990US4906867 Buffer circuit with load sensitive transition control
03/06/1990US4906823 Solder carrier, manufacturing method thereof and method of mounting semiconductor devices by utilizing same
03/06/1990US4906802 Molded chip carrier
03/06/1990US4906592 Method for forming a multilayered metal network for bonding components of a high-density integrated circuit using a spin on glass layer
03/06/1990US4906514 Metallized substrate for electronic device
03/06/1990US4906511 Aluminum nitride circuit board
03/06/1990US4906494 Antistatic sheet material, package and method of making
03/06/1990US4906404 Copper conductor composition
03/06/1990US4906314 Process for simultaneously applying precut swatches of precured polyimide film to each semiconductor die on a wafer
03/06/1990US4906311 Method of making a hermetically sealed electronic component
03/06/1990CA1266388A1 Multipurpose copper alloys and processing therefor with moderate conductivity and high strength
03/01/1990DE3928765A1 Chemische dampfabscheidung unter verwendung von disilan Chemical vapor deposition using disilane
03/01/1990DE3927033A1 Semiconductor component with electrode(s) on substrate surface - has four-layer electrode assembly with top and bottom electrodes sandwiching amorphous silicon and silicon insulating film
03/01/1990DE3829414A1 Method for marking plastic-coated electronic components
02/1990
02/28/1990EP0356300A1 High-density integrated-circuit carrier, and method of manufacturing same
02/28/1990EP0355965A2 A method of achieving selective inhibition and control of adhesion in thick-film conductors
02/28/1990EP0355955A2 Connection for semiconductor devices or integrated circuits by coated wires and method of manufacturing the same
02/28/1990EP0355841A2 Automatic routing method using prioritized routability indices
02/28/1990EP0355478A1 Improved lift-off process for terminal metals
02/28/1990EP0355366A2 Process for manufacturing silicon boron nitride layers for integrated semiconductor circuits
02/28/1990EP0355359A1 Turn-off semiconductor component
02/28/1990EP0312528B1 Multiple-plate hybrid device
02/27/1990US4905075 Hermetic semiconductor enclosure
02/27/1990US4905074 Interdiffusion resistant Fe-Ni alloys having improved glass sealing property
02/27/1990US4905073 Integrated circuit with improved tub tie
02/27/1990US4905069 Darlington transistor arrangement
02/27/1990US4905068 Semiconductor device having interconnection layers of T-shape cross section
02/27/1990US4904989 Display device
02/27/1990US4904761 Graft copolymer of a epoxy resin and vinyl polymer having dispersed fine particles of silicone rubber
02/27/1990US4904610 Mounting wafer on substrate, cutting grooves, filling with resin, curing
02/27/1990US4904609 Method of making symmetrical blocking high voltage breakdown semiconductor device
02/27/1990US4904499 Die bonding method
02/27/1990US4904414 Electrically conductive adhesive for a broad range of temperatures
02/27/1990US4904036 Subassemblies for optoelectronic hybrid integrated circuits
02/27/1990US4903889 Connection to a component for use in an electronics assembly
02/27/1990CA1266332A1 Heat sink
02/22/1990WO1990001811A1 Functional component of linear design
02/22/1990WO1990001810A1 Functional component of linear design
02/22/1990WO1990001797A1 Method of manufacturing hermetically sealed compression bonded circuit assemblies
02/22/1990WO1990001782A1 Low inductance decoupling capacitor
02/22/1990DE3826764A1 Zeilenartig aufgebaute funktionsbaueinheit Funktionsbaueinheit line-like structured
02/21/1990EP0355060A2 Hermetically sealed housing
02/20/1990US4903120 Chip carrier with interconnects on lid
02/20/1990US4903119 Semi-conductor device
02/20/1990US4903117 Semiconductor device
02/20/1990US4903116 Integrated semiconductor circuit having a multilayer wiring
02/20/1990US4903115 Method of manufacturing conductive electrodes for a circuit element, and semiconductor device thus obtained
02/20/1990US4903114 Resin-molded semiconductor
02/20/1990US4903113 Enhanced tab package
02/20/1990US4903112 Semiconductor component with contact hole
02/20/1990US4903111 Integrated circuit device
02/20/1990US4903096 Semiconductor memory device with barrier layer
02/20/1990US4903089 Vertical transistor device fabricated with semiconductor regrowth
02/20/1990US4902990 Thick film microwave coupler
02/20/1990US4902854 Hermetic direct bond circuit assembly
02/20/1990US4902637 Method for producing a three-dimensional type semiconductor device
02/20/1990US4902635 Method for production of compound semicondutor devices
02/20/1990US4902606 Compressive pedestal for microminiature connections
02/20/1990CA1266132A1 Mesfet transistor with air layer between gate electrode connections and substrate
02/15/1990DE3926238A1 Halbleiter-bauelement Semiconductor component
02/15/1990DE3827614A1 Method for producing a semiconductor component
02/15/1990DE3826396A1 Zeilenartig aufgebaute funktionsbaueinheit Funktionsbaueinheit line-like structured
02/15/1990DE3825981A1 Isothermalised heat sink
02/14/1990EP0354800A2 Processes for producing semiconductor devices
02/14/1990EP0354722A2 Heat transfer system especially for cooling semiconductor devices
02/14/1990EP0354717A2 Semi-conductor device and method of manufacturing such a device
02/14/1990EP0354708A2 General three dimensional packaging
02/14/1990EP0354696A2 Semiconductor device assembly comprising a lead frame structure
02/14/1990EP0354512A2 Semiconductor integrated circuit
02/14/1990EP0354454A2 Press-contact flat type semiconductor device
02/14/1990EP0354371A2 Semiconductor integrated circuit for a radio
02/14/1990EP0354341A1 A composite structure for use in electronic packages
02/14/1990CN2052959U Silicon rectifier for automobile ac generator
02/14/1990CN1006834B Integral heat pipe module
02/13/1990US4901203 Hybrid integrated circuit module assembly
02/13/1990US4901201 Plate fin/chic heat exchanger
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