Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1990
04/04/1990EP0361572A1 Method for producing conducting layers on semiconductor substrates
04/04/1990EP0361495A2 Semiconductor package and computer using the package
04/04/1990EP0361461A2 Process for producing metal-polyimide composite article
04/04/1990EP0361316A2 Power semiconducter diode
04/04/1990EP0361283A2 Resin-sealed type semiconductor device and method for manufacturing the same
04/04/1990EP0361194A2 Method of enveloping electrical or electronic components or component assemblies, and envelope for electrical or electronic components or component assemblies
04/04/1990EP0361109A1 Resin composition
04/04/1990EP0360992A2 A method of making a dielectric layer
04/04/1990EP0360991A2 An integrated circuit self-protected against reversal of the supply battery polarity
04/04/1990CN1041067A Formed top contact for non-flat semiconductor devices
04/04/1990CN1041066A Semiconductor component with turn-off facility
04/04/1990CN1041065A Self-centering electrode for power devices
04/03/1990US4914741 Tape automated bonding semiconductor package
04/03/1990US4914551 Electronic package with heat spreader member
04/03/1990US4914504 Opto-electronic image sensor arrangement
04/03/1990US4914503 Semiconductor device
04/03/1990US4914502 Laterally marching interconnecting lines in semiconductor intergrated circuits
04/03/1990US4914501 Vertical contact structure
04/03/1990US4914185 For encapsulating electronic components
04/03/1990US4914057 Contacting method and structure for integrated circuit pads
04/03/1990US4914056 Etching refractory
04/03/1990US4914055 Semiconductor antifuse structure and method
04/03/1990US4914054 Vapor depositing gold alloy layer on back substrate, a silver layer on the gold, polishing
04/03/1990US4914050 Semiconductor device and manufacturing method thereof
04/03/1990US4914045 Method of fabricating packaged TRIAC and trigger switch
04/03/1990CA2000087A1 Article of manufacture
03/1990
03/29/1990DE3843529C1 Liquid cooling device
03/28/1990EP0360647A1 Coding device especially for printed circuit boards
03/28/1990EP0360587A2 Silver glass pastes
03/28/1990EP0360541A1 Dynamic random access memory device
03/28/1990EP0360507A2 Semiconductor integrated circuit device having an improved arrangement of power source lines
03/28/1990EP0360485A2 Pin grid array (PGA) integrated circuit packages
03/28/1990EP0360477A2 Integrated circuit power supply contact
03/28/1990EP0360461A2 Resin compositions for sealing semiconductors
03/28/1990EP0359928A2 Integrated circuit package with cooling means
03/27/1990US4912603 High density printed wiring board
03/27/1990US4912601 Multiple-plate hybrid device
03/27/1990US4912548 Use of a heat pipe integrated with the IC package for improving thermal performance
03/27/1990US4912547 Tape bonded semiconductor device
03/27/1990US4912546 Lead frame and method of fabricating a semiconductor device
03/27/1990US4912545 Bonding of aligned conductive bumps on adjacent surfaces
03/27/1990US4912544 Corrosion-resistant aluminum electronic material
03/27/1990US4912543 Integrated semiconductor circuit having an external contacting track level consisting of aluminum or of an aluminum alloy
03/27/1990US4912542 Semiconductor device and method of manufacturing the same
03/27/1990US4912284 Electrical circuits
03/27/1990US4912066 Make-link programming of semiconductor devices using laser-enhanced thermal breakdown of insulator
03/22/1990WO1990003046A1 Integrated circuit employing dummy conductors for planarity
03/22/1990WO1990003045A1 Method of forming holes in ceramic ic packages
03/22/1990WO1990002712A1 Glass/ceramic sealing system
03/22/1990DE3930655A1 Semiconductor module with laminated coupling layer - has coupling section, extending over insulating film on semiconductor substrate main surface
03/21/1990EP0359632A1 Integrated circuits encapsulation process, especially for chip cards
03/21/1990EP0359558A2 Semiconductor device encapsulant consisting of epoxy resin composition
03/21/1990EP0359518A2 Improvements in aluminium nitride substrates
03/21/1990EP0359513A2 Semiconductor chip carrier and method of making it
03/21/1990EP0359500A2 Resin compositions for sealing semiconductors
03/21/1990EP0359413A2 Hybrid circuits
03/21/1990EP0359328A1 Device having an electronic circuit mounted on a flexible carrier, protected against electrostatic discharges, and flexible card comprising this device
03/21/1990EP0359228A2 Gold/tin eutectic bonding for tape automated process
03/21/1990EP0358879A2 Method of making high density interconnects
03/21/1990EP0233884B1 Device for surface mounting of components
03/20/1990US4910707 EEPROM with protective circuit
03/20/1990US4910680 Wiring method for semiconductor integrated circuit
03/20/1990US4910642 Coolant activated contact compact high intensity cooler
03/20/1990US4910584 Semiconductor device
03/20/1990US4910583 Semiconductor body with heat sink
03/20/1990US4910582 Semiconductor device and method of manufacturing thereof
03/20/1990US4910581 Internally molded isolated package
03/20/1990US4910580 Method for manufacturing a low-impedance, planar metallization composed of aluminum or of an aluminum alloy
03/20/1990US4910578 Semiconductor device having a metal electrode interconnection film with two layers of silicide
03/20/1990US4910577 Lead frame
03/20/1990US4910574 Porous circuit macro for semiconductor integrated circuits
03/20/1990US4910455 Non-intrusive current measuring circuit
03/20/1990US4910418 Semiconductor fuse programmable array structure
03/20/1990US4910169 Forming copper metallization film; patterning; depositing dielectric
03/20/1990US4910094 Heating, diffusion, exposure
03/20/1990US4909315 Fluid heat exchanger for an electronic component
03/20/1990US4909307 Regenerative bed heat exchanger
03/20/1990US4908937 Method to install an electronic component and its electrical connections on a support, and product obtained thereby
03/20/1990US4908935 Method for fabricating electronic devices
03/20/1990US4908933 Method of manufacturing a substrate for mounting electronic components
03/20/1990CA1266805A1 Semiconductor fabrication
03/15/1990DE3830299A1 Method and arrangement for determining internal thermal resistances of wafer-shaped semiconductor components
03/15/1990DE3829767A1 Novel polypyrrylenemethines
03/14/1990EP0358077A2 Semiconductor device and method of forming it
03/14/1990EP0357802A1 Methods of manufacture of a resin-sealed semiconductor device
03/14/1990EP0357769A1 Vernier structure for flip chip bonded devices
03/14/1990EP0357759A1 Alignment of leads for ceramic integrated circuit packages
03/14/1990EP0357747A1 Method and apparatus for packaging and cooling integrated circuit chips
03/14/1990EP0357606A1 Low stress heat sinking for semiconductors
03/14/1990CN1040461A Electric device and mfg. method of same by use of plasma processing
03/14/1990CN1040395A Siliconized fernico
03/13/1990US4908736 Self packaging chip mount
03/13/1990US4908696 Connector and semiconductor device packages employing the same
03/13/1990US4908695 Cooling apparatus and semiconductor device employing the same
03/13/1990US4908694 Semiconductor device
03/13/1990US4908692 Fuse-containing semiconductor device
03/13/1990US4908690 Semiconductor integrated circuit device with high reliability wiring layers
03/13/1990US4908399 Curable epoxy resin, metal ion scavenger comprising calixarene derivatives, silacrowns, polyalkylene ether derivatives
03/13/1990US4908348 Barrier layer arrangement for conductive layers on silicon substrates
03/13/1990US4908275 Film carrier and method of manufacturing same
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